World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
32
Citations
4543
World Ranking
6290
National Ranking
2075

Overview

Muhannad S. Bakir is affiliated with the Georgia Institute of Technology in the United States. Their research primarily focuses on engineering, with a total of 123 publications in this field. Within engineering, their expertise spans several subfields, including electrical and electronic engineering, mechanical engineering, cellular and molecular neuroscience, biomedical engineering, and cognitive neuroscience.

Their work addresses a range of scientific topics, particularly in areas related to integrated circuits, semiconductor materials, and neuroscience. Key topics covered by their research include:

  • 3D IC and TSV technologies
  • Semiconductor materials and devices
  • Neuroscience and Neural Engineering
  • Advanced Memory and Neural Computing
  • Heat Transfer and Optimization
  • Muscle activation and electromyography studies
  • Ferroelectric and Negative Capacitance Devices

Their publication record features articles in prominent journals and conferences. Frequent publication venues include:

  • IEEE Transactions on Components Packaging and Manufacturing Technology (22 publications)
  • bioRxiv (Cold Spring Harbor Laboratory) (5 publications)
  • IEEE Journal on Exploratory Solid-State Computational Devices and Circuits (3 publications)
  • eLife (2 publications)
  • IEEE Transactions on Electron Devices (2 publications)

Some recent papers illustrating the scope and nature of their research are:

  • "Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management," 2022, IEEE Access
  • "Myomatrix arrays for high-definition muscle recording," 2023, eLife
  • "Heterogeneous 3-D Integration of Multitier Compute-in-Memory Accelerators: An Electrical-Thermal Co-Design," 2021, IEEE Transactions on Electron Devices
  • "Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water," 2020, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "Flexible Multielectrode Arrays With 2-D and 3-D Contacts for In Vivo Electromyography Recording," 2020, IEEE Transactions on Components Packaging and Manufacturing Technology

Collaboration is a significant element of their work, with frequent co-authors including:

  • Ankit Kaul (12 joint publications)
  • Muneeb Zia (10 joint publications)
  • Samuel J. Sober (10 joint publications)
  • Jiaao Lu (8 joint publications)
  • Shimeng Yu (8 joint publications)

Best Publications

  • A 3D-IC Technology with Integrated Microchannel Cooling

    Deepak Sekar;Calvin King;Bing Dang;Todd Spencer

  • Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

    Bing Dang;M.S. Bakir;D.C. Sekar;C.R. King

  • Integrated Interconnect Technologies for 3D Nanoelectronic Systems

    Muhannad S. Bakir;James D. Meindl

  • Power Delivery for 3D Chip Stacks: Physical Modeling and Design Implication

    Gang Huang;M. Bakir;A. Naeemi;H. Chen

  • 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation

    M.S. Bakir;C. King;D. Sekar;H. Thacker

  • Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering

    Daniel Lorenzini;Craig Green;Thomas E. Sarvey;Xuchen Zhang

  • Integrated circuit interconnects with coaxial conductors

    Paul A. Kohl;Ate He;Mark Cupta;Muhannad Bakir

  • Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink

    B. Dang;M.S. Bakir;J.D. Meindl

  • 3D stacking of chips with electrical and microfluidic I/O interconnects

    C.R. King;D. Sekar;M.S. Bakir;B. Dang

  • Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI)

    M.S. Bakir;H.A. Reed;H.D. Thacker;C.S. Patel

  • Sea of leads ultra high-density compliant wafer-level packaging technology

    M.S. Bakir;H.A. Reed;P.A. Kohl;K.P. Martin

  • Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof

    Muhannad S. Bakir;Kevin P. Martin;James D. Meindl

  • Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package

    Tony Mule;Chirag Patel;James D. Meindl;Thomas K. Gaylord

  • Silicon Micropin-Fin Heat Sink With Integrated TSVs for 3-D ICs: Tradeoff Analysis and Experimental Testing

    Yue Zhang;Ashish Dembla;Muhannad S. Bakir

  • Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology

    Yue Zhang;Calvin R. King;Jesal Zaveri;Yoon Jo Kim

  • 3-D ICs equipped with double sided power, coolant, and data features

    Muhannad S. Bakir;Gang Huang

  • Wafer-level microfluidic cooling interconnects for GSI

    Bing Dang;P. Joseph;M. Bakir;T. Spencer

  • Interconnecting device opportunities for gigascale integration (GSI)

    J.D. Meindl;R. Venkatesan;J.A. Davis;J. Joyner

  • 3-D ICs WITH MICROFLUIDIC INTERCONNECTS AND METHODS OF CONSTRUCTING SAME

    Muhannad S. Bakir;Deepak Sekar;Bing Dang;Calvin King

  • Sea of polymer pillars electrical and optical chip I/O interconnections for gigascale integration

    M.S. Bakir;J.D. Meindl

  • A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

    Craig Green;Peter Kottke;Xuefei Han;Casey Woodrum

  • Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections

    M.S. Bakir;T.K. Gaylord;K.P. Martin;J.D. Meindl

  • Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems

    M.S. Bakir;B. Dang;J.D. Meindl

  • Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge

    Yang Zhang;Yue Zhang;Muhannad S. Bakir

  • Through-Silicon Vias: Drivers, Performance, and Innovations

    Paragkumar A. Thadesar;Xiaoxiong Gu;Ramakanth Alapati;Muhannad S. Bakir

Frequent Co-Authors

James D. Meindl
James D. Meindl Georgia Institute of Technology
Paul A. Kohl
Paul A. Kohl Georgia Institute of Technology
Maysam Ghovanloo
Maysam Ghovanloo Silicon Creations Inc.
Elias N. Glytsis
Elias N. Glytsis National Technical University of Athens
Nobumichi Tamura
Nobumichi Tamura Lawrence Berkeley National Laboratory
Hua Wang
Hua Wang Georgia Institute of Technology
Madhavan Swaminathan
Madhavan Swaminathan Pennsylvania State University
Shimeng Yu
Shimeng Yu Georgia Institute of Technology
Oliver Brand
Oliver Brand Georgia Institute of Technology
Er-Ping Li
Er-Ping Li Zhejiang University

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