World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
39
Citations
6935
World Ranking
4664
National Ranking
1642

Edmund J. Sprogis publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Edmund J. Sprogis sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 108 publications — 5th percentile

5% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Edmund J. Sprogis D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Edmund J. Sprogis sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 39 D-Index — 33rd percentile

33% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Integrated circuit
  • Semiconductor

Edmund J. Sprogis focuses on Optoelectronics, Electronic engineering, Chip, Electrical engineering and Electrical conductor. His studies deal with areas such as Layer and Soldering as well as Optoelectronics. His Electronic engineering research is multidisciplinary, relying on both Die, Wafer and Silicon.

He combines subjects such as Semiconductor structure and Heat spreader, Heat sink with his study of Chip. His work in the fields of Integrated circuit overlaps with other areas such as Component and ChIP-on-chip. His biological study spans a wide range of topics, including Thermal expansion, Silicon chip and Elastic modulus.

His most cited work include:

  • Three-dimensional silicon integration (403 citations)
  • Highly integrated chip-on-chip packaging (367 citations)
  • Silicon chip carrier with conductive through-vias and method for fabricating same (256 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of investigation include Optoelectronics, Electronic engineering, Electrical engineering, Wafer and Chip. The Optoelectronics study combines topics in areas such as Layer, Substrate, Electrical conductor and Soldering. Edmund J. Sprogis works mostly in the field of Electronic engineering, limiting it down to concerns involving Aperture and, occasionally, Ball grid array.

His Wafer backgrinding study in the realm of Wafer connects with subjects such as Process. His Chip research also works with subjects such as

  • Flip chip which intersects with area such as Three-dimensional integrated circuit,
  • Inductor, which have a strong connection to Transistor. His research in Silicon intersects with topics in CMOS and System in package.

He most often published in these fields:

  • Optoelectronics (60.14%)
  • Electronic engineering (30.43%)
  • Electrical engineering (29.71%)

What were the highlights of his more recent work (between 2010-2018)?

  • Optoelectronics (60.14%)
  • Electrical engineering (29.71%)
  • Substrate (23.19%)

In recent papers he was focusing on the following fields of study:

His main research concerns Optoelectronics, Electrical engineering, Substrate, Electrical conductor and CMOS. His Optoelectronics study incorporates themes from Layer and Transistor. Electrical engineering is frequently linked to Interposer in his study.

Edmund J. Sprogis regularly ties together related areas like Electronic engineering in his Substrate studies. His Electronic engineering research integrates issues from Dram and Reliability engineering. His research in Wafer focuses on subjects like Dielectric, which are connected to Flip chip, Insulator and Soldering.

Between 2010 and 2018, his most popular works were:

  • 3D copper TSV integration, testing and reliability (93 citations)
  • Integrated decoupling capacitor employing conductive through-substrate vias (37 citations)
  • Flattened substrate surface for substrate bonding (12 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Integrated circuit
  • Semiconductor

Edmund J. Sprogis mainly investigates Optoelectronics, Substrate, Wafer, Electrical engineering and Electronic engineering. The various areas that Edmund J. Sprogis examines in his Optoelectronics study include Decoupling capacitor, Capacitance, Capacitance probe and Capacitor. Edmund J. Sprogis interconnects Engineering drawing, Lithography, Through-silicon via, Structural engineering and Integrated circuit in the investigation of issues within Substrate.

His Wafer research incorporates elements of Layer, Gallium nitride, Silicon, Chip and Substrate surface. His work on Microelectronics, Inductor, Electromagnetic coil and Voltage regulator as part of general Electrical engineering study is frequently connected to Magnetic flux, therefore bridging the gap between diverse disciplines of science and establishing a new relationship between them. His work carried out in the field of Electronic engineering brings together such families of science as Epitaxy, Stress relaxation, Silicon on insulator, Transistor and Substrate.

Best Publications

  • Three-dimensional silicon integration

    J. U. Knickerbocker;P. S. Andry;B. Dang;R. R. Horton

  • Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

    J. U. Knickerbocker;P. S. Andry;L. P. Buchwalter;A. Deutsch

  • Multi-chip integrated circuit module

    Harm Peter Hofstee;Robert Kevin Montoye;Edmund Juris Sprogis

  • Silicon chip carrier with conductive through-vias and method for fabricating same

    Daniel Charles Edelstein;Paul Stephen Andry;Leena Paivikki Buchwalter;Jon Alfred Casey

  • 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

    J.U. Knickerbocker;C.S. Patel;P.S. Andry;C.K. Tsang

  • Physically highly secure multi-chip assembly

    Vincenzo Condorelli;Claudius Feger;Kevin C. Gotze;Nihad Hadzic

  • Wafer-level 3D integration technology

    S. J. Koester;A. M. Young;R. R. Yu;S. Purushothaman

  • Self-aligned pattern over a reflective layer

    Michael Dean Caterer;Timothy Harrison Daubenspeck;Thomas George Ference;Edmund Juris Sprogis

  • Stacked chip security

    Brent Alan Anderson;Edmund Juris Sprogis

  • Stacked chip process carrier

    George C. Correia;John E. Cronin;Edmund J. Sprogis

  • 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

    K. Sakuma;P. S. Andry;C. K. Tsang;S. L. Wright

  • Conductive through via structure and process for electronic device carriers

    Paul S. Andry;Chirag S. Patel;Edmund J. Sprogis;Cornelia K. Tsang

  • A cmos imager array with recessed dielectric layer

    Jeffrey Peter Gambino;James William Adkisson;Edmund Juris Sprogis;Richard John Rassel

  • Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

    P. S. Andry;C. K. Tsang;B. C. Webb;E. J. Sprogis

  • A CMOS-compatible process for fabricating electrical through-vias in silicon

    P.S. Andry;C. Tsang;E. Sprogis;C. Patel

  • Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

    S.L. Wright;R. Polastre;H. Gan;L.P. Buchwalter

  • Dual chip with heat sink

    Thomas G. Ference;Wayne J. Howell;Edmund J. Sprogis

  • 3D copper TSV integration, testing and reliability

    M. G. Farooq;T. L. Graves-Abe;W. F. Landers;C. Kothandaraman

  • Low resistance and inductance backside through vias and methods of fabricating same

    Mete Erturk;Robert A. Groves;Jeffrey Bowman Johnson;Alvin Jose Joseph

  • Stacked image method

    James W. Adkisson;Jeffrey P. Gambino;Mark D. Jaffe;Robert K. Leidy

Frequent Co-Authors

Cornelia K. Tsang
Cornelia K. Tsang IBM Thomas J. Watson Research Center
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Anthony K. Stamper
Anthony K. Stamper GlobalFoundries (United States)
Paul S. Andry
Paul S. Andry IBM (United States)
Jeffrey P. Gambino
Jeffrey P. Gambino ON Semiconductor (United States)
Steven J. Holmes
Steven J. Holmes IBM (United States)
Terence B. Hook
Terence B. Hook IBM (United States)
Douglas D. Coolbaugh
Douglas D. Coolbaugh University at Albany, State University of New York
David V. Horak
David V. Horak IBM (United States)
Mark C. Hakey
Mark C. Hakey Semivation

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