World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
32
Citations
4543
World Ranking
6289
National Ranking
2076

Muhannad S. Bakir publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Muhannad S. Bakir sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 281 publications — 53rd percentile

53% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Muhannad S. Bakir D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Muhannad S. Bakir sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 32 D-Index — 10th percentile

10% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Muhannad S. Bakir is affiliated with the Georgia Institute of Technology in the United States. Their research primarily focuses on engineering, with a total of 123 publications in this field. Within engineering, their expertise spans several subfields, including electrical and electronic engineering, mechanical engineering, cellular and molecular neuroscience, biomedical engineering, and cognitive neuroscience.

Their work addresses a range of scientific topics, particularly in areas related to integrated circuits, semiconductor materials, and neuroscience. Key topics covered by their research include:

  • 3D IC and TSV technologies
  • Semiconductor materials and devices
  • Neuroscience and Neural Engineering
  • Advanced Memory and Neural Computing
  • Heat Transfer and Optimization
  • Muscle activation and electromyography studies
  • Ferroelectric and Negative Capacitance Devices

Their publication record features articles in prominent journals and conferences. Frequent publication venues include:

  • IEEE Transactions on Components Packaging and Manufacturing Technology (22 publications)
  • bioRxiv (Cold Spring Harbor Laboratory) (5 publications)
  • IEEE Journal on Exploratory Solid-State Computational Devices and Circuits (3 publications)
  • eLife (2 publications)
  • IEEE Transactions on Electron Devices (2 publications)

Some recent papers illustrating the scope and nature of their research are:

  • "Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management," 2022, IEEE Access
  • "Myomatrix arrays for high-definition muscle recording," 2023, eLife
  • "Heterogeneous 3-D Integration of Multitier Compute-in-Memory Accelerators: An Electrical-Thermal Co-Design," 2021, IEEE Transactions on Electron Devices
  • "Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water," 2020, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "Flexible Multielectrode Arrays With 2-D and 3-D Contacts for In Vivo Electromyography Recording," 2020, IEEE Transactions on Components Packaging and Manufacturing Technology

Collaboration is a significant element of their work, with frequent co-authors including:

  • Ankit Kaul (12 joint publications)
  • Muneeb Zia (10 joint publications)
  • Samuel J. Sober (10 joint publications)
  • Jiaao Lu (8 joint publications)
  • Shimeng Yu (8 joint publications)

Best Publications

  • A 3D-IC Technology with Integrated Microchannel Cooling

    Deepak Sekar;Calvin King;Bing Dang;Todd Spencer

  • Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

    Bing Dang;M.S. Bakir;D.C. Sekar;C.R. King

  • Integrated Interconnect Technologies for 3D Nanoelectronic Systems

    Muhannad S. Bakir;James D. Meindl

  • Power Delivery for 3D Chip Stacks: Physical Modeling and Design Implication

    Gang Huang;M. Bakir;A. Naeemi;H. Chen

  • 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation

    M.S. Bakir;C. King;D. Sekar;H. Thacker

  • Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering

    Daniel Lorenzini;Craig Green;Thomas E. Sarvey;Xuchen Zhang

  • Integrated circuit interconnects with coaxial conductors

    Paul A. Kohl;Ate He;Mark Cupta;Muhannad Bakir

  • Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink

    B. Dang;M.S. Bakir;J.D. Meindl

  • 3D stacking of chips with electrical and microfluidic I/O interconnects

    C.R. King;D. Sekar;M.S. Bakir;B. Dang

  • Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI)

    M.S. Bakir;H.A. Reed;H.D. Thacker;C.S. Patel

  • Sea of leads ultra high-density compliant wafer-level packaging technology

    M.S. Bakir;H.A. Reed;P.A. Kohl;K.P. Martin

  • Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof

    Muhannad S. Bakir;Kevin P. Martin;James D. Meindl

  • Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package

    Tony Mule;Chirag Patel;James D. Meindl;Thomas K. Gaylord

  • Silicon Micropin-Fin Heat Sink With Integrated TSVs for 3-D ICs: Tradeoff Analysis and Experimental Testing

    Yue Zhang;Ashish Dembla;Muhannad S. Bakir

  • Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology

    Yue Zhang;Calvin R. King;Jesal Zaveri;Yoon Jo Kim

  • 3-D ICs equipped with double sided power, coolant, and data features

    Muhannad S. Bakir;Gang Huang

  • Wafer-level microfluidic cooling interconnects for GSI

    Bing Dang;P. Joseph;M. Bakir;T. Spencer

  • Interconnecting device opportunities for gigascale integration (GSI)

    J.D. Meindl;R. Venkatesan;J.A. Davis;J. Joyner

  • 3-D ICs WITH MICROFLUIDIC INTERCONNECTS AND METHODS OF CONSTRUCTING SAME

    Muhannad S. Bakir;Deepak Sekar;Bing Dang;Calvin King

  • Sea of polymer pillars electrical and optical chip I/O interconnections for gigascale integration

    M.S. Bakir;J.D. Meindl

  • A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

    Craig Green;Peter Kottke;Xuefei Han;Casey Woodrum

  • Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections

    M.S. Bakir;T.K. Gaylord;K.P. Martin;J.D. Meindl

  • Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems

    M.S. Bakir;B. Dang;J.D. Meindl

  • Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge

    Yang Zhang;Yue Zhang;Muhannad S. Bakir

  • Through-Silicon Vias: Drivers, Performance, and Innovations

    Paragkumar A. Thadesar;Xiaoxiong Gu;Ramakanth Alapati;Muhannad S. Bakir

Frequent Co-Authors

James D. Meindl
James D. Meindl Georgia Institute of Technology
Paul A. Kohl
Paul A. Kohl Georgia Institute of Technology
Yogendra Joshi
Yogendra Joshi Georgia Institute of Technology
Thomas K. Gaylord
Thomas K. Gaylord Georgia Institute of Technology
Andrei G. Fedorov
Andrei G. Fedorov Georgia Institute of Technology
Azad Naeemi
Azad Naeemi Georgia Institute of Technology
Elias N. Glytsis
Elias N. Glytsis National Technical University of Athens
Maysam Ghovanloo
Maysam Ghovanloo Silicon Creations Inc.
Xi Liu
Xi Liu Shanghai Jiao Tong University
Nobumichi Tamura
Nobumichi Tamura Lawrence Berkeley National Laboratory

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Related Online Degrees & Career Pathways

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Additionally, careers in this field can suit a wide range of personalities. Introverts, for instance, might find rewarding roles that emphasize independent work or specialized technical expertise. Exploring introvert jobs within electronics and electrical engineering can reveal ideal pathways that align personal work preferences with professional success.

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