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D-Index & Metrics

Discipline name D-Index World Ranking Current World Ranking National Ranking Current National Ranking Publications Citations
Electronics and Electrical Engineering 39 4664 4477 1642 1537 108 6935

Edmund J. Sprogis publications per year

The chart shows the history of publications by Edmund J. Sprogis between 1985 and 2018, highlighting the no. of papers published in each year and offering an overview of the publication velocity of this scholar. Edmund J. Sprogis published across 34 years, from 1985 to 2018, averaging 3.5 papers a year. Output peaked at 17 publications in 2008. 4 of the 120 publications appeared in the last two years.

No. of publications
5 10 15
Bar chart. Horizontal axis: year, 1985 to 2018. Vertical axis: number of publications, 0 to 17. Peak 17 publications in 2008. 1985: 1 publication 1986: 1 publication 1987: 0 publications 1988: 2 publications 1989: 0 publications 1990: 1 publication 1991: 1 publication 1992: 0 publications 1993: 0 publications 1994: 0 publications 1995: 2 publications 1996: 1 publication 1997: 0 publications 1998: 0 publications 1999: 2 publications 2000: 4 publications 2001: 2 publications 2002: 2 publications 2003: 4 publications 2004: 1 publication 2005: 9 publications 2006: 11 publications 2007: 15 publications 2008: 17 publications 2009: 12 publications 2010: 9 publications 2011: 5 publications 2012: 4 publications 2013: 4 publications 2014: 2 publications 2015: 0 publications 2016: 4 publications 2017: 3 publications 2018: 1 publication
1985 2018

120 publications in total across all disciplines

View publications per year as a table
Edmund J. Sprogis: publications per year, 1985 to 2018
Year Publications
1985 1
1986 1
1987 0
1988 2
1989 0
1990 1
1991 1
1992 0
1993 0
1994 0
1995 2
1996 1
1997 0
1998 0
1999 2
2000 4
2001 2
2002 2
2003 4
2004 1
2005 9
2006 11
2007 15
2008 17
2009 12
2010 9
2011 5
2012 4
2013 4
2014 2
2015 0
2016 4
2017 3
2018 1
Total 120
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Edmund J. Sprogis publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Edmund J. Sprogis sits on this spectrum.

No. of scientists
100 200 300 400
Bar chart with 53 bars. Horizontal axis: publications, 34–53 to 1,065+. Vertical axis: number of scientists, 0 to 445. Most scientists, 445, have 174–193 publications. The last bar groups every scientist with 1,065 publications or more. The highlighted bar, 94–113 publications, is where this scientist sits. 34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34–53 publications 1,065+

This scientist: 108 publications — 5th percentile

5% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

View publications distribution as a table
Number of Electronics and Electrical Engineering scientists by publication count, Research.com 2026 ranking edition. Based on 6,875 ranked scientists.
Publications Scientists This scientist
34–53 24
54–73 52
74–93 114
94–113 203 108
114–133 269
134–153 355
154–173 403
174–193 445
194–213 430
214–233 431
234–253 399
254–273 366
274–293 335
294–313 300
314–333 276
334–353 250
354–373 214
374–393 187
394–413 152
414–433 169
434–453 147
454–473 111
474–493 117
494–513 103
514–533 99
534–553 92
554–573 75
574–593 58
594–613 69
614–633 50
634–653 62
654–673 54
674–693 44
694–713 37
714–733 28
734–753 26
754–773 26
774–793 19
794–813 23
814–833 20
834–853 16
854–873 20
874–893 11
894–913 11
914–933 16
934–953 13
954–973 10
974–993 11
994–1,013 9
1,014–1,033 9
1,034–1,053 10
1,054–1,064 6
1,065+ 99
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Edmund J. Sprogis D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Edmund J. Sprogis sits on this spectrum.

No. of scientists
50 100 150 200 250
Bar chart with 82 bars. Horizontal axis: D-Index, 30 to 111+. Vertical axis: number of scientists, 0 to 263. Most scientists, 263, have 32 D-Index. The last bar groups every scientist with 111 D-Index or more. The highlighted bar, 39 D-Index, is where this scientist sits. 30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 39 D-Index — 33rd percentile

33% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

View D-Index distribution as a table
Number of Electronics and Electrical Engineering scientists by D-index, Research.com 2026 ranking edition. Based on 6,875 ranked scientists.
D-Index Scientists This scientist
30 178
31 257
32 263
33 262
34 244
35 236
36 211
37 220
38 214
39 214 39
40 205
41 187
42 194
43 201
44 155
45 189
46 148
47 160
48 134
49 130
50 141
51 156
52 108
53 130
54 112
55 97
56 111
57 102
58 108
59 120
60 103
61 93
62 92
63 74
64 77
65 73
66 64
67 69
68 60
69 39
70 57
71 59
72 46
73 49
74 38
75 35
76 32
77 35
78 31
79 22
80 34
81 31
82 34
83 23
84 18
85 30
86 19
87 19
88 20
89 8
90 17
91 7
92 14
93 9
94 15
95 10
96 12
97 10
98 10
99 12
100 16
101 5
102 7
103 7
104 8
105 9
106 13
107 4
108 5
109 10
110 8
111+ 96
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Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Integrated circuit
  • Semiconductor

Edmund J. Sprogis focuses on Optoelectronics, Electronic engineering, Chip, Electrical engineering and Electrical conductor. His studies deal with areas such as Layer and Soldering as well as Optoelectronics. His Electronic engineering research is multidisciplinary, relying on both Die, Wafer and Silicon.

He combines subjects such as Semiconductor structure and Heat spreader, Heat sink with his study of Chip. His work in the fields of Integrated circuit overlaps with other areas such as Component and ChIP-on-chip. His biological study spans a wide range of topics, including Thermal expansion, Silicon chip and Elastic modulus.

His most cited work include:

  • Three-dimensional silicon integration (403 citations)
  • Highly integrated chip-on-chip packaging (367 citations)
  • Silicon chip carrier with conductive through-vias and method for fabricating same (256 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of investigation include Optoelectronics, Electronic engineering, Electrical engineering, Wafer and Chip. The Optoelectronics study combines topics in areas such as Layer, Substrate, Electrical conductor and Soldering. Edmund J. Sprogis works mostly in the field of Electronic engineering, limiting it down to concerns involving Aperture and, occasionally, Ball grid array.

His Wafer backgrinding study in the realm of Wafer connects with subjects such as Process. His Chip research also works with subjects such as

  • Flip chip which intersects with area such as Three-dimensional integrated circuit,
  • Inductor, which have a strong connection to Transistor. His research in Silicon intersects with topics in CMOS and System in package.

He most often published in these fields:

  • Optoelectronics (60.14%)
  • Electronic engineering (30.43%)
  • Electrical engineering (29.71%)

What were the highlights of his more recent work (between 2010-2018)?

  • Optoelectronics (60.14%)
  • Electrical engineering (29.71%)
  • Substrate (23.19%)

In recent papers he was focusing on the following fields of study:

His main research concerns Optoelectronics, Electrical engineering, Substrate, Electrical conductor and CMOS. His Optoelectronics study incorporates themes from Layer and Transistor. Electrical engineering is frequently linked to Interposer in his study.

Edmund J. Sprogis regularly ties together related areas like Electronic engineering in his Substrate studies. His Electronic engineering research integrates issues from Dram and Reliability engineering. His research in Wafer focuses on subjects like Dielectric, which are connected to Flip chip, Insulator and Soldering.

Between 2010 and 2018, his most popular works were:

  • 3D copper TSV integration, testing and reliability (93 citations)
  • Integrated decoupling capacitor employing conductive through-substrate vias (37 citations)
  • Flattened substrate surface for substrate bonding (12 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Integrated circuit
  • Semiconductor

Edmund J. Sprogis mainly investigates Optoelectronics, Substrate, Wafer, Electrical engineering and Electronic engineering. The various areas that Edmund J. Sprogis examines in his Optoelectronics study include Decoupling capacitor, Capacitance, Capacitance probe and Capacitor. Edmund J. Sprogis interconnects Engineering drawing, Lithography, Through-silicon via, Structural engineering and Integrated circuit in the investigation of issues within Substrate.

His Wafer research incorporates elements of Layer, Gallium nitride, Silicon, Chip and Substrate surface. His work on Microelectronics, Inductor, Electromagnetic coil and Voltage regulator as part of general Electrical engineering study is frequently connected to Magnetic flux, therefore bridging the gap between diverse disciplines of science and establishing a new relationship between them. His work carried out in the field of Electronic engineering brings together such families of science as Epitaxy, Stress relaxation, Silicon on insulator, Transistor and Substrate.

Best Publications

  • Three-dimensional silicon integration

    J. U. Knickerbocker;P. S. Andry;B. Dang;R. R. Horton

  • Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

    J. U. Knickerbocker;P. S. Andry;L. P. Buchwalter;A. Deutsch

  • Multi-chip integrated circuit module

    Harm Peter Hofstee;Robert Kevin Montoye;Edmund Juris Sprogis

  • Silicon chip carrier with conductive through-vias and method for fabricating same

    Daniel Charles Edelstein;Paul Stephen Andry;Leena Paivikki Buchwalter;Jon Alfred Casey

  • 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

    J.U. Knickerbocker;C.S. Patel;P.S. Andry;C.K. Tsang

  • Physically highly secure multi-chip assembly

    Vincenzo Condorelli;Claudius Feger;Kevin C. Gotze;Nihad Hadzic

  • Wafer-level 3D integration technology

    S. J. Koester;A. M. Young;R. R. Yu;S. Purushothaman

  • Self-aligned pattern over a reflective layer

    Michael Dean Caterer;Timothy Harrison Daubenspeck;Thomas George Ference;Edmund Juris Sprogis

  • Stacked chip security

    Brent Alan Anderson;Edmund Juris Sprogis

  • Stacked chip process carrier

    George C. Correia;John E. Cronin;Edmund J. Sprogis

  • 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

    K. Sakuma;P. S. Andry;C. K. Tsang;S. L. Wright

  • Conductive through via structure and process for electronic device carriers

    Paul S. Andry;Chirag S. Patel;Edmund J. Sprogis;Cornelia K. Tsang

  • A cmos imager array with recessed dielectric layer

    Jeffrey Peter Gambino;James William Adkisson;Edmund Juris Sprogis;Richard John Rassel

  • Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

    P. S. Andry;C. K. Tsang;B. C. Webb;E. J. Sprogis

  • A CMOS-compatible process for fabricating electrical through-vias in silicon

    P.S. Andry;C. Tsang;E. Sprogis;C. Patel

  • Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

    S.L. Wright;R. Polastre;H. Gan;L.P. Buchwalter

  • Dual chip with heat sink

    Thomas G. Ference;Wayne J. Howell;Edmund J. Sprogis

  • 3D copper TSV integration, testing and reliability

    M. G. Farooq;T. L. Graves-Abe;W. F. Landers;C. Kothandaraman

  • Low resistance and inductance backside through vias and methods of fabricating same

    Mete Erturk;Robert A. Groves;Jeffrey Bowman Johnson;Alvin Jose Joseph

  • Stacked image method

    James W. Adkisson;Jeffrey P. Gambino;Mark D. Jaffe;Robert K. Leidy

Frequent Co-Authors

Cornelia K. Tsang
Cornelia K. Tsang IBM Thomas J. Watson Research Center
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Anthony K. Stamper
Anthony K. Stamper GlobalFoundries (United States)
Paul S. Andry
Paul S. Andry IBM (United States)
Jeffrey P. Gambino
Jeffrey P. Gambino ON Semiconductor (United States)
Steven J. Holmes
Steven J. Holmes IBM (United States)
Terence B. Hook
Terence B. Hook IBM (United States)
Douglas D. Coolbaugh
Douglas D. Coolbaugh University at Albany, State University of New York
David V. Horak
David V. Horak IBM (United States)
Mark C. Hakey
Mark C. Hakey Semivation

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