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Materials Science
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2026

D-Index & Metrics

Best Scientists

D-Index
167
Citations
108523
World Ranking
977
National Ranking
579

Mechanical and Aerospace Engineering

D-Index
172
Citations
113658
World Ranking
1
National Ranking
1

Materials Science

D-Index
166
Citations
107599
World Ranking
94
National Ranking
41

Yonggang Huang publication distribution in Mechanical and Aerospace Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where Yonggang Huang sits on this spectrum.

47–56 publications: 10 scientists 57–66 publications: 23 scientists 67–76 publications: 32 scientists 77–86 publications: 62 scientists 87–96 publications: 67 scientists 97–106 publications: 91 scientists 107–116 publications: 113 scientists 117–126 publications: 115 scientists 127–136 publications: 130 scientists 137–146 publications: 140 scientists 147–156 publications: 155 scientists 157–166 publications: 132 scientists 167–176 publications: 133 scientists 177–186 publications: 130 scientists 187–196 publications: 140 scientists 197–206 publications: 115 scientists 207–216 publications: 125 scientists 217–226 publications: 117 scientists 227–236 publications: 99 scientists 237–246 publications: 92 scientists 247–256 publications: 100 scientists 257–266 publications: 95 scientists 267–276 publications: 88 scientists 277–286 publications: 77 scientists 287–296 publications: 74 scientists 297–306 publications: 74 scientists 307–316 publications: 62 scientists 317–326 publications: 70 scientists 327–336 publications: 59 scientists 337–346 publications: 58 scientists 347–356 publications: 45 scientists 357–366 publications: 44 scientists 367–376 publications: 36 scientists 377–386 publications: 41 scientists 387–396 publications: 32 scientists 397–406 publications: 23 scientists 407–416 publications: 28 scientists 417–426 publications: 27 scientists 427–436 publications: 25 scientists 437–446 publications: 23 scientists 447–456 publications: 23 scientists 457–466 publications: 20 scientists 467–476 publications: 12 scientists 477–486 publications: 24 scientists 487–496 publications: 18 scientists 497–506 publications: 12 scientists 507–516 publications: 13 scientists 517–526 publications: 21 scientists 527–536 publications: 12 scientists 537–546 publications: 8 scientists 547–556 publications: 16 scientists 557–566 publications: 3 scientists 567–576 publications: 11 scientists 577–586 publications: 6 scientists 587–596 publications: 5 scientists 597–606 publications: 6 scientists 607–616 publications: 7 scientists 617–626 publications: 7 scientists 627–636 publications: 10 scientists 637–646 publications: 4 scientists 647–656 publications: 3 scientists 657–658 publications: 2 scientists 659+ publications: 100 scientists
47 publications 659+

This scientist: 816 publications — 99th percentile

99% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 659 publications or more.

Yonggang Huang D-index placement in Mechanical and Aerospace Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Yonggang Huang sits on this spectrum.

30 D-Index: 83 scientists 31 D-Index: 113 scientists 32 D-Index: 144 scientists 33 D-Index: 153 scientists 34 D-Index: 189 scientists 35 D-Index: 158 scientists 36 D-Index: 139 scientists 37 D-Index: 127 scientists 38 D-Index: 130 scientists 39 D-Index: 126 scientists 40 D-Index: 104 scientists 41 D-Index: 100 scientists 42 D-Index: 107 scientists 43 D-Index: 101 scientists 44 D-Index: 103 scientists 45 D-Index: 79 scientists 46 D-Index: 88 scientists 47 D-Index: 70 scientists 48 D-Index: 83 scientists 49 D-Index: 44 scientists 50 D-Index: 64 scientists 51 D-Index: 56 scientists 52 D-Index: 50 scientists 53 D-Index: 48 scientists 54 D-Index: 58 scientists 55 D-Index: 52 scientists 56 D-Index: 48 scientists 57 D-Index: 42 scientists 58 D-Index: 34 scientists 59 D-Index: 42 scientists 60 D-Index: 37 scientists 61 D-Index: 42 scientists 62 D-Index: 44 scientists 63 D-Index: 22 scientists 64 D-Index: 33 scientists 65 D-Index: 29 scientists 66 D-Index: 23 scientists 67 D-Index: 29 scientists 68 D-Index: 24 scientists 69 D-Index: 19 scientists 70 D-Index: 34 scientists 71 D-Index: 26 scientists 72 D-Index: 19 scientists 73 D-Index: 18 scientists 74 D-Index: 19 scientists 75 D-Index: 14 scientists 76 D-Index: 19 scientists 77 D-Index: 8 scientists 78 D-Index: 18 scientists 79 D-Index: 16 scientists 80 D-Index: 12 scientists 81 D-Index: 17 scientists 82 D-Index: 11 scientists 83 D-Index: 16 scientists 84 D-Index: 7 scientists 85 D-Index: 9 scientists 86 D-Index: 8 scientists 87 D-Index: 6 scientists 88 D-Index: 6 scientists 89 D-Index: 7 scientists 90 D-Index: 10 scientists 91 D-Index: 4 scientists 92 D-Index: 4 scientists 93+ D-Index: 100 scientists
30 D-Index 93+

This scientist: 172 D-Index — 100th percentile

100% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 93 D-Index or more.

Research.com Recognitions

  • 2026 - Research.com Materials Science in United States Leader Award
  • 2026 - Research.com Mechanical and Aerospace Engineering in United States Leader Award
  • 2025 - Research.com Best Scientists Award
  • 2025 - Research.com Materials Science in United States Leader Award
  • 2025 - Research.com Mechanical and Aerospace Engineering in United States Leader Award
  • 2022 - Research.com Materials Science in United States Leader Award
  • 2020 - Fellow of the American Academy of Arts and Sciences
  • 2020 - Member of the National Academy of Sciences
  • 2019 - Theodore von Karman Medal
  • 2017 - Member of Academia Europaea
  • 2017 - Member of the National Academy of Engineering For pioneering work on mechanics of stretchable electronics and mechanically guided, deterministic 3-D assembly.
  • 2016 - Nadai Medal, The American Society of Mechanical Engineers (ASME)
  • 2013 - Drucker Medal, American Society of Mechanical Engineers
  • 2013 - Daniel C. Drucker Medal, The American Society of Mechanical Engineers
  • 2010 - Charles Russ Richards Memorial Award, The American Society of Mechanical Engineers
  • 2008 - Fellow of John Simon Guggenheim Memorial Foundation
  • 2003 - ASME Gustus L. Larson Memorial Award
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, Chinese Academy of Sciences
  • Foreign Member, Chinese Academy of Sciences

Overview

Yonggang Huang is affiliated with Northwestern University in the United States. Their research primarily spans the field of Engineering, with a focus on several subfields including Biomedical Engineering, Cellular and Molecular Neuroscience, Mechanical Engineering, Electrical and Electronic Engineering, and Cognitive Neuroscience.

Their scholarly output includes work published in key venues such as Science Advances, Advanced Materials, Proceedings of the National Academy of Sciences, SSRN Electronic Journal, and Nature Communications.

Major topics covered in their research include Advanced Sensor and Energy Harvesting Materials, Neuroscience and Neural Engineering, Advanced Materials and Mechanics, Tactile and Sensory Interactions, Photoreceptor and Optogenetics Research, 3D Printing in Biomedical Research, and Non-Invasive Vital Sign Monitoring.

Among their recent papers are:

  • Skin-interfaced biosensors for advanced wireless physiological monitoring in neonatal and pediatric intensive-care units (2020, Nature Medicine)
  • Fully implantable and bioresorbable cardiac pacemakers without leads or batteries (2021, Nature Biotechnology)
  • Catheter-integrated soft multilayer electronic arrays for multiplexed sensing and actuation during cardiac surgery (2020, Nature Biomedical Engineering)
  • Stretchable, dynamic covalent polymers for soft, long-lived bioresorbable electronic stimulators designed to facilitate neuromuscular regeneration (2020, Nature Communications)
  • Three-dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids (2021, Science Advances)

Frequent collaborators include John A. Rogers, Raudel Avila, Zhaoqian Xie, and Wubin Bai.

Yonggang Huang has received several recognitions such as being a Fellow of the American Academy of Arts and Sciences and a Member of the National Academy of Sciences, both since 2020. They have also been awarded the Theodore von Karman Medal in 2019 and hold membership in the Academia Europaea since 2017. Their contributions to mechanics and stretchable electronics are also acknowledged by membership in the National Academy of Engineering from 2017.

Additional honors include the Nadai Medal from The American Society of Mechanical Engineers (2016), the Drucker Medal and Daniel C. Drucker Medal (both 2013), the Charles Russ Richards Memorial Award (2010), and the ASME Gustus L. Larson Memorial Award (2003). They were also recognized as a Fellow of the John Simon Guggenheim Memorial Foundation in 2008 and hold foreign membership in the Chinese Academy of Sciences.

Best Publications

  • Materials and mechanics for stretchable electronics

    John A. Rogers;Takao Someya;Yonggang Huang

  • Mechanism-based strain gradient plasticity— I. Theory

    H. Gao;Y. Huang;W. D. Nix;J. W. Hutchinson

  • Stretchable and foldable silicon integrated circuits.

    Dae-Hyeong Kim;Jong-Hyun Ahn;Won Mook Choi;Hoon-Sik Kim

  • Dissolvable films of silk fibroin for ultrathin conformal bio-integrated electronics

    Dae Hyeong Kim;Jonathan Viventi;Jason J. Amsden;Jianliang Xiao

  • A hemispherical electronic eye camera based on compressible silicon optoelectronics

    Heung Cho Ko;Mark P. Stoykovich;Jizhou Song;Viktor Malyarchuk

  • Stretchable batteries with self-similar serpentine interconnects and integrated wireless recharging systems.

    Sheng Xu;Yihui Zhang;Yihui Zhang;Jiung Cho;Juhwan Lee

  • A Physically Transient Form of Silicon Electronics

    Suk Won Hwang;Hu Tao;Dae Hyeong Kim;Huanyu Cheng

  • Ultrathin conformal devices for precise and continuous thermal characterization of human skin.

    R. Chad Webb;Andrew P. Bonifas;Alex Behnaz;Yihui Zhang

  • Soft Microfluidic Assemblies of Sensors, Circuits, and Radios for the Skin

    Sheng Xu;Yihui Zhang;Yihui Zhang;Lin Jia;Kyle E. Mathewson

  • High performance piezoelectric devices based on aligned arrays of nanofibers of poly(vinylidenefluoride-co-trifluoroethylene)

    Luana Persano;Canan Dagdeviren;Yewang Su;Yewang Su;Yihui Zhang;Yihui Zhang

  • A soft, wearable microfluidic device for the capture, storage, and colorimetric sensing of sweat

    Ahyeon Koh;Daeshik Kang;Daeshik Kang;Yeguang Xue;Seungmin Lee

  • Injectable, Cellular-Scale Optoelectronics with Applications for Wireless Optogenetics

    Tae Il Kim;Tae Il Kim;Jordan G. McCall;Yei Hwan Jung;Xian Huang

  • Fractal design concepts for stretchable electronics

    Jonathan A. Fan;Woon Hong Yeo;Woon Hong Yeo;Yewang Su;Yewang Su;Yoshiaki Hattori

  • Arrays of sealed silicon nanotubes as anodes for lithium ion batteries.

    Taeseup Song;Jianliang Xia;Jin Hyon Lee;Dong Hyun Lee

  • Conformal piezoelectric energy harvesting and storage from motions of the heart, lung, and diaphragm

    Canan Dagdeviren;Byung Duk Yang;Yewang Su;Yewang Su;Phat L. Tran

  • Controlled buckling of semiconductor nanoribbons for stretchable electronics

    Yugang Sun;Yugang Sun;Won Mook Choi;Hanqing Jiang;Yonggang Y. Huang

  • Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays.

    Sang-Il Park;Yujie Xiong;Rak-Hwan Kim;Paulius Elvikis

  • Conformable amplified lead zirconate titanate sensors with enhanced piezoelectric response for cutaneous pressure monitoring

    Canan Dagdeviren;Yewang Su;Pauline Joe;Raissa Yona

  • Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

    Andrew Carlson;Audrey M. Bowen;Yonggang Huang;Ralph G. Nuzzo

  • Skin-integrated wireless haptic interfaces for virtual and augmented reality.

    Xinge Yu;Zhaoqian Xie;Yang Yu;Yang Yu;Jungyup Lee

  • The Effect of Nanotube Waviness and Agglomeration on the Elastic Property of Carbon Nanotube-Reinforced Composites

    Dong Li Shi;Xi Qiao Feng;Yonggang Y. Huang;Keh Chih Hwang

  • Multifunctional Epidermal Electronics Printed Directly Onto the Skin

    Woon Hong Yeo;Yun Soung Kim;Jongwoo Lee;Abid Ameen

Frequent Co-Authors

John A. Rogers
John A. Rogers Northwestern University
Yihui Zhang
Yihui Zhang Tsinghua University
Yinji Ma
Yinji Ma Tsinghua University
Jizhou Song
Jizhou Song Zhejiang University
Zhaoqian Xie
Zhaoqian Xie Dalian University of Technology
Hanqing Jiang
Hanqing Jiang Westlake University
Yewang Su
Yewang Su University of Chinese Academy of Sciences
Yuhang Li
Yuhang Li Beihang University
Huanyu Cheng
Huanyu Cheng Pennsylvania State University
Kyung In Jang
Kyung In Jang Daegu Gyeongbuk Institute of Science and Technology

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