2026 Katsuaki Suganuma: Materials Science Researcher – H-Index, Publications & Awards

Discipline name	D-Index	World Ranking	Current World Ranking	National Ranking	Current National Ranking	Publications	Citations
Materials Science	81	2564	2475	111	108	777	26065

Discipline name

D-Index

World Ranking

Current World Ranking

National Ranking

Current National Ranking

Publications

Citations

Materials Science

2564

2475

111

108

777

26065

Overview

Katsuaki Suganuma is a researcher affiliated with Osaka University in Japan. Their work primarily spans the fields of engineering and materials science, with specialized focus on electrical and electronic engineering, mechanical engineering, electronic, optical and magnetic materials, materials chemistry, and ceramics and composites.

Their research topics cover:

Electronic packaging and soldering technologies
Aluminum alloys composites properties
3D IC and TSV technologies
Silicon carbide semiconductor technologies
Copper interconnects and reliability
Advanced ceramic materials synthesis
Advanced welding techniques analysis

Suganuma has published extensively, with notable venues including:

SSRN Electronic Journal
IMAPSource Proceedings
IEEE Transactions on Power Electronics
Microelectronics Reliability
Scripta Materialia

Frequent collaborators in their research include Chuantong Chen, Aiji Suetake, Dongjin Kim, Zheng Zhang, and Minoru Ueshima.

Selected recent papers highlight key contributions and include:

"Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip," 2020, IEEE Transactions on Power Electronics
"Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste," 2021, Scripta Materialia
"Robust bonding and thermal-stable Ag-Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less," 2020, Journal of Alloys and Compounds
"Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro," 2020, Journal of Alloys and Compounds
"Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests," 2021, Journal of Electronic Materials

Best Publications

Advances in lead-free electronics soldering

Katsuaki Suganuma

1010
Citations
Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim;S.H. Huh;K. Suganuma

876
Citations
Fabrication of silver nanowire transparent electrodes at room temperature

Takehiro Tokuno;Masaya Nogi;Makoto Karakawa;Jinting Jiu

764
Citations
Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

K.S Kim;S.H Huh;K Suganuma

533
Citations
Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

K.S. Kim;S.H. Huh;K. Suganuma

426
Citations
High-Temperature Lead-Free Solders: Properties and Possibilities

Katsuaki Suganuma;Seong-Jun Kim;Keun-Soo Kim

415
Citations
Low-temperature low-pressure die attach with hybrid silver particle paste

K. Suganuma;S. Sakamoto;N. Kagami;D. Wakuda

359
Citations
Transparent, conductive, and printable composites consisting of TEMPO-oxidized nanocellulose and carbon nanotube.

Hirotaka Koga;Tsuguyuki Saito;Takuya Kitaoka;Masaya Nogi

325
Citations
Bioactive glass coatings for orthopedic metallic implants

Sonia Lopez-Esteban;Eduardo Saiz;Sigheru Fujino;Takeo Oku

320
Citations
A highly sensitive and flexible pressure sensor with electrodes and elastomeric interlayer containing silver nanowires

Jun Wang;Jun Wang;Jinting Jiu;Masaya Nogi;Tohru Sugahara

317
Citations
Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Young-Sun Kim;Keun-Soo Kim;Chi-Won Hwang;Katsuaki Suganuma

311
Citations
Facile synthesis of very-long silver nanowires for transparent electrodes

J. Jiu;T. Araki;J. Wang;M. Nogi

302
Citations
Wetting and interface microstructure between Sn–Zn binary alloys and Cu

Katsuaki Suganuma;Koichi Niihara;Takeshi Shoutoku;Yoshikazu Nakamura

295
Citations
The Surface Coating of Commercial LiFePO 4 by Utilizing ZIF-8 for High Electrochemical Performance Lithium Ion Battery

XiaoLong Xu;CongYu Qi;ZhenDong Hao;Hao Wang

286
Citations
Synthesis, atomic structures and properties of carbon and boron nitride fullerene materials

Takeo Oku;Takanori Hirano;Masaki Kuno;Takafumi Kusunose

284
Citations
Foldable nanopaper antennas for origami electronics

Masaya Nogi;Natsuki Komoda;Kanji Otsuka;Katsuaki Suganuma

263
Citations
Uniformly connected conductive networks on cellulose nanofiber paper for transparent paper electronics

Hirotaka Koga;Masaya Nogi;Natsuki Komoda;Thi Thi Nge

262
Citations
Polyaniline films with modified nanostructure for bifunctional flexible multicolor electrochromic and supercapacitor applications

KaiLing Zhou;Hao Wang;JinTing Jiu;JingBing Liu

251
Citations
Strongly adhesive and flexible transparent silver nanowire conductive films fabricated with a high-intensity pulsed light technique

Jinting Jiu;Masaya Nogi;Tohru Sugahara;Takehiro Tokuno

240
Citations
A Miniaturized Flexible Antenna Printed on a High Dielectric Constant Nanopaper Composite

Tetsuji Inui;Hirotaka Koga;Masaya Nogi;Natsuki Komoda

234
Citations