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Materials Science

D-Index
54
Citations
10690
World Ranking
8896
National Ranking
94

Overview

Johan Liu is affiliated with Chalmers University of Technology in Sweden, focusing on the intersection of materials science and engineering. Their research portfolio is concentrated on advanced materials and their thermal properties, with a particular emphasis on graphene and related nanomaterials.

The main fields of study covered by Johan Liu include:

  • Materials Science
  • Engineering

Within these broader categories, Liu's work delves into several subfields, such as:

  • Materials Chemistry
  • Electrical and Electronic Engineering
  • Civil and Structural Engineering
  • Mechanical Engineering
  • Biomedical Engineering

Their research topics frequently address thermal management and nanomaterials applications, including:

  • Thermal properties of materials
  • Graphene research and applications
  • Thermal Radiation and Cooling Technologies
  • Graphene and Nanomaterials Applications
  • Carbon and Quantum Dots Applications
  • Carbon Nanotubes in Composites
  • Advancements in Battery Materials

Johan Liu has contributed to publications in several notable scientific venues. These include:

  • Nanotechnology
  • ACS Applied Materials & Interfaces
  • ChemistryOpen
  • Journal of Electronic Materials
  • IMAPSource Proceedings

Their recent papers cover diverse advances related to graphene and quantum dots, highlighting work in drug delivery, thermal management, and material fabrication. Notable publications are:

  • Synthesis of graphene quantum dots and their applications in drug delivery, 2020, Journal of Nanobiotechnology
  • Scalable production of thick graphene film for next generation thermal management application, 2020, Carbon
  • Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites, 2020, ACS Applied Materials & Interfaces
  • A Novel Graphene Quantum Dot-Based mRNA Delivery Platform, 2021, ChemistryOpen
  • Graphene-Based Films: Fabrication, Interfacial Modification, and Applications, 2021, Nanomaterials

Liu collaborates regularly with a group of frequent coauthors including:

  • Yifeng Fu
  • Lilei Ye
  • Yong Zhang
  • Andreas Nylander
  • Torbjörn Nilsson

Best Publications

  • Novel nanostructured thermal interface materials: a review

    Josef Hansson;Torbjörn M. J. Nilsson;Lilei Ye;Johan Liu

  • Conductive adhesives for electronics packaging

    Johan Liu

  • Synthesis of graphene quantum dots and their applications in drug delivery

    Changhong Zhao;Changhong Zhao;Xuebin Song;Ya Liu;Yifeng Fu

  • Graphene related materials for thermal management

    Yifeng Fu;Josef Hansson;Ya Liu;Ya Liu;Shujing Chen

  • Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives

    Lilei Ye;Zonghe Lai;Johan Liu;A. Tholen

  • Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates

    Zonghe Lai;Johan Liu

  • Functionalization mediates heat transport in graphene nanoflakes

    Haoxue Han;Yong Zhang;Nan Wang;Majid Kabiri Samani

  • Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering

    Nan Wang;Majid Kabiri Samani;Hu Li;Lan Dong

  • Characterization of liquid crystal polymer for high frequency system-in-a-package applications

    Gang Zou;H. Gronqvist;J.P. Starski;Johan Liu

  • ACA bonding technology for low cost electronics packaging applications – current status and remaining challenges

    Johan Liu

  • Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

    Seung Hee Jeong;Si Chen;Jinxing Huo;Erik Kristofer Gamstedt

  • Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

    Yong Zhang;Yong Zhang;Haoxue Han;Haoxue Han;Nan Wang;Pengtu Zhang

  • Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

    Cristina Andersson;Zonghe Lai;Johan Liu;Hairong Jiang

  • Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo-like morphological complexity of astroglial cells

    Till B. Puschmann;Carl Zandén;Yolanda De Pablo;Frank Kirchhoff

  • Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.

    Björn Carlberg;Mathilda Zetterström Axell;Ulf Nannmark;Johan Liu;Johan Liu

  • Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots

    Zhaoli Gao;Zhaoli Gao;Yong Zhang;Yong Zhang;Yifeng Fu;Matthew Ming Fai Yuen

  • A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

    J. Liu;A. Tolvgard;J. Malmodin;Z. Lai

  • Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper

    Jie Sun;N. Lindvall;M. T. Cole;K. T. T. Angel

  • Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

    Yulai Gao;Changdong Zou;Bin Yang;Qijie Zhai

  • Cellulose-derived carbon nanofibers/graphene composite electrodes for powerful compact supercapacitors

    Volodymyr Kuzmenko;Nan Wang;Mazharul Haque;Olga Naboka

  • A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

    Yifeng Fu;Nabi Nabiollahi;Teng Wang;Shun Wang

  • High-pressure Raman scattering and x-ray diffraction of phase transitions in MoO3

    D. Liu;W. W. Lei;J. Hao;D. D. Liu

Frequent Co-Authors

Magnus Willander
Magnus Willander Linköping University
Eleanor E. B. Campbell
Eleanor E. B. Campbell University of Edinburgh
Milos Pekny
Milos Pekny University of Gothenburg
Hiroaki Muta
Hiroaki Muta Osaka University
Herbert Zirath
Herbert Zirath Chalmers University of Technology
Shinsuke Yamanaka
Shinsuke Yamanaka Osaka University
Sebastian Volz
Sebastian Volz University of Tokyo
Zhigang Wu
Zhigang Wu Huazhong University of Science and Technology
Peter Enoksson
Peter Enoksson Chalmers University of Technology
Kenneth B. K. Teo
Kenneth B. K. Teo Aixtron (United Kingdom)

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