D-Index & Metrics Best Publications

Ching-Ping Wong

Georgia Institute of Technology
United States

Materials Science

USA

2023

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name Citations Publications World Ranking National Ranking

Materials Science D-index 126 Citations 54,753 1,118 World Ranking 198 National Ranking 86

Research.com Recognitions

Awards & Achievements

2023 - Research.com Materials Science in United States Leader Award

2000 - Member of the National Academy of Engineering For contributions to materials development leading to plastic packaging of electronics.

Overview

What are the main themes of his work throughout his whole career to date

His Dry etching research extends to the thematically linked field of Composite material. Ching-Ping Wong combines topics linked to Layer (electronics) with his work on Dry etching. His research ties Composite material and Layer (electronics) together. Nanotechnology is closely attributed to Monolayer in his work. His work on Monolayer is being expanded to include thematically relevant topics such as Nanotechnology. Ching-Ping Wong connects Electrochemistry with Physical chemistry in his research. His research links Electrode with Physical chemistry. In his works, Ching-Ping Wong performs multidisciplinary study on Electrode and Electrochemistry. He performs multidisciplinary studies into Contact angle and Wetting in his work.

Ching-Ping Wong most often published in these fields:

Composite material (100.00%)
Nanotechnology (100.00%)
Electrochemistry (50.00%)

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Low-Cost High-Performance Solid-State Asymmetric Supercapacitors Based on MnO2 Nanowires and Fe2O3 Nanotubes

Peihua Yang;Yong Ding;Ziyin Lin;Zhongwei Chen.
Nano Letters (2014)

1020 Citations

Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging

C. P. Wong;Raja S. Bollampally.
Journal of Applied Polymer Science (1999)

890 Citations

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Yi Li;C.P. Wong.
Materials Science & Engineering R-reports (2006)

878 Citations

Facile Synthesis of Nitrogen-Doped Graphene via Pyrolysis of Graphene Oxide and Urea, and its Electrocatalytic Activity toward the Oxygen-Reduction Reaction

Ziyin Lin;Gordon Waller;Yan Liu;Meilin Liu.
Advanced Energy Materials (2012)

853 Citations

Hydrogenated ZnO Core–Shell Nanocables for Flexible Supercapacitors and Self-Powered Systems

Peihua Yang;Xu Xiao;Yuzhi Li;Yong Ding.
ACS Nano (2013)

783 Citations

Hierarchical porous carbon aerogel derived from bagasse for high performance supercapacitor electrode

Pin Hao;Zhenhuan Zhao;Jian Tian;Haidong Li.
Nanoscale (2014)

521 Citations

Electronics Without Lead

Yi Li;Kyoung-sik Moon;C. P. Wong.
Science (2005)

519 Citations

Graphene-based nitrogen self-doped hierarchical porous carbon aerogels derived from chitosan for high performance supercapacitors

Pin Hao;Pin Hao;Zhenhuan Zhao;Yanhua Leng;Jian Tian.
Nano Energy (2015)

470 Citations

Thermal Behavior of Silver Nanoparticles for Low-Temperature Interconnect Applications

Kyoung-Sik Moon;Hai Dong;Radenka Maric;Suresh Pothukuchi.
Journal of Electronic Materials (2005)

469 Citations

Novel polymer–ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application

Yang Rao;S. Ogitani;Paul Kohl;C. P. Wong.
Journal of Applied Polymer Science (2002)

454 Citations

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Citations by year

Frequent Co-Authors

External Links

Personal Website for Ching-Ping Wong