Anthony K. Stamper

Overview

Best Publications

• Damascene copper wiring optical image sensor

  James W. Adkisson;Jeffrey P. Gambino;Mark D. Jaffe;Robert K. Leidy

  245
  Citations

• Plasma-assisted chemical vapor deposition of dielectric thin films for ULSI semiconductor circuits

  D. R. Cote;S. V. Nguyen;A. K. Stamper;D. S. Armbrust

  187
  Citations

• Double-sided integrated circuit chips

  Kerry Bernstein;Timothy Joseph Dalton;Jeffrey Peter Gambino;Mark David Jaffe

  155
  Citations

• Reduced Cu interface diffusion by CoWP surface coating

  C.-K. Hu;L. Gignac;R. Rosenberg;E. Liniger

  150
  Citations

• Methods for forming a bonded semiconductor substrate including a cooling mechanism

  Jeffrey P. Gambino;Anthony K. Stamper

  147
  Citations

• Planar mems structures, fabrication methods thereof and reducing variation of a silicon layer of planar mems structures

  Dang Dinh;Doan Thai;Dunbar Iii George A;He Zhong-Xiang

  130
  Citations

• Low resistance and inductance backside through vias and methods of fabricating same

  Mete Erturk;Robert A. Groves;Jeffrey Bowman Johnson;Alvin Jose Joseph

  130
  Citations

• Exposed pore sealing post patterning

  Edward C. Cooney;John A. Fitzsimmons;Jeffrey P. Gambino;Stephen E. Luce

  100
  Citations

• Device and methodology for reducing effective diel

  Edelstein Daniel C;Colburn Matthew E;Cooney Edward C;Dalton Timothy J

  93
  Citations

• Cmos imager of eliminating high reflectivity interfaces

  James W Adkisson;Jeffrey P Gambino;Mark D Jaffe;Robert K Leidy

  86
  Citations

• Post-fuse blow corrosion prevention structure for copper fuses

  Timothy H. Daubenspeck;Daniel C. Edelstein;Robert M. Geffken;William T. Motsiff

  82
  Citations

• METHOD OF MANUFACTURING ELECTRONIC STRUCTURE

  Adams Charlotte;Stamper Anthony

  77
  Citations

• Passive components in the back end of integrated circuits

  Anil K. Chinthakindi;Douglas D. Coolbaugh;Ebenezer E. Eshun;Zhong-Xiang He

  75
  Citations

• Through wafer vias and method of making same

  Hanyi Ding;Alvin Jose Joseph;Anthony Kendall Stamper

  70
  Citations

• Through wafer via and method of making same

  Hanyi Ding;Alvin Jose Joseph;Anthony Kendall Stamper

  63
  Citations

• Line edge roughness and spacing effect on low-k TDDB characteristics

  F. Chen;J.R. Lloyd;K. Chanda;R. Achanta

  62
  Citations

• Recessed bond pad

  Anthony K. Stamper;Sally J. Yankee

  61
  Citations

• Low-temperature chemical vapor deposition processes and dielectrics for microelectronic circuit manufacturing at IBM

  D. R. Cote;S. V. Nguyen;W. J. Cote;S. L. Pennington

  60
  Citations

• Damascene etchback for low ε dielectric

  Anthony K. Stamper;Vincent J. McGahay

  52
  Citations

• Characterization of yttria-stabilized zirconium oxide buffer layers for high-temperature superconductor thin films

  J‐W. Lee;T. E. Schlesinger;A. K. Stamper;M. Migliuolo

  51
  Citations

• Metallic capacitor and its formation method

  M Jeffken Robert;Anthony K Stamper;アンソニー・ケイ・スタンパー;ロバート・エム・ジェフケン

  35
  Citations

• Interconnect structures on substrate and its manufacture method

  Fitzsimmons John A;Stamper Anthony K;Dalton Timothy J;Cooney Iii Edward C

  35
  Citations

• SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD AS WELL AS FORMING METHOD OF POLYSILICON FUSE AT THE SMALL PITCH IN SEMICONDUCTOR

  Anthony K Stamper

  33
  Citations

• Method of integration of a MIM capacitor with a lower plate of metal gate material formed on an STI region or a silicide region formed in or on the surface of a doped well with a high K dielectric material

  Anil Kumar Chinthakindi;Douglas Duane Coolbaugh;Keith Edward Downes;Ebenezer E. Eshun

  33
  Citations

• Dual wired integrated circuit chips

  Kerry Bernstein;Timothy Joseph Dalton;Jeffrey Peter Gambino;Mark David Jaffe

  32
  Citations