What is he best known for?
The fields of study he is best known for:
- Composite material
- Thermodynamics
- Electrical engineering
The scientist’s investigation covers issues in Composite material, Sintering, Electronic packaging, Soldering and Metallurgy.
His work on Microstructure, Thermal conductivity, Ultimate tensile strength and Semiconductor device as part of his general Composite material study is frequently connected to Lattice diffusion coefficient, thereby bridging the divide between different branches of science.
His Microstructure research includes themes of Porosity, Nanoelectronics, Semiconductor and Nanomaterials.
His studies deal with areas such as Nanoparticle, Scanning electron microscope, Elastic modulus, Die and Substrate as well as Sintering.
His Electronic packaging research is multidisciplinary, incorporating elements of Silicon carbide, Power module and Power electronics.
His Copper, Aluminium, Recrystallization and Ceramic study in the realm of Metallurgy interacts with subjects such as dBc.
His most cited work include:
- Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (259 citations)
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection (252 citations)
- Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{
m mm}^{2})$ Chips (186 citations)
What are the main themes of his work throughout his whole career to date?
His scientific interests lie mostly in Composite material, Sintering, Metallurgy, Microstructure and Power module.
His work on Soldering, Electronic packaging, Shear strength and Stress as part of general Composite material research is frequently linked to Permeability, thereby connecting diverse disciplines of science.
His work carried out in the field of Sintering brings together such families of science as Nanoparticle, Scanning electron microscope, Die, Thermal resistance and Substrate.
His work is dedicated to discovering how Metallurgy, Silver nanoparticle are connected with Metallic bonding and other disciplines.
His Microstructure research is multidisciplinary, incorporating perspectives in Porosity, Delamination and Grain size.
The various areas that he examines in his Power module study include Optoelectronics, Insulated-gate bipolar transistor, Electronic engineering, Electrical engineering and Junction temperature.
He most often published in these fields:
- Composite material (66.54%)
- Sintering (48.85%)
- Metallurgy (30.77%)
What were the highlights of his more recent work (between 2017-2021)?
- Composite material (66.54%)
- Sintering (48.85%)
- Optoelectronics (13.08%)
In recent papers he was focusing on the following fields of study:
Guo-Quan Lu focuses on Composite material, Sintering, Optoelectronics, Inductance and Power module.
His Composite material research incorporates elements of Metallic bonding and Copper.
His Sintering research entails a greater understanding of Metallurgy.
His work deals with themes such as Junction temperature, Die and Interposer, which intersect with Optoelectronics.
Guo-Quan Lu interconnects Power semiconductor device, MOSFET, Power density and Insulated-gate bipolar transistor in the investigation of issues within Power module.
Guo-Quan Lu studied Thermal resistance and Substrate that intersect with Die.
Between 2017 and 2021, his most popular works were:
- A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air (37 citations)
- A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air (37 citations)
- Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications (19 citations)
In his most recent research, the most cited papers focused on:
- Composite material
- Thermodynamics
- Electrical engineering
His primary areas of study are Composite material, Sintering, Permeability, Inductance and Inductor.
His Composite material study combines topics from a wide range of disciplines, such as Metallic bonding and Copper.
His study in Sintering is interdisciplinary in nature, drawing from both Microstructure, Grain boundary, Scanning electron microscope, Insulated-gate bipolar transistor and Thermal resistance.
The various areas that Guo-Quan Lu examines in his Microstructure study include Die, Power module, Grain size and Nickel.
His studies deal with areas such as Plating, Nanoparticle, Surface force, Nano- and Metallurgy as well as Thermal resistance.
His biological study deals with issues like Electromagnetic coil, which deal with fields such as Magnetic flux.
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