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Overview

Paul S. Andry is affiliated with IBM in the United States, where they conduct research primarily within the field of Engineering. Their work encompasses subfields such as Electrical and Electronic Engineering and Automotive Engineering.

Their research topics focus mainly on advanced semiconductor and manufacturing technologies. Key areas include:

  • 3D IC and TSV technologies
  • Electronic Packaging and Soldering Technologies
  • Additive Manufacturing and 3D Printing Technologies

Paul S. Andry has contributed to the academic literature with publications in highly specialized venues. They have published in the IEEE Transactions on Components Packaging and Manufacturing Technology, where they authored the paper titled "3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System" in 2021.

Frequent collaborators include:

  • Katsuyuki Sakuma
  • Mukta Farooq
  • C. Cabral
  • Thomas Wassick
  • Dale McHerron

These coauthors reflect the interdisciplinary nature of Paul S. Andry's research activities, intersecting areas of electronics packaging, advanced manufacturing, and system integration.

Best Publications

  • Three-dimensional silicon integration

    J. U. Knickerbocker;P. S. Andry;B. Dang;R. R. Horton

  • Interconnects in the third dimension: design challenges for 3D ICs

    Kerry Bernstein;Paul Andry;Jerome Cann;Phil Emma

  • Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

    J. U. Knickerbocker;P. S. Andry;L. P. Buchwalter;A. Deutsch

  • 3D silicon integration

    J.U. Knickerbocker;P.S. Andry;B. Dang;R.R. Horton

  • Silicon chip carrier with conductive through-vias and method for fabricating same

    Daniel Charles Edelstein;Paul Stephen Andry;Leena Paivikki Buchwalter;Jon Alfred Casey

  • 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

    J.U. Knickerbocker;C.S. Patel;P.S. Andry;C.K. Tsang

  • 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

    K. Sakuma;P. S. Andry;C. K. Tsang;S. L. Wright

  • Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

    Paul S. Andry;John M. Cotte;John U. Knickerbocker;Cornelia K. Tsang

  • Conductive through via structure and process for electronic device carriers

    Paul S. Andry;Chirag S. Patel;Edmund J. Sprogis;Cornelia K. Tsang

  • Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

    P. S. Andry;C. K. Tsang;B. C. Webb;E. J. Sprogis

  • A CMOS-compatible process for fabricating electrical through-vias in silicon

    P.S. Andry;C. Tsang;E. Sprogis;C. Patel

  • Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

    S.L. Wright;R. Polastre;H. Gan;L.P. Buchwalter

  • 3D copper TSV integration, testing and reliability

    M. G. Farooq;T. L. Graves-Abe;W. F. Landers;C. Kothandaraman

  • 2.5D and 3D technology challenges and test vehicle demonstrations

    J. U. Knickerbocker;P. S. Andry;E. Colgan;B. Dang

  • Small area, robust silicon via structure and process

    Paul S. Andry;John M. Cotte;John Ulrich Knickerbocker;Cornelia K. Tsang

  • Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate

    Paul S. Andry;Thomas J. Brunschwiler;Evan G. Colgan;John H. Magerlein

  • Apparatus and methods for cooling semiconductor integrated circuit chip packages

    Paul S. Andry;Evan G. Colgan;Lawrence S. Mok;Chirag S. Patel

  • Through silicon via for use in integrated circuit chips

    Paul Stephen Andry;Edmund Juris Sprogis;Cornelia Kang-I Tsang

  • 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections

    K. Sakuma;P.S. Andry;B. Dang;J. Maria

  • Structure, Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits

    Kuan-Neng Chen;Sang Hwui Lee;P.S. Andry;C.K. Tsang

Frequent Co-Authors

Cornelia K. Tsang
Cornelia K. Tsang IBM Thomas J. Watson Research Center
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Edmund J. Sprogis
Edmund J. Sprogis IBM (United States)
Cyril Cabral
Cyril Cabral IBM (United States)
Xiaoxiong Gu
Xiaoxiong Gu IBM (United States)
Mahesh G. Samant
Mahesh G. Samant IBM (United States)
Yong Liu
Yong Liu New York University
Subramanian S. Iyer
Subramanian S. Iyer University of California, Los Angeles
Jeffrey P. Gambino
Jeffrey P. Gambino ON Semiconductor (United States)
Daniel J. Friedman
Daniel J. Friedman IBM (United States)

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