H-Index & Metrics Best Publications

H-Index & Metrics

Discipline name H-index Citations Publications World Ranking National Ranking
Materials Science D-index 57 Citations 9,553 460 World Ranking 4039 National Ranking 49

Overview

What is he best known for?

The fields of study he is best known for:

  • Composite material
  • Electrical engineering
  • Thermodynamics

His main research concerns Nanotechnology, Composite material, Graphene, Carbon nanotube and Thermal conductivity. His Nanotechnology research is multidisciplinary, incorporating perspectives in Surface-mount technology, Thermal conduction, Electronic packaging and Electronics. The study incorporates disciplines such as Electrical conductor, Integrated circuit packaging and Dielectric in addition to Electronic packaging.

His Composite material research includes themes of Thermal, Temperature cycling and Surface modification. His Graphene study is concerned with Chemical engineering in general. His Carbon nanotube research integrates issues from Through-silicon via, Silicon, Electrical measurements and Microscale chemistry.

His most cited work include:

  • Conductive adhesives for electronics packaging (216 citations)
  • Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives (152 citations)
  • Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates (144 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of investigation include Composite material, Nanotechnology, Thermal conductivity, Carbon nanotube and Adhesive. The concepts of his Composite material study are interwoven with issues in Thermal and Graphene. His Nanotechnology study combines topics from a wide range of disciplines, such as Heat transfer, Chip and Electronics.

His research integrates issues of Composite number, Thermal resistance and Thermal conduction in his study of Thermal conductivity. His research investigates the connection between Carbon nanotube and topics such as Optoelectronics that intersect with problems in Electronic engineering. The various areas that Johan Liu examines in his Adhesive study include Electrically conductive, Curing, Epoxy, Conductive polymer and Flip chip.

He most often published in these fields:

  • Composite material (58.69%)
  • Nanotechnology (29.34%)
  • Thermal conductivity (26.57%)

What were the highlights of his more recent work (between 2016-2021)?

  • Graphene (23.80%)
  • Composite material (58.69%)
  • Thermal conductivity (26.57%)

In recent papers he was focusing on the following fields of study:

Johan Liu spends much of his time researching Graphene, Composite material, Thermal conductivity, Carbon nanotube and Thermal. Research on Chemical engineering and Nanotechnology is a part of his Graphene study. His research on Composite material frequently links to adjacent areas such as Thermal resistance.

His study in Thermal conductivity is interdisciplinary in nature, drawing from both Electrical conductor, Electronic packaging, Electronics and Copper. His Carbon nanotube study integrates concerns from other disciplines, such as Graphite, Heat transfer, Miniaturization, Thermal conduction and Substrate. His Thermal research includes themes of Microelectronics, Nanotube, Heat flux, Heat pipe and Engineering physics.

Between 2016 and 2021, his most popular works were:

  • Novel nanostructured thermal interface materials: a review (102 citations)
  • Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering (63 citations)
  • Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering (63 citations)

In his most recent research, the most cited papers focused on:

  • Composite material
  • Electrical engineering
  • Thermodynamics

Graphene, Carbon nanotube, Chemical engineering, Composite material and Thermal conductivity are his primary areas of study. His work deals with themes such as Capacitance, Engineering physics and Electronics, which intersect with Graphene. His Carbon nanotube study is related to the wider topic of Nanotechnology.

His Chemical engineering research is multidisciplinary, incorporating elements of Supercapacitor, Oxide, Chemical vapor deposition and Raman spectroscopy. Johan Liu conducts interdisciplinary study in the fields of Composite material and Power density through his works. His Thermal conductivity research includes elements of Coaxial, Phonon, Thermal and Electrical conductor.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Conductive adhesives for electronics packaging

Johan Liu.
(1999)

332 Citations

Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives

Lilei Ye;Zonghe Lai;Johan Liu;A. Tholen.
IEEE Transactions on Electronics Packaging Manufacturing (1999)

227 Citations

Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates

Zonghe Lai;Johan Liu.
electrical performance of electronic packaging (1996)

217 Citations

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson;Zonghe Lai;Johan Liu;Hairong Jiang.
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing (2005)

148 Citations

Characterization of liquid crystal polymer for high frequency system-in-a-package applications

Gang Zou;H. Gronqvist;J.P. Starski;Johan Liu.
IEEE Transactions on Advanced Packaging (2002)

141 Citations

Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.

Björn Carlberg;Mathilda Zetterström Axell;Ulf Nannmark;Johan Liu;Johan Liu.
Biomedical Materials (2009)

137 Citations

Novel nanostructured thermal interface materials: a review

Josef Hansson;Torbjörn M. J. Nilsson;Lilei Ye;Johan Liu.
International Materials Reviews (2018)

129 Citations

A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

J. Liu;A. Tolvgard;J. Malmodin;Z. Lai.
IEEE Transactions on Components and Packaging Technologies (1999)

126 Citations

Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo-like morphological complexity of astroglial cells

Till B. Puschmann;Carl Zandén;Yolanda De Pablo;Frank Kirchhoff.
Glia (2013)

124 Citations

Functionalization mediates heat transport in graphene nanoflakes

Haoxue Han;Yong Zhang;Yong Zhang;Nan Wang;Majid Kabiri Samani.
Nature Communications (2016)

109 Citations

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Best Scientists Citing Johan Liu

Ching-Ping Wong

Ching-Ping Wong

Georgia Institute of Technology

Publications: 53

Y.C. Chan

Y.C. Chan

City University of Hong Kong

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Kyoung-Sik Moon

Kyoung-Sik Moon

Georgia Institute of Technology

Publications: 31

Jie Sun

Jie Sun

Fuzhou University

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Zhiliang Zhang

Zhiliang Zhang

Norwegian University of Science and Technology

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Katsuaki Suganuma

Katsuaki Suganuma

Osaka University

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Pradeep Lall

Pradeep Lall

Auburn University

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Alexander A. Balandin

Alexander A. Balandin

University of California, Riverside

Publications: 16

Seeram Ramakrishna

Seeram Ramakrishna

National University of Singapore

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Xu Chen

Xu Chen

Tianjin University

Publications: 11

Yagang Yao

Yagang Yao

Nanjing University

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Rong Sun

Rong Sun

Chinese Academy of Sciences

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Manos M. Tentzeris

Manos M. Tentzeris

Georgia Institute of Technology

Publications: 11

Wen-Yan Yin

Wen-Yan Yin

Zhejiang University

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Malcolm K. Horne

Malcolm K. Horne

Florey Institute of Neuroscience and Mental Health

Publications: 10

Denis L. Nika

Denis L. Nika

Moldova State University

Publications: 9

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