World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
36
Citations
4347
World Ranking
5412
National Ranking
1864

Materials Science

D-Index
45
Citations
5411
World Ranking
11884
National Ranking
2752

Overview

Minh Van Ngo is affiliated with Advanced Micro Devices in the United States, focusing primarily on engineering research. Their work encompasses several specialized subfields within engineering, including electrical and electronic engineering, aerospace engineering, and control and systems engineering.

Their research contributions are notably centered around topics related to wind energy and control systems. Key themes in their work include:

  • Wind Turbine Control Systems
  • Wind Energy Research and Development
  • Real-time Simulation and Control Systems

Minh Van Ngo has collaborated frequently with Bao The Nguyen and Huy Gia Ngo, among others, indicating a pattern of cooperative research engagements within their area of expertise.

Best Publications

  • Methods for improving carrier mobility of PMOS and NMOS devices

    William George En;Angela Hui;Minh Van Ngo

  • Preparation of composite high-K / standard-K dielectrics for semiconductor devices

    Arvind Halliyal;Joong S. Jeon;Minh Van Ngo;Robert B. Ogle

  • Process for fabricating semiconductor memory device with high data retention including silicon nitride etch stop layer formed at high temperature with low hydrogen ion concentration

    Minh Van Ngo;Sunil Mehta

  • Mosfets incorporating nickel germanosilicided gate and methods of their formation

    Eric N. Paton;Qi Xiang;Paul R. Besser;Ming-Ren Lin

  • Method of forming copper sulfide for memory cell

    Minh Van Ngo;Sergey D. Lopatin;Suzette K. Pangrle;Nicholas H. Tripsas

  • Process for reducing copper oxide during integrated circuit fabrication

    Minh Van Ngo;Guarionex Morales;Takeshi Nogami

  • Use of sic for preventing copper contamination of dielectric layer

    Lu You;Fei Wang;Minh Van Ngo

  • Spin on polymers for organic memory devices

    Jane V. Oglesby;Christopher F. Lyons;Ramkumar Subramanian;Angela T. Hui

  • Method of forming reliable capped copper interconnects

    Minh Van Ngo;Shekhar Pramanick;Takeshi Nogami

  • Integrated plasma etch of gate and gate dielectric and low power plasma post gate etch removal of high-K residual

    Chih-Yuh Yang;Minh Van Ngo

  • Engineered metal gate electrode

    James N. Pan;Paul R. Besser;Christy Woo;Minh Van Ngo

  • Method of forming low resistance vias

    Minh Van Ngo;Robert A Huertas;Drawn Hopper

  • Protection of low-k ILD during damascene processing with thin liner

    Minh Van Ngo;Christy Mei-Chu Woo;Steven C. Avanzino;John E. Sanchez

  • Tensile strained substrate

    Minh V. Ngo;Paul R. Besser;Ming Ren Lin;HaiHong Wang

  • Copper interconnect with improved electromigration resistance

    Minh Van Ngo;Shekhar Pramanick;Takeshi Nogami

  • Method of reducing incidence of stress-induced voiding in semiconductor interconnect lines

    Suzette K. Pangrle;Paul R. Besser;Minh Van Ngo

  • Process for forming fully silicided gates

    Qi Xiang;Ercan Adem;Jacques J. Bertrand;Paul R. Besser

  • Gate array with multiple dielectric properties and method for forming same

    William G. En;Arvind Halliyal;Minh-Ren Lin;Minh Van Ngo

  • Nitrogen-plasma treatment for reduced nickel silicide bridging

    Minh Van Ngo;Christy Mei-Chu Woo;Paul R. Besser;Robert A. Huertas

  • Laser thermal annealing of silicon nitride for increased density and etch selectivity

    Minh Van Ngo;Angela Hui

Frequent Co-Authors

Sergey D. Lopatin
Sergey D. Lopatin Applied Materials (United States)
Qi Xiang
Qi Xiang Xilinx (United States)
Mark I. Gardner
Mark I. Gardner Micron Technology
Zoran Krivokapic
Zoran Krivokapic GlobalFoundries (United States)
Bin Yu
Bin Yu Southeast University

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