World's Best Scientists 2026 revealed!

D-Index & Metrics

Engineering and Technology

D-Index
54
Citations
10996
World Ranking
3189
National Ranking
947

Guo-Quan Lu publication distribution in Engineering and Technology in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where Guo-Quan Lu sits on this spectrum.

38–47 publications: 20 scientists 48–57 publications: 35 scientists 58–67 publications: 96 scientists 68–77 publications: 135 scientists 78–87 publications: 190 scientists 88–97 publications: 259 scientists 98–107 publications: 283 scientists 108–117 publications: 369 scientists 118–127 publications: 341 scientists 128–137 publications: 386 scientists 138–147 publications: 372 scientists 148–157 publications: 457 scientists 158–167 publications: 415 scientists 168–177 publications: 407 scientists 178–187 publications: 421 scientists 188–197 publications: 378 scientists 198–207 publications: 403 scientists 208–217 publications: 317 scientists 218–227 publications: 346 scientists 228–237 publications: 321 scientists 238–247 publications: 260 scientists 248–257 publications: 280 scientists 258–267 publications: 240 scientists 268–277 publications: 214 scientists 278–287 publications: 242 scientists 288–297 publications: 203 scientists 298–307 publications: 166 scientists 308–317 publications: 154 scientists 318–327 publications: 175 scientists 328–337 publications: 159 scientists 338–347 publications: 99 scientists 348–357 publications: 131 scientists 358–367 publications: 106 scientists 368–377 publications: 118 scientists 378–387 publications: 97 scientists 388–397 publications: 108 scientists 398–407 publications: 82 scientists 408–417 publications: 71 scientists 418–427 publications: 64 scientists 428–437 publications: 55 scientists 438–447 publications: 54 scientists 448–457 publications: 60 scientists 458–467 publications: 47 scientists 468–477 publications: 40 scientists 478–487 publications: 30 scientists 488–497 publications: 29 scientists 498–507 publications: 38 scientists 508–517 publications: 40 scientists 518–527 publications: 32 scientists 528–537 publications: 23 scientists 538–547 publications: 28 scientists 548–557 publications: 23 scientists 558–567 publications: 19 scientists 568–577 publications: 16 scientists 578–587 publications: 17 scientists 588–597 publications: 18 scientists 598–607 publications: 22 scientists 608–617 publications: 15 scientists 618–627 publications: 9 scientists 628–637 publications: 11 scientists 638–647 publications: 21 scientists 648–657 publications: 12 scientists 658–667 publications: 9 scientists 668–677 publications: 11 scientists 678–687 publications: 9 scientists 688–697 publications: 6 scientists 698–707 publications: 14 scientists 708–717 publications: 7 scientists 718–727 publications: 8 scientists 728–737 publications: 10 scientists 738–747 publications: 9 scientists 748–757 publications: 5 scientists 758–767 publications: 5 scientists 768–777 publications: 11 scientists 778–787 publications: 7 scientists 788–797 publications: 2 scientists 798–803 publications: 4 scientists 804+ publications: 100 scientists
38 publications 804+

This scientist: 334 publications — 82nd percentile

82% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 804 publications or more.

Guo-Quan Lu D-index placement in Engineering and Technology in 2026

The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where Guo-Quan Lu sits on this spectrum.

30 D-Index: 59 scientists 31 D-Index: 114 scientists 32 D-Index: 129 scientists 33 D-Index: 189 scientists 34 D-Index: 200 scientists 35 D-Index: 262 scientists 36 D-Index: 311 scientists 37 D-Index: 312 scientists 38 D-Index: 350 scientists 39 D-Index: 385 scientists 40 D-Index: 348 scientists 41 D-Index: 362 scientists 42 D-Index: 426 scientists 43 D-Index: 380 scientists 44 D-Index: 310 scientists 45 D-Index: 341 scientists 46 D-Index: 301 scientists 47 D-Index: 306 scientists 48 D-Index: 271 scientists 49 D-Index: 246 scientists 50 D-Index: 210 scientists 51 D-Index: 253 scientists 52 D-Index: 213 scientists 53 D-Index: 221 scientists 54 D-Index: 195 scientists 55 D-Index: 186 scientists 56 D-Index: 170 scientists 57 D-Index: 167 scientists 58 D-Index: 166 scientists 59 D-Index: 144 scientists 60 D-Index: 152 scientists 61 D-Index: 141 scientists 62 D-Index: 138 scientists 63 D-Index: 131 scientists 64 D-Index: 118 scientists 65 D-Index: 114 scientists 66 D-Index: 119 scientists 67 D-Index: 95 scientists 68 D-Index: 87 scientists 69 D-Index: 77 scientists 70 D-Index: 89 scientists 71 D-Index: 69 scientists 72 D-Index: 54 scientists 73 D-Index: 46 scientists 74 D-Index: 55 scientists 75 D-Index: 54 scientists 76 D-Index: 49 scientists 77 D-Index: 53 scientists 78 D-Index: 46 scientists 79 D-Index: 28 scientists 80 D-Index: 39 scientists 81 D-Index: 36 scientists 82 D-Index: 24 scientists 83 D-Index: 26 scientists 84 D-Index: 36 scientists 85 D-Index: 18 scientists 86 D-Index: 25 scientists 87 D-Index: 19 scientists 88 D-Index: 26 scientists 89 D-Index: 27 scientists 90 D-Index: 23 scientists 91 D-Index: 15 scientists 92 D-Index: 12 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 13 scientists 97 D-Index: 13 scientists 98 D-Index: 9 scientists 99 D-Index: 7 scientists 100 D-Index: 7 scientists 101 D-Index: 8 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 9 scientists 105 D-Index: 6 scientists 106 D-Index: 9 scientists 107+ D-Index: 99 scientists
30 D-Index 107+

This scientist: 54 D-Index — 68th percentile

68% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 107 D-Index or more.

Research.com Recognitions

  • 2018 - IEEE Fellow For development of materials and packaging technologies for power electronics modules

Overview

Guo-Quan Lu is affiliated with Virginia Tech in the United States and has a research focus predominantly in engineering, with a specialization in electrical and electronic engineering. Their published work spans multiple subfields, including materials chemistry, mechanical engineering, electronic, optical and magnetic materials, and condensed matter physics.

The primary subjects of Guo-Quan Lu's research cover a variety of advanced topics, notably:

  • Silicon Carbide Semiconductor Technologies
  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies
  • Aluminum Alloys Composites Properties
  • High voltage insulation and dielectric phenomena
  • Electromagnetic Compatibility and Noise Suppression
  • GaN-based semiconductor devices and materials

Guo-Quan Lu has contributed extensively to academic literature, with a significant number of publications appearing in the following venues:

  • IEEE Transactions on Power Electronics
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • IEEE Journal of Emerging and Selected Topics in Power Electronics
  • IEEE Transactions on Industrial Electronics
  • IEEE Transactions on Magnetics

Some recent notable publications include:

  • "Packaged Ga2O3 Schottky Rectifiers With Over 60-A Surge Current Capability," 2021, IEEE Transactions on Power Electronics
  • "A Double-Side Cooled SiC MOSFET Power Module With Sintered-Silver Interposers: I-Design, Simulation, Fabrication, and Performance Characterization," 2021, IEEE Transactions on Power Electronics
  • "Low Thermal Resistance (0.5 K/W) Ga₂O₃ Schottky Rectifiers With Double-Side Packaging," 2021, IEEE Electron Device Letters
  • "Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging," 2021, IEEE Transactions on Power Electronics
  • "Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science," 2022, IEEE Journal of Emerging and Selected Topics in Power Electronics

These works reflect Guo-Quan Lu's emphasis on semiconductor devices, packaging techniques, and materials used in high-power electronics.

The scientist frequently collaborates with several researchers, including:

  • Yunhui Mei
  • Khai D. T. Ngo
  • Zichen Zhang
  • Shengchang Lu
  • Chao Ding

Guo-Quan Lu was recognized as an IEEE Fellow in 2018 for their development of materials and packaging technologies for power electronics modules.

Best Publications

  • Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

    J.G. Bai;Zhiye Zach Zhang;J.N. Calata;Guo-Quan Lu

  • Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

    Tao Wang;Xu Chen;Guo-Quan Lu;Guang-Yin Lei

  • Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

    Z. Zhang;Guo-Quan Lu

  • Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly

    J.G. Bai;Guo-Quan Lu

  • Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{ m mm}^{2})$ Chips

    T.G. Lei;J.N. Calata;Guo-Quan Lu;Xu Chen

  • Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

    Dun-ji Yu;Xu Chen;Gang Chen;Guo-quan Lu

  • The Activation Strain Tensor: Nonhydrostatic Stress Effects on Crystal-Growth Kinetics

    Michael J. Aziz;Paul C. Sabin;Guo-Quan Lu

  • Pressure‐enhanced crystallization kinetics of amorphous Si and Ge: Implications for point‐defect mechanisms

    Guo‐Quan Lu;Eric Nygren;Michael J. Aziz

  • High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

    J. Guofeng Bai;Jian Yin;Zhiye Zhang;Guo-Quan Lu

  • Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices

    J.G. Bai;J.N. Calata;Guo-Quan Lu

  • Nanoscale metal paste for interconnect and method of use

    Guo-Quan Lu;Guangyin Lei;Jesus N. Calata

  • Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

    Shancan Fu;Yunhui Mei;Guo-Quan Lu;Guo-Quan Lu;Xin Li

  • Technology trends toward a system-in-a-module in power electronics

    F.C. Lee;J.D. van Wyk;D. Boroyevich;Guo-Quan Lu

  • Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

    Yiying Yao;Guo-Quan Lu;Dushan Boroyevich;Khai D. T. Ngo

  • Three-dimensional packaging for power semiconductor devices and modules

    J.N. Calata;J.G. Bai;Xingsheng Liu;Sihua Wen

  • A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

    Puqi Ning;Thomas Guangyin Lei;Fei Wang;Guo-Quan Lu

  • Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance

    Xiao Cao;Tao Wang;K D T Ngo;Guo-Quan Lu

  • Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕or vortex magnetic field sensor

    Shuxiang Dong;J. G. Bai;Junyi Zhai;Jiefang Li

  • An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

    S. Haque;Kun Xing;Ray-Lee Lin;C.T.A. Suchicital

  • Effect of Mismatched Sintering Kinetics on Camber in a Low-Temperature Cofired Ceramic Package

    Guo-Quan Lu;Robert C. Sutterlin;Tapan K. Gupta

  • Packaged Ga 2 O 3 Schottky Rectifiers With Over 60-A Surge Current Capability

    Ming Xiao;Boyan Wang;Jingcun Liu;Ruizhe Zhang

Frequent Co-Authors

Khai D. T. Ngo
Khai D. T. Ngo Virginia Tech
Xu Chen
Xu Chen Tianjin University
Rolando Burgos
Rolando Burgos Virginia Tech
Dushan Boroyevich
Dushan Boroyevich Virginia Tech
J.D. van Wyk
J.D. van Wyk University of Johannesburg
Yuhao Zhang
Yuhao Zhang Virginia Tech
Kohei Sasaki
Kohei Sasaki Novel Crystal Technology, Inc
Michael J. Aziz
Michael J. Aziz Harvard University
Fred Wang
Fred Wang University of Tennessee at Knoxville
D. P. H. Hasselman
D. P. H. Hasselman Virginia Tech

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