World's Best Scientists 2026 revealed!
Yosi Shacham-Diamand

Yosi Shacham-Diamand

D-Index & Metrics

Materials Science

D-Index
47
Citations
9452
World Ranking
11058
National Ranking
52

Engineering and Technology

D-Index
44
Citations
8777
World Ranking
5748
National Ranking
38

Overview

Yosi Shacham-Diamand is affiliated with Tel Aviv University in Israel and has an extensive body of research primarily in the fields of Engineering and Materials Science. Their work spans multiple subfields including Biomedical Engineering, Electrical and Electronic Engineering, Plant Science, Materials Chemistry, and Molecular Biology.

Their research topics cover a range of specialized areas such as Smart Agriculture and AI, Electrochemical Analysis and Applications, Supramolecular Self-Assembly in Materials, Microfluidic and Bio-sensing Technologies, Electrochemical Sensors and Biosensors, Advanced Chemical Sensor Technologies, and Analytical Chemistry and Sensors.

Frequent publication venues for their research include ECS Meeting Abstracts, Microelectronic Engineering, Sensors, Advanced Healthcare Materials, and Biosensors and Bioelectronics.

Their recent papers demonstrate a focus on sensor technologies, materials chemistry, and sustainable agriculture approaches. Notable recent publications are:

  • "Smart Farming Revolution: Portable and Real-Time Soil Nitrogen and Phosphorus Monitoring for Sustainable Agriculture" (2023) published in Sensors
  • "Phase Transition and Crystallization Kinetics of a Supramolecular System in a Microfluidic Platform" (2020) published in Chemistry of Materials
  • "Conductive Peptide-Based MXene Hydrogel as a Piezoresistive Sensor" (2024) published in Advanced Healthcare Materials
  • "Electrical Impedance Spectroscopy of plant cells in aqueous biological buffer solutions and their modelling using a unified electrical equivalent circuit over a wide frequency range: 4Hz to 20 GHz" (2020) published in Biosensors and Bioelectronics
  • "Gold, Silver, and Electrum Electroless Plating on Additively Manufactured Laser Powder-Bed Fusion AlSi10Mg Parts: A Review" (2021) published in Coatings

Yosi Shacham-Diamand frequently collaborates with several coauthors, including:

  • Aakash Jog
  • Dana Cohen-Gerassi
  • Kian Kadan-Jamal
  • Adi Avni
  • Tali Dotan

Best Publications

  • Engineered hybrid cardiac patches with multifunctional electronics for online monitoring and regulation of tissue function

    Ron Feiner;Leeya Engel;Sharon Fleischer;Maayan Malki

  • Electroless deposition of metal films with spray processor

    Valery Dubin;Vinh Nguyen;Yosi Shacham-Diamand

  • Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration

    Valery M. Dubin;Yosi Shacham‐Diamand;Bin Zhao;P. K. Vasudev

  • Electroless copper deposition for ULSI

    Yosi Shacham-Diamand;Valery Dubin;Matthew Angyal

  • Copper transport in thermal SiO2

    Y. Shacham‐Diamand;A. Dedhia;D. Hoffstetter;W. G. Oldham

  • Electroless deposition equipment or apparatus and method of performing electroless deposition

    Yosi Shacham-Diamand;Valery M. Dubin;Chiu H. Ting;Bin Zhao

  • Characterization of channel hot electron injection by the subthreshold slope of NROM/sup TM/ device

    E. Lusky;Y. Shacham-Diamand;I. Bloom;B. Eitan

  • A random access photodiode array for intelligent image capture

    O. Yadid-Pecht;R. Ginosar;Y. Shacham-Diamand

  • High aspect ratio quarter-micron electroless copper integrated technology

    Y. Shacham-Diamand;S.Y. Lopatin

  • 30years of electroless plating for semiconductor and polymer micro-systems

    Y. Shacham-Diamand;T. Osaka;Y. Okinaka;A. Sugiyama

  • Copper electroless deposition technology for ultra-large-scale-integration (ULSI) metallization

    Yosi Shacham-Diamand;Valery M. Dubin

  • Integrated electroless metallization for ULSI

    Yosi Shacham-Diamand;Sergey Lopatin

  • Characterization of electroless deposited Co(W,P) thin films for encapsulation of copper metallization

    A. Kohn;M. Eizenberg;Y. Shacham-Diamand;Y. Sverdlov

  • Electrons retention model for localized charge in oxide-nitride-oxide (ONO) dielectric

    E. Lusky;Y. Shacham-Diamand;I. Bloom;B. Eitan

  • Copper deposition and thermal stability issues in copper-based metallization for ULSI technology

    Jian Li;Y. Shacham-Diamand;J.W. Mayer

  • Electrochemically deposited thin film alloys for ULSI and MEMS applications

    Y. Shacham-Diamand;Y. Sverdlov

  • Thin electroless barrier for copper films

    Sergey D. Lopatin;Yosi Y. Shacham-Diamand;Valery M. Dubin;Yoon So Kim

  • STM/AFM studies of the evolution of morphology of electroplated Ni/W alloys

    L Zhu;O Younes;N Ashkenasy;Y Shacham-Diamand

  • Electroless Silver and Silver with Tungsten Thin Films for Microelectronics and Microelectromechanical System Applications

    Yosi Shacham‐Diamand;Alexandra Inberg;Yelena Sverdlov;Nathan Croitoru

  • Electroless Copper Deposition Using Glyoxylic Acid as Reducing Agent for Ultralarge Scale Integration Metallization

    Yosi Y. Shacham‐Diamand

Frequent Co-Authors

Shimshon Belkin
Shimshon Belkin Hebrew University of Jerusalem
Eliezer Gileadi
Eliezer Gileadi Tel Aviv University
Tetsuya Osaka
Tetsuya Osaka Waseda University
Amir Boag
Amir Boag Tel Aviv University
Pavel Ginzburg
Pavel Ginzburg Tel Aviv University
Friedrich Schäffler
Friedrich Schäffler Johannes Kepler University of Linz
Eliora Z. Ron
Eliora Z. Ron Tel Aviv University
Emmanuel P. Giannelis
Emmanuel P. Giannelis Cornell University
Peter Lievens
Peter Lievens KU Leuven
Yishay Feldman
Yishay Feldman Weizmann Institute of Science

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