D-Index & Metrics Best Publications

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Materials Science D-index 41 Citations 8,721 139 World Ranking 9673 National Ranking 2483

Overview

What is he best known for?

The fields of study he is best known for:

  • Mechanical engineering
  • Electrical engineering
  • Semiconductor

Mei Chang mainly investigates Substrate, Optoelectronics, Layer, Chemical vapor deposition and Composite material. His Substrate research integrates issues from Electrical engineering and Analytical chemistry. His research integrates issues of Inorganic chemistry and Deposition process in his study of Layer.

His research in Inorganic chemistry intersects with topics in Nitrogen trifluoride, Chemical engineering, Nitride and Deposition. His work carried out in the field of Chemical vapor deposition brings together such families of science as Choke, Wafer, Structural engineering and Pedestal. His research investigates the link between Composite material and topics such as Electronic engineering that cross with problems in Inner diameter, Copper interconnect and Tin.

His most cited work include:

  • Chemical vapor deposition chamber (500 citations)
  • Gas delivery apparatus for atomic layer deposition (431 citations)
  • Thermally floating pedestal collar in a chemical vapor deposition chamber (328 citations)

What are the main themes of his work throughout his whole career to date?

His scientific interests lie mostly in Optoelectronics, Wafer, Substrate, Layer and Chemical engineering. His study in Optoelectronics is interdisciplinary in nature, drawing from both Electronic engineering, Plasma etching and Electrical engineering. The Wafer study combines topics in areas such as Chemical vapor deposition, Deposition, Pedestal, Semiconductor and Susceptor.

The Substrate study which covers Analytical chemistry that intersects with Purge and Plasma-enhanced chemical vapor deposition. His Layer research incorporates themes from Inorganic chemistry and Metallurgy, Tungsten. His Chemical engineering research includes themes of Silicon, Cobalt, Metal, Dielectric and Substrate.

He most often published in these fields:

  • Optoelectronics (25.25%)
  • Wafer (24.26%)
  • Substrate (23.76%)

What were the highlights of his more recent work (between 2013-2021)?

  • Substrate (23.76%)
  • Chemical engineering (21.78%)
  • Composite material (18.32%)

In recent papers he was focusing on the following fields of study:

Mei Chang mainly focuses on Substrate, Chemical engineering, Composite material, Metal and Substrate. His work in Substrate addresses issues such as Atomic layer deposition, which are connected to fields such as Deposition rate. His Chemical engineering research is multidisciplinary, incorporating perspectives in Cobalt, Chemical vapor deposition and Deposition.

The various areas that Mei Chang examines in his Metal study include Layer, Optoelectronics and Deposition. His research on Layer often connects related topics like Tungsten. The concepts of his Substrate study are interwoven with issues in Titanium and Argon.

Between 2013 and 2021, his most popular works were:

  • Alcohol Assisted ALD Film Deposition (98 citations)
  • Multi-threshold voltage (Vt) workfunction metal by selective atomic layer deposition (ALD) (74 citations)
  • Methods for pre-cleaning conductive interconnect structures (60 citations)

In his most recent research, the most cited papers focused on:

  • Mechanical engineering
  • Electrical engineering
  • Semiconductor

His primary areas of investigation include Substrate, Metal, Inorganic chemistry, Atomic layer deposition and Layer. His Substrate research is classified as research in Composite material. His work deals with themes such as Substrate and Low temperature deposition, which intersect with Metal.

His Inorganic chemistry research integrates issues from Oxide, Deposition, Dielectric surface and Reactive gas. His Atomic layer deposition study integrates concerns from other disciplines, such as Blocking layer, Optoelectronics, Work function and Threshold voltage. As a part of the same scientific study, Mei Chang usually deals with the Layer, concentrating on Tungsten and frequently concerns with Inert gas, Etching and Analytical chemistry.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Chemical vapor deposition chamber

Ashok Sinha;Mei Chang;Ilya Perlov;Karl Littau.
(1994)

787 Citations

Gas delivery apparatus for atomic layer deposition

Ling Chen;Vincent Ku;Dien-Yeh Wu;Hua Chung.
(2002)

687 Citations

Thermally floating pedestal collar in a chemical vapor deposition chamber

윤 쟈오;아쇼크 신하;아비 테프만;메이 챵.
(1996)

508 Citations

Inlet manifold and methods for increasing gas dissociation and for pecvd of dielectric films

Mei Chang;David N. K. Wang;John M. White;Dan Maydan.
(1988)

479 Citations

Copper interconnect barrier layer structure and formation method

Ling Chen;Seshadri Ganguli;Christophe Marcadal;Wei Cao.
(2001)

466 Citations

Apparatus and method for hybrid chemical processing

빈센트 쿠;메이 창;디엔-예 유.
(2003)

396 Citations

Integration of ALD tantalum nitride for copper metallization

Hua Chung;Nirmalya Maity;Jick Yu;Roderick Craig Mosely.
(2004)

326 Citations

An in-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber

Chien-Teh Kao;Jing-Pei Chou;Salvador P. Umotoy;Mei Chang.
(2005)

315 Citations

In-situ dry clean chamber for front end of line fabrication

Chien-Teh Kao;Jing-Pei Connie Chou;Chiukin (Steven) Lai;Salvador P. Umotoy.
(2005)

304 Citations

Methods of thin film process

Nitin K. Ingle;Jing Tang;Yi Zheng;Zheng Yuan.
(2007)

292 Citations

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