What is he best known for?
The fields of study he is best known for:
- Composite material
- Electrical engineering
- Integrated circuit
John H. Lau mainly focuses on Soldering, Electronic engineering, Chip, Flip chip and Composite material.
His biological study spans a wide range of topics, including Joint, Structural engineering, Wafer and Temperature cycling.
His Electronic engineering research is multidisciplinary, incorporating perspectives in Through-silicon via, Optoelectronics, Interconnection, Integrated circuit packaging and Interposer.
John H. Lau is involved in the study of Chip that focuses on Three-dimensional integrated circuit in particular.
His Flip chip research is multidisciplinary, relying on both Fracture mechanics, Young's modulus, Ball grid array and Forensic engineering.
His Composite material research is multidisciplinary, incorporating elements of Wafer-scale integration, Wafer-level packaging and Microelectronics.
His most cited work include:
- Discovery of Seven Novel Mammalian and Avian Coronaviruses in the Genus Deltacoronavirus Supports Bat Coronaviruses as the Gene Source of Alphacoronavirus and Betacoronavirus and Avian Coronaviruses as the Gene Source of Gammacoronavirus and Deltacoronavirus (713 citations)
- Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (371 citations)
- Ball Grid Array Technology (340 citations)
What are the main themes of his work throughout his whole career to date?
John H. Lau spends much of his time researching Soldering, Composite material, Electronic engineering, Printed circuit board and Wafer.
His study in Soldering is interdisciplinary in nature, drawing from both Creep, Chip-scale package, Temperature cycling and Flip chip.
Composite material connects with themes related to Structural engineering in his study.
His studies deal with areas such as Optoelectronics, Chip, Three-dimensional integrated circuit and Through-silicon via as well as Electronic engineering.
His Three-dimensional integrated circuit course of study focuses on Interposer and System in package.
His research integrates issues of Mechanical engineering, Electronic packaging, Ball grid array and Integrated circuit packaging in his study of Printed circuit board.
He most often published in these fields:
- Soldering (45.68%)
- Composite material (32.87%)
- Electronic engineering (26.46%)
What were the highlights of his more recent work (between 2014-2021)?
- Fan-out (6.41%)
- Chip (18.66%)
- Wafer (21.73%)
In recent papers he was focusing on the following fields of study:
His scientific interests lie mostly in Fan-out, Chip, Wafer, Wafer-level packaging and Printed circuit board.
His Chip study incorporates themes from Optoelectronics, Computer hardware, Epoxy and Temperature cycling.
The concepts of his Wafer-level packaging study are interwoven with issues in Redistribution layer, Compression molding and Composite material.
John H. Lau studies Composite material, focusing on Soldering in particular.
John H. Lau combines subjects such as Joint, Lead and Flip chip with his study of Soldering.
John H. Lau interconnects Mechanical engineering, Line width and Photoresist in the investigation of issues within Printed circuit board.
Between 2014 and 2021, his most popular works were:
- Recent Advances and New Trends in Flip Chip Technology (52 citations)
- Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging (47 citations)
- Fan-Out Wafer-Level Packaging (39 citations)
In his most recent research, the most cited papers focused on:
- Electrical engineering
- Composite material
- Integrated circuit
His main research concerns Fan-out, Chip, Wafer-level packaging, Printed circuit board and Epoxy.
His Fan-out research includes elements of Mechanical engineering and Temperature cycling.
His study with Printed circuit board involves better knowledge in Electrical engineering.
His work is dedicated to discovering how Epoxy, Compression molding are connected with Wafer-scale integration and Thermal resistance and other disciplines.
His Optoelectronics research incorporates themes from Thermal copper pillar bump and Flip chip.
His Composite material research includes themes of Restoring force and Electronic engineering.
This overview was generated by a machine learning system which analysed the scientist’s
body of work. If you have any feedback, you can
contact us
here.
