World's Best Scientists 2026 revealed!

D-Index & Metrics

Materials Science

D-Index
56
Citations
12029
World Ranking
8221
National Ranking
2028

Engineering and Technology

D-Index
58
Citations
12483
World Ranking
2490
National Ranking
763

Research.com Recognitions

  • 1999 - Fellow of the American Society of Mechanical Engineers

Overview

John H. Lau is affiliated with ASM International in the United States and has a research focus primarily in engineering, with significant contributions to electrical and electronic engineering. Their work extends into subfields including automotive engineering, biomedical engineering, mechanical engineering, and aerospace engineering.

The scientist's main research topics cover several aspects of electronic and manufacturing technologies. Key areas include:

  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies
  • Additive Manufacturing and 3D Printing Technologies
  • Nanofabrication and Lithography Techniques
  • Electromagnetic Compatibility and Noise Suppression
  • Advanced Antenna and Metasurface Technologies
  • Material Properties and Processing

John H. Lau has published extensively in several journals and proceedings. Frequent publication venues include:

  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • Journal of Microelectronics and Electronic Packaging
  • IMAPSource Proceedings
  • Journal of Electronic Packaging
  • International Symposium on Microelectronics

Some of the recent papers by John H. Lau are:

  • Recent Advances and Trends in Advanced Packaging, 2022, IEEE Transactions on Components Packaging and Manufacturing Technology
  • Recent Advances and Trends in Cu-Cu Hybrid Bonding, 2023, IEEE Transactions on Components Packaging and Manufacturing Technology
  • State of the Art of Lead-Free Solder Joint Reliability, 2020, Journal of Electronic Packaging
  • Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers, 2023, IEEE Transactions on Components Packaging and Manufacturing Technology
  • Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers, 2022, IEEE Transactions on Components Packaging and Manufacturing Technology

The scientist frequently collaborates with other researchers, including:

  • Tzyy-Jang Tseng
  • Cheng-Ta Ko
  • Kai-Ming Yang
  • Tim Xia
  • Puru Bruce Lin

John H. Lau was awarded the title Fellow of the American Society of Mechanical Engineers in 1999.

Best Publications

  • Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

    John H. Lau;Yi-Hsin Pao

  • Ball Grid Array Technology

    John H. Lau

  • Overview and outlook of through‐silicon via (TSV) and 3D integrations

    John H. Lau

  • Solder Joint Reliability

    John H. Lau

  • Solder Joint Reliability: Theory and Applications

    John H. Lau;Peter A. Engel

  • Chip scale package (CSP) : design, materials, processes, reliability, and applications

    John H. Lau;Shi-Wei Ricky Lee

  • Thermal Stress and Strain in Microelectronics Packaging

    John H. Lau;Peter A. Engel

  • Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration

    John H. Lau

  • TSV manufacturing yield and hidden costs for 3D IC integration

    John H. Lau

  • Thermal management of 3D IC integration with TSV (through silicon via)

    Unknown

  • Development of 3-D Silicon Module With TSV for System in Packaging

    N. Khan;V.S. Rao;S. Lim;Ho Soon We

  • Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

    John H. Lau;Ming Li;Dewen Tian;Nelson Fan

  • Recent Advances and New Trends in Flip Chip Technology

    John H. Lau

  • Chip on Board: Technologies for Multichip Modules

    John H. Lau;Richard J. Prosman

  • High RF performance TSV silicon carrier for high frequency application

    Unknown

  • Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

    Xiaowu Zhang;T.C. Chai;John H. Lau;C. S. Selvanayagam

  • Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

    John H. Lau

  • Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions

    Unknown

  • Fan-Out Wafer-Level Packaging

    John H. Lau

  • Acceleration models, constitutive equations, and reliability of lead-free solders and joints

    J. Lau;W. Danksher;P. Vianco

  • Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)

    John H. Lau;Tang Gong Yue

  • Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method

    John H. Lau

  • Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

    John H. Lau

  • Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

    J.H. Lau;S.-W.R. Lee;C. Chang

  • Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices

    John H. Lau;Yung Shih Chen;Tai-Yu Chou;Frank H. Wu

Frequent Co-Authors

Aditya Kumar
Aditya Kumar Missouri University of Science and Technology
Chengkuo Lee
Chengkuo Lee National University of Singapore
Dim-Lee Kwong
Dim-Lee Kwong National University of Singapore
Gaurav Sharma
Gaurav Sharma University of Rochester
Ming Li
Ming Li Shanghai Jiao Tong University
John Hock Lye Pang
John Hock Lye Pang Nanyang Technological University

If you think any of the details on this page are incorrect, let us know.

Report an issue

We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below:

Related Online Degrees & Career Pathways

Online education is transforming how students access Engineering and Technology programs in the USA. Flexible study options are now available for learners of all backgrounds. For example, institutions are offering online school for moms, making higher education accessible for parents balancing family and career goals.

Accelerated pathways are also paving the way for rapid skill development. Many colleges offer 6 week college courses, allowing motivated students to progress quickly through core modules. Similarly, specialized business fields can be explored in depth with an accelerated online finance degree—a great option for those interested in tech-driven finance roles.

Ambitious students may even consider fast track mba programs to build leadership skills and open doors to management positions in tech industries. Whether you are seeking flexible learning, faster completion, or career advancement, exploring online degrees can help shape a dynamic career in Engineering and Technology.

Best Scientists Citing John H. Lau

Trending Scientists

Recently Published Articles