The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where John H. Lau sits on this spectrum.
This scientist: 419 publications — 91st percentile
91% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 804 publications or more.
The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where John H. Lau sits on this spectrum.
This scientist: 58 D-Index — 75th percentile
75% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 107 D-Index or more.
John H. Lau is affiliated with ASM International in the United States and has a research focus primarily in engineering, with significant contributions to electrical and electronic engineering. Their work extends into subfields including automotive engineering, biomedical engineering, mechanical engineering, and aerospace engineering.
The scientist's main research topics cover several aspects of electronic and manufacturing technologies. Key areas include:
John H. Lau has published extensively in several journals and proceedings. Frequent publication venues include:
Some of the recent papers by John H. Lau are:
The scientist frequently collaborates with other researchers, including:
John H. Lau was awarded the title Fellow of the American Society of Mechanical Engineers in 1999.
John H. Lau;Yi-Hsin Pao
John H. Lau
John H. Lau
John H. Lau
John H. Lau;Peter A. Engel
John H. Lau;Shi-Wei Ricky Lee
John H. Lau;Peter A. Engel
John H. Lau
John H. Lau
Unknown
N. Khan;V.S. Rao;S. Lim;Ho Soon We
John H. Lau;Ming Li;Dewen Tian;Nelson Fan
John H. Lau
John H. Lau;Richard J. Prosman
Unknown
Xiaowu Zhang;T.C. Chai;John H. Lau;C. S. Selvanayagam
John H. Lau
Unknown
John H. Lau
J. Lau;W. Danksher;P. Vianco
John H. Lau;Tang Gong Yue
John H. Lau
John H. Lau
J.H. Lau;S.-W.R. Lee;C. Chang
John H. Lau;Yung Shih Chen;Tai-Yu Chou;Frank H. Wu
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