Oliver Brand spends much of his time researching CMOS, Cantilever, Optoelectronics, Surface micromachining and Nanotechnology. Oliver Brand has included themes like Field-effect transistor and Bimorph in his CMOS study. The Cantilever study combines topics in areas such as Epoxy, Substrate, Coercivity and Magnet.
The study incorporates disciplines such as Resonance, Thermopile, Amplifier and Analytical chemistry in addition to Optoelectronics. His studies in Nanotechnology integrate themes in fields like Wetting, Transducer and Chemical sensor. His work investigates the relationship between Transducer and topics such as Gas detector that intersect with problems in Chip.
His main research concerns Optoelectronics, Cantilever, CMOS, Resonator and Nanotechnology. The concepts of his Optoelectronics study are interwoven with issues in Resonance, Electronic engineering and Analytical chemistry. His Cantilever study also includes fields such as
Oliver Brand combines subjects such as Microsystem, Transducer and Chip with his study of CMOS. Oliver Brand usually deals with Resonator and limits it to topics linked to Silicon and Etching, Wafer and Composite material. His Nanotechnology research incorporates elements of Chemical sensor and Electronics.
His primary areas of investigation include Optoelectronics, Nanotechnology, Liquid metal, Capacitive sensing and Soft lithography. The various areas that Oliver Brand examines in his Optoelectronics study include Cantilever, Signal, Electromagnetic coil and Capacitor. His Cantilever research incorporates themes from Concentrator, Compensation, Engineering physics, Resonator and Transient.
His Liquid metal study combines topics from a wide range of disciplines, such as Microsystem and Microfluidics. In his research, Excitation is intimately related to Microelectromechanical systems, which falls under the overarching field of Capacitive sensing. He interconnects Flexible electronics and Microelectronics in the investigation of issues within Electronic component.
Oliver Brand mainly investigates Nanotechnology, Liquid metal, Microsystem, Soft lithography and Microfluidics. His Nanotechnology research is multidisciplinary, incorporating elements of Electronic component and Capacitor. His study in Liquid metal is interdisciplinary in nature, drawing from both Electronic skin, Supercapacitor, Carbon nanotube and Stretchable electronics.
His Microsystem research includes themes of Relative permittivity and Gallium. His Microfluidics study combines topics in areas such as Fluidics, Dynamic range, Optics and Linear acceleration. His studies deal with areas such as Layer, Nano-, Lithography and Line as well as Electronics.
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Smart single-chip gas sensor microsystem.
C. Hagleitner;A. Hierlemann;D. Lange;A. Kummer.
Nature (2001)
Smart single-chip gas sensor microsystem.
C. Hagleitner;A. Hierlemann;D. Lange;A. Kummer.
Nature (2001)
Complementary metal oxide semiconductor cantilever arrays on a single chip: mass-sensitive detection of volatile organic compounds.
Dirk Lange;Christoph Hagleitner;Andreas Hierlemann;Oliver Brand.
Analytical Chemistry (2002)
Complementary metal oxide semiconductor cantilever arrays on a single chip: mass-sensitive detection of volatile organic compounds.
Dirk Lange;Christoph Hagleitner;Andreas Hierlemann;Oliver Brand.
Analytical Chemistry (2002)
Micromachined thermally based CMOS microsensors
H. Baltes;O. Paul;O. Brand.
Proceedings of the IEEE (1998)
Micromachined thermally based CMOS microsensors
H. Baltes;O. Paul;O. Brand.
Proceedings of the IEEE (1998)
Magnetic microactuators based on polymer magnets
L.K. Lagorce;O. Brand;M.G. Allen.
IEEE/ASME Journal of Microelectromechanical Systems (1999)
Microfabrication techniques for chemical/biosensors
A. Hierlemann;O. Brand;C. Hagleitner;H. Baltes.
Proceedings of the IEEE (2003)
Microfabrication techniques for chemical/biosensors
A. Hierlemann;O. Brand;C. Hagleitner;H. Baltes.
Proceedings of the IEEE (2003)
Microjet cooling devices for thermal management of electronics
D.S. Kercher;Jeong-Bong Lee;O. Brand;M.G. Allen.
IEEE Transactions on Components and Packaging Technologies (2003)
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