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Herbert Reichl

Herbert Reichl

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
50
Citations
9890
World Ranking
2806
National Ranking
82

Research.com Recognitions

  • 2001 - IEEE Fellow For contributions to microelectronic packaging.

Overview

Herbert Reichl is affiliated with the Fraunhofer Society in Germany, an organization known for applied research and development across various scientific and technological disciplines.

They have been recognized as an IEEE Fellow since 2001 for contributions to microelectronic packaging. This distinction indicates involvement in research and development related to the design and assembly of microelectronic components.

Although specific publications, co-authors, and detailed fields of study are not listed, the award citation provides insight into their area of specialization.

Best Publications

  • Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

    A. Schubert;R. Dudek;E. Auerswald;A. Gollbardt

  • Forced convective interlayer cooling in vertically integrated packages

    T. Brunschwiler;B. Michel;H. Rothuizen;U. Kloter

  • High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

    I. Ndip;B. Curran;K. Lobbicke;S. Guttowski

  • Development of a planar micro fuel cell with thin film and micro patterning technologies

    R. Hahn;S. Wagner;A. Schmitz;H. Reichl

  • 3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

    Michael Topper;Ivan Ndip;Robert Erxleben;Lars Brusberg

  • Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric

    T. Linz;C. Kallmayer;R. Aschenbrenner;H. Reichl

  • High aspect ratio TSV copper filling with different seed layers

    M.J. Wolf;T. Dretschkow;B. Wunderle;N. Jurgensen

  • Through silicon via technology — processes and reliability for wafer-level 3D system integration

    P. Ramm;M.J. Wolf;A. Klumpp;R. Wieland

  • Efficient HF modeling and model parameterization of induction machines for time and frequency domain simulations

    M. Schinkel;S. Weber;S. Guttowski;W. John

  • Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

    Ivan Ndip;Kai Zoschke;Kai Lobbicke;M. Jurgen Wolf

  • Reliability assessment of flip-chip assemblies with lead-free solder joints

    A. Schubert;R. Dudek;H. Walter;E. Jung

  • EMC issues in cars with electric drives

    S. Guttowski;S. Weber;E. Hoene;W. John

  • A comparison of thin film polymers for Wafer Level Packaging

    Michael Topper;Thorsten Fischer;Tobias Baumgartner;Herbert Reichl

  • A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

    Young-Doo Jeon;Sabine Nieland;Andreas Ostmann;Herbert Reichl

  • Overview and development trends in the field of MEMS packaging

    Unknown

  • Modeling of striplines between a power and a ground plane

    A.E. Engin;W. John;G. Sommer;W. Mathis

  • Batteries and power supplies for wearable and ubiquitous computing

    R. Hahn;H. Reichl

  • Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

    Dionysios Manessis;Rainer Patzelt;Andreas Ostmann;Rolf Aschenbrenner

  • Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

    K. Zoschke;M.J. Wolf;M. Topper;O. Ehrmann

  • High-temperature reliability of Flip Chip assemblies

    Tanja Braun;Karl-Friedrich Becker;Mathias Koch;Volker Bader

  • Electroless deposition of bumps for TAB technology

    J. Simon;E. Zakel;H. Reichl

  • Micro system technologies 90

    Unknown

Frequent Co-Authors

Y. Zhou
Y. Zhou University of Waterloo
Franz Faupel
Franz Faupel Kiel University
Toshihiro Itoh
Toshihiro Itoh University of Tokyo
Peter Russer
Peter Russer Technical University of Munich
Roberto Guerrieri
Roberto Guerrieri University of Bologna
Thomas Elsaesser
Thomas Elsaesser Max Planck Society
Tadatomo Suga
Tadatomo Suga Meisei University
Andreas Beling
Andreas Beling University of Virginia
Richard C. Jaeger
Richard C. Jaeger Auburn University
Pradeep Lall
Pradeep Lall Auburn University

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