World's Best Scientists 2026 revealed!
Herbert Reichl

Herbert Reichl

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
50
Citations
9890
World Ranking
2806
National Ranking
81

Herbert Reichl publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Herbert Reichl sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 557 publications — 88th percentile

88% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Herbert Reichl D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Herbert Reichl sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 50 D-Index — 60th percentile

60% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Research.com Recognitions

  • 2001 - IEEE Fellow For contributions to microelectronic packaging.

Overview

Herbert Reichl is affiliated with the Fraunhofer Society in Germany, an organization known for applied research and development across various scientific and technological disciplines.

They have been recognized as an IEEE Fellow since 2001 for contributions to microelectronic packaging. This distinction indicates involvement in research and development related to the design and assembly of microelectronic components.

Although specific publications, co-authors, and detailed fields of study are not listed, the award citation provides insight into their area of specialization.

Best Publications

  • Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

    A. Schubert;R. Dudek;E. Auerswald;A. Gollbardt

  • Forced convective interlayer cooling in vertically integrated packages

    T. Brunschwiler;B. Michel;H. Rothuizen;U. Kloter

  • High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

    I. Ndip;B. Curran;K. Lobbicke;S. Guttowski

  • Development of a planar micro fuel cell with thin film and micro patterning technologies

    R. Hahn;S. Wagner;A. Schmitz;H. Reichl

  • 3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

    Michael Topper;Ivan Ndip;Robert Erxleben;Lars Brusberg

  • Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric

    T. Linz;C. Kallmayer;R. Aschenbrenner;H. Reichl

  • High aspect ratio TSV copper filling with different seed layers

    M.J. Wolf;T. Dretschkow;B. Wunderle;N. Jurgensen

  • Through silicon via technology — processes and reliability for wafer-level 3D system integration

    P. Ramm;M.J. Wolf;A. Klumpp;R. Wieland

  • Efficient HF modeling and model parameterization of induction machines for time and frequency domain simulations

    M. Schinkel;S. Weber;S. Guttowski;W. John

  • Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

    Ivan Ndip;Kai Zoschke;Kai Lobbicke;M. Jurgen Wolf

  • Reliability assessment of flip-chip assemblies with lead-free solder joints

    A. Schubert;R. Dudek;H. Walter;E. Jung

  • EMC issues in cars with electric drives

    S. Guttowski;S. Weber;E. Hoene;W. John

  • A comparison of thin film polymers for Wafer Level Packaging

    Michael Topper;Thorsten Fischer;Tobias Baumgartner;Herbert Reichl

  • A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

    Young-Doo Jeon;Sabine Nieland;Andreas Ostmann;Herbert Reichl

  • Overview and development trends in the field of MEMS packaging

    Unknown

  • Modeling of striplines between a power and a ground plane

    A.E. Engin;W. John;G. Sommer;W. Mathis

  • Batteries and power supplies for wearable and ubiquitous computing

    R. Hahn;H. Reichl

  • Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

    Dionysios Manessis;Rainer Patzelt;Andreas Ostmann;Rolf Aschenbrenner

  • Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

    K. Zoschke;M.J. Wolf;M. Topper;O. Ehrmann

  • High-temperature reliability of Flip Chip assemblies

    Tanja Braun;Karl-Friedrich Becker;Mathias Koch;Volker Bader

  • Electroless deposition of bumps for TAB technology

    J. Simon;E. Zakel;H. Reichl

  • Micro system technologies 90

    Unknown

Frequent Co-Authors

Bruno Michel
Bruno Michel IBM Research - Zurich
Roberto Gambari
Roberto Gambari University of Ferrara
Hugo E. Rothuizen
Hugo E. Rothuizen IBM Research - Zurich
Y. Zhou
Y. Zhou University of Waterloo
Roberto Guerrieri
Roberto Guerrieri University of Bologna
Toshihiro Itoh
Toshihiro Itoh University of Tokyo
Peter Russer
Peter Russer Technical University of Munich
Thomas Elsaesser
Thomas Elsaesser Max Planck Society
Tadatomo Suga
Tadatomo Suga Meisei University
Franz Faupel
Franz Faupel Kiel University

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