World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
41
Citations
6966
World Ranking
1915
National Ranking
721

Research.com Recognitions

  • 2015 - Fellow of the American Society of Mechanical Engineers

Overview

Abhijit Dasgupta is affiliated with the University of Maryland, College Park in the United States. Their academic work is primarily situated within the broad domain of engineering, with a specialization in electrical and electronic engineering, automotive engineering, mechanical engineering, biomedical engineering, and mechanics of materials.

The scientist's research spans several key topics, including electronic packaging and soldering technologies, additive manufacturing and 3D printing technologies, advanced sensor and energy harvesting materials, nanomaterials and printing technologies, 3D IC and TSV technologies, electrohydrodynamics and fluid dynamics, as well as metallurgy and material forming.

Notable recent publications by Abhijit Dasgupta include:

  • Considerations of aerosol-jet printing for the fabrication of printed hybrid electronic circuits (2021, Additive Manufacturing)
  • Ultrathin and Ultrasensitive Printed Carbon Nanotube-Based Temperature Sensors Capable of Repeated Uses on Surfaces of Widely Varying Curvatures and Wettabilities (2021, ACS Applied Materials & Interfaces)
  • Anisotropic steady-state creep behavior of Single-crystal β-Sn: A continuum constitutive model based on crystal viscoplasticity (2021, International Journal of Plasticity)
  • Multi-scale Crystal Viscoplasticity Approach for Estimating Anisotropic Steady-State Creep Properties of Single-Crystal SnAgCu Alloys (2022, International Journal of Plasticity)
  • Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life (2020, Microelectronics Reliability)

Their frequent collaborators have included Siddhartha Das, Beihan Zhao, Qian Jiang, Vishal Sankar Sivasankar, and Hayden Richards.

Abhijit Dasgupta's work is often published in journals such as the Journal of Electronic Packaging, Microelectronics Reliability, ACS Applied Materials & Interfaces, International Journal of Plasticity, and Materials. These venues reflect a focus on a mixture of applied materials science and engineering disciplines.

In recognition of their professional contributions, the scientist was awarded the title of Fellow of the American Society of Mechanical Engineers in 2015.

Best Publications

  • Physics-of-Failure: An Approach to Reliable Product Development

    Michael Pecht;Abhijit Dasgupta

  • Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

    A. Dasgupta;C. Oyan;D. Barker;M. Pecht

  • Material failure mechanisms and damage models

    A. Dasgupta;M. Pecht

  • Three-dimensional modeling of woven-fabric composites for effective thermo-mechanical and thermal properties

    A. Dasgupta;R.K. Agarwal;S.M. Bhandarkar

  • Orthotropic Thermal Conductivity of Plain-Weave Fabric Composites Using a Homogenization Technique

    A. Dasgupta;R.K. Agarwal

  • Cross-Switched Multilevel Inverter Using Novel Switched Capacitor Converters

    Tapas Roy;Pradip Kumar Sadhu;Abhijit Dasgupta

  • Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3.9Ag0.6Cu solder alloy

    Qian Zhang;A. Dasgupta;P. Haswell

  • A fundamental overview of accelerated-testing analytic models

    H. Caruso;A. Dasgupta

  • Failure-mechanism models for creep and creep rupture

    J. Li;A. Dasgupta

  • Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach

    D. Barker;J. Vodzak;A. Dasgupta;M. Pecht

  • Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis

    Qian Zhang;Abhijit Dasgupta;Dave Nelson;Hector Pallavicini

  • Importance of coatings to optical fiber sensors embedded in smart structures

    Abhijit Dasgupta;James S. Sirkis

  • Effective Thermomechanical Behavior of Plain-Weave Fabric-Reinforced Composites Using Homogenization Theory

    A. Dasgupta;S. M. Bhandarkar

  • Role of failure-mechanism identification in accelerated testing

    J.M. Hu;D.B. Barker;A. Dasgupta;A.K. Arora

  • Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

    Y. Zhou;M. Al-Bassyiouni;A. Dasgupta

  • Creep fatigue models of solder joints: A critical review

    Ee-Hua Wong;W. D. van Driel;A. Dasgupta;Michael G. Pecht

  • Failure mechanism models for cyclic fatigue

    A. Dasgupta

  • A generalized self-consistent Mori-Tanaka scheme for fiber-composites with multiple interphases

    A. Dasgupta;S.M. Bhandarkar

  • Considerations of aerosol-jet printing for the fabrication of printed hybrid electronic circuits

    D.R. Hines;Y. Gu;A.A. Martin;P. Li

  • Harmonic and Random Vibration Durability of SAC305 and Sn37Pb Solder Alloys

    Y Zhou;M Al-Bassyiouni;A Dasgupta

  • A nonlinear Galerkin finite-element theory for modeling magnetostrictive smart structures

    K S Kannan;A Dasgupta

  • Prediction of resin pocket geometry for stress analysis of optical fibers embedded in laminated composites

    A Dasgupta;Ying Wan;J S Sirkis

Frequent Co-Authors

Michael Pecht
Michael Pecht University of Maryland, College Park
Guenakh Mitselmakher
Guenakh Mitselmakher University of Florida
John Paul Chou
John Paul Chou Rutgers, The State University of New Jersey

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