His main research concerns Nanotechnology, Composite material, Graphene, Carbon nanotube and Thermal conductivity. His Nanotechnology research is multidisciplinary, incorporating perspectives in Surface-mount technology, Thermal conduction, Electronic packaging and Electronics. The study incorporates disciplines such as Electrical conductor, Integrated circuit packaging and Dielectric in addition to Electronic packaging.
His Composite material research includes themes of Thermal, Temperature cycling and Surface modification. His Graphene study is concerned with Chemical engineering in general. His Carbon nanotube research integrates issues from Through-silicon via, Silicon, Electrical measurements and Microscale chemistry.
His primary areas of investigation include Composite material, Nanotechnology, Thermal conductivity, Carbon nanotube and Adhesive. The concepts of his Composite material study are interwoven with issues in Thermal and Graphene. His Nanotechnology study combines topics from a wide range of disciplines, such as Heat transfer, Chip and Electronics.
His research integrates issues of Composite number, Thermal resistance and Thermal conduction in his study of Thermal conductivity. His research investigates the connection between Carbon nanotube and topics such as Optoelectronics that intersect with problems in Electronic engineering. The various areas that Johan Liu examines in his Adhesive study include Electrically conductive, Curing, Epoxy, Conductive polymer and Flip chip.
Johan Liu spends much of his time researching Graphene, Composite material, Thermal conductivity, Carbon nanotube and Thermal. Research on Chemical engineering and Nanotechnology is a part of his Graphene study. His research on Composite material frequently links to adjacent areas such as Thermal resistance.
His study in Thermal conductivity is interdisciplinary in nature, drawing from both Electrical conductor, Electronic packaging, Electronics and Copper. His Carbon nanotube study integrates concerns from other disciplines, such as Graphite, Heat transfer, Miniaturization, Thermal conduction and Substrate. His Thermal research includes themes of Microelectronics, Nanotube, Heat flux, Heat pipe and Engineering physics.
Graphene, Carbon nanotube, Chemical engineering, Composite material and Thermal conductivity are his primary areas of study. His work deals with themes such as Capacitance, Engineering physics and Electronics, which intersect with Graphene. His Carbon nanotube study is related to the wider topic of Nanotechnology.
His Chemical engineering research is multidisciplinary, incorporating elements of Supercapacitor, Oxide, Chemical vapor deposition and Raman spectroscopy. Johan Liu conducts interdisciplinary study in the fields of Composite material and Power density through his works. His Thermal conductivity research includes elements of Coaxial, Phonon, Thermal and Electrical conductor.
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Conductive adhesives for electronics packaging
Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives
Lilei Ye;Zonghe Lai;Johan Liu;A. Tholen.
IEEE Transactions on Electronics Packaging Manufacturing (1999)
Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates
Zonghe Lai;Johan Liu.
electrical performance of electronic packaging (1996)
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Cristina Andersson;Zonghe Lai;Johan Liu;Hairong Jiang.
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing (2005)
Characterization of liquid crystal polymer for high frequency system-in-a-package applications
Gang Zou;H. Gronqvist;J.P. Starski;Johan Liu.
IEEE Transactions on Advanced Packaging (2002)
Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.
Björn Carlberg;Mathilda Zetterström Axell;Ulf Nannmark;Johan Liu;Johan Liu.
Biomedical Materials (2009)
Novel nanostructured thermal interface materials: a review
Josef Hansson;Torbjörn M. J. Nilsson;Lilei Ye;Johan Liu.
International Materials Reviews (2018)
A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive
J. Liu;A. Tolvgard;J. Malmodin;Z. Lai.
IEEE Transactions on Components and Packaging Technologies (1999)
Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo-like morphological complexity of astroglial cells
Till B. Puschmann;Carl Zandén;Yolanda De Pablo;Frank Kirchhoff.
Functionalization mediates heat transport in graphene nanoflakes
Haoxue Han;Yong Zhang;Yong Zhang;Nan Wang;Majid Kabiri Samani.
Nature Communications (2016)
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