Guo-Quan Lu

Research.com Recognitions

• 2018 - IEEE Fellow For development of materials and packaging technologies for power electronics modules

Overview

Best Publications

• Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

  J.G. Bai;Zhiye Zach Zhang;J.N. Calata;Guo-Quan Lu

  442
  Citations

• Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

  Tao Wang;Xu Chen;Guo-Quan Lu;Guang-Yin Lei

  401
  Citations

• Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

  Z. Zhang;Guo-Quan Lu

  268
  Citations

• Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly

  J.G. Bai;Guo-Quan Lu

  257
  Citations

• Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{ m mm}^{2})$ Chips

  T.G. Lei;J.N. Calata;Guo-Quan Lu;Xu Chen

  226
  Citations

• Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

  Dun-ji Yu;Xu Chen;Gang Chen;Guo-quan Lu

  213
  Citations

• The Activation Strain Tensor: Nonhydrostatic Stress Effects on Crystal-Growth Kinetics

  Michael J. Aziz;Paul C. Sabin;Guo-Quan Lu

  212
  Citations

• Pressure‐enhanced crystallization kinetics of amorphous Si and Ge: Implications for point‐defect mechanisms

  Guo‐Quan Lu;Eric Nygren;Michael J. Aziz

  211
  Citations

• High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

  J. Guofeng Bai;Jian Yin;Zhiye Zhang;Guo-Quan Lu

  189
  Citations

• Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices

  J.G. Bai;J.N. Calata;Guo-Quan Lu

  168
  Citations

• Nanoscale metal paste for interconnect and method of use

  Guo-Quan Lu;Guangyin Lei;Jesus N. Calata

  165
  Citations

• Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

  Shancan Fu;Yunhui Mei;Guo-Quan Lu;Guo-Quan Lu;Xin Li

  139
  Citations

• Technology trends toward a system-in-a-module in power electronics

  F.C. Lee;J.D. van Wyk;D. Boroyevich;Guo-Quan Lu

  135
  Citations

• Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

  Yiying Yao;Guo-Quan Lu;Dushan Boroyevich;Khai D. T. Ngo

  135
  Citations

• Three-dimensional packaging for power semiconductor devices and modules

  J.N. Calata;J.G. Bai;Xingsheng Liu;Sihua Wen

  128
  Citations

• A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

  Puqi Ning;Thomas Guangyin Lei;Fei Wang;Guo-Quan Lu

  126
  Citations

• Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance

  Xiao Cao;Tao Wang;K D T Ngo;Guo-Quan Lu

  126
  Citations

• Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕or vortex magnetic field sensor

  Shuxiang Dong;J. G. Bai;Junyi Zhai;Jiefang Li

  125
  Citations

• An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

  S. Haque;Kun Xing;Ray-Lee Lin;C.T.A. Suchicital

  123
  Citations

• Effect of Mismatched Sintering Kinetics on Camber in a Low-Temperature Cofired Ceramic Package

  Guo-Quan Lu;Robert C. Sutterlin;Tapan K. Gupta

  109
  Citations

• Packaged Ga 2 O 3 Schottky Rectifiers With Over 60-A Surge Current Capability

  Ming Xiao;Boyan Wang;Jingcun Liu;Ruizhe Zhang

  108
  Citations