World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
39
Citations
6935
World Ranking
4664
National Ranking
1641

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Integrated circuit
  • Semiconductor

Edmund J. Sprogis focuses on Optoelectronics, Electronic engineering, Chip, Electrical engineering and Electrical conductor. His studies deal with areas such as Layer and Soldering as well as Optoelectronics. His Electronic engineering research is multidisciplinary, relying on both Die, Wafer and Silicon.

He combines subjects such as Semiconductor structure and Heat spreader, Heat sink with his study of Chip. His work in the fields of Integrated circuit overlaps with other areas such as Component and ChIP-on-chip. His biological study spans a wide range of topics, including Thermal expansion, Silicon chip and Elastic modulus.

His most cited work include:

  • Three-dimensional silicon integration (403 citations)
  • Highly integrated chip-on-chip packaging (367 citations)
  • Silicon chip carrier with conductive through-vias and method for fabricating same (256 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of investigation include Optoelectronics, Electronic engineering, Electrical engineering, Wafer and Chip. The Optoelectronics study combines topics in areas such as Layer, Substrate, Electrical conductor and Soldering. Edmund J. Sprogis works mostly in the field of Electronic engineering, limiting it down to concerns involving Aperture and, occasionally, Ball grid array.

His Wafer backgrinding study in the realm of Wafer connects with subjects such as Process. His Chip research also works with subjects such as

  • Flip chip which intersects with area such as Three-dimensional integrated circuit,
  • Inductor, which have a strong connection to Transistor. His research in Silicon intersects with topics in CMOS and System in package.

He most often published in these fields:

  • Optoelectronics (60.14%)
  • Electronic engineering (30.43%)
  • Electrical engineering (29.71%)

What were the highlights of his more recent work (between 2010-2018)?

  • Optoelectronics (60.14%)
  • Electrical engineering (29.71%)
  • Substrate (23.19%)

In recent papers he was focusing on the following fields of study:

His main research concerns Optoelectronics, Electrical engineering, Substrate, Electrical conductor and CMOS. His Optoelectronics study incorporates themes from Layer and Transistor. Electrical engineering is frequently linked to Interposer in his study.

Edmund J. Sprogis regularly ties together related areas like Electronic engineering in his Substrate studies. His Electronic engineering research integrates issues from Dram and Reliability engineering. His research in Wafer focuses on subjects like Dielectric, which are connected to Flip chip, Insulator and Soldering.

Between 2010 and 2018, his most popular works were:

  • 3D copper TSV integration, testing and reliability (93 citations)
  • Integrated decoupling capacitor employing conductive through-substrate vias (37 citations)
  • Flattened substrate surface for substrate bonding (12 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Integrated circuit
  • Semiconductor

Edmund J. Sprogis mainly investigates Optoelectronics, Substrate, Wafer, Electrical engineering and Electronic engineering. The various areas that Edmund J. Sprogis examines in his Optoelectronics study include Decoupling capacitor, Capacitance, Capacitance probe and Capacitor. Edmund J. Sprogis interconnects Engineering drawing, Lithography, Through-silicon via, Structural engineering and Integrated circuit in the investigation of issues within Substrate.

His Wafer research incorporates elements of Layer, Gallium nitride, Silicon, Chip and Substrate surface. His work on Microelectronics, Inductor, Electromagnetic coil and Voltage regulator as part of general Electrical engineering study is frequently connected to Magnetic flux, therefore bridging the gap between diverse disciplines of science and establishing a new relationship between them. His work carried out in the field of Electronic engineering brings together such families of science as Epitaxy, Stress relaxation, Silicon on insulator, Transistor and Substrate.

Best Publications

  • Three-dimensional silicon integration

    J. U. Knickerbocker;P. S. Andry;B. Dang;R. R. Horton

  • Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

    J. U. Knickerbocker;P. S. Andry;L. P. Buchwalter;A. Deutsch

  • Multi-chip integrated circuit module

    Harm Peter Hofstee;Robert Kevin Montoye;Edmund Juris Sprogis

  • Silicon chip carrier with conductive through-vias and method for fabricating same

    Daniel Charles Edelstein;Paul Stephen Andry;Leena Paivikki Buchwalter;Jon Alfred Casey

  • 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

    J.U. Knickerbocker;C.S. Patel;P.S. Andry;C.K. Tsang

  • Physically highly secure multi-chip assembly

    Vincenzo Condorelli;Claudius Feger;Kevin C. Gotze;Nihad Hadzic

  • Wafer-level 3D integration technology

    S. J. Koester;A. M. Young;R. R. Yu;S. Purushothaman

  • Self-aligned pattern over a reflective layer

    Michael Dean Caterer;Timothy Harrison Daubenspeck;Thomas George Ference;Edmund Juris Sprogis

  • Stacked chip security

    Brent Alan Anderson;Edmund Juris Sprogis

  • Stacked chip process carrier

    George C. Correia;John E. Cronin;Edmund J. Sprogis

  • 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

    K. Sakuma;P. S. Andry;C. K. Tsang;S. L. Wright

  • Conductive through via structure and process for electronic device carriers

    Paul S. Andry;Chirag S. Patel;Edmund J. Sprogis;Cornelia K. Tsang

  • A cmos imager array with recessed dielectric layer

    Jeffrey Peter Gambino;James William Adkisson;Edmund Juris Sprogis;Richard John Rassel

  • Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

    P. S. Andry;C. K. Tsang;B. C. Webb;E. J. Sprogis

  • A CMOS-compatible process for fabricating electrical through-vias in silicon

    P.S. Andry;C. Tsang;E. Sprogis;C. Patel

  • Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

    S.L. Wright;R. Polastre;H. Gan;L.P. Buchwalter

  • Dual chip with heat sink

    Thomas G. Ference;Wayne J. Howell;Edmund J. Sprogis

  • 3D copper TSV integration, testing and reliability

    M. G. Farooq;T. L. Graves-Abe;W. F. Landers;C. Kothandaraman

  • Low resistance and inductance backside through vias and methods of fabricating same

    Mete Erturk;Robert A. Groves;Jeffrey Bowman Johnson;Alvin Jose Joseph

  • Stacked image method

    James W. Adkisson;Jeffrey P. Gambino;Mark D. Jaffe;Robert K. Leidy

Frequent Co-Authors

Cornelia K. Tsang
Cornelia K. Tsang IBM Thomas J. Watson Research Center
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Paul S. Andry
Paul S. Andry IBM (United States)
Jeffrey P. Gambino
Jeffrey P. Gambino ON Semiconductor (United States)
Steven J. Holmes
Steven J. Holmes IBM (United States)
Terence B. Hook
Terence B. Hook IBM (United States)
Douglas D. Coolbaugh
Douglas D. Coolbaugh University at Albany, State University of New York
David V. Horak
David V. Horak IBM (United States)
Mark C. Hakey
Mark C. Hakey Semivation
Devendra K. Sadana
Devendra K. Sadana IBM (United States)

If you think any of the details on this page are incorrect, let us know.

Report an issue

We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below:

Related Online Degrees & Career Pathways

Exploring online degrees in Electronics and Electrical Engineering offers flexibility and accessibility for many students. Military spouses, for instance, can benefit greatly from attending online colleges for military spouses, ensuring their education continues regardless of relocations or deployments.

If you're eager to start your studies without delay, many online colleges that start soon offer rolling or weekly enrollment, allowing you to begin your program quickly and maintain momentum in your career development.

For those seeking a quicker credential, short term certificate programs in electrical engineering fundamentals or specialized fields can provide targeted skills and improve job prospects in as little as six months.

Moreover, the field offers diverse roles suited for various personalities, including careers for introverts that involve design, testing, or software development, allowing for meaningful contributions in less socially demanding environments.

Best Scientists Citing Edmund J. Sprogis

Trending Scientists

Recently Published Articles