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Khai D. T. Ngo

Khai D. T. Ngo

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
51
Citations
10007
World Ranking
2676
National Ranking
1014

Overview

Khai D. T. Ngo is affiliated with Virginia Tech in the United States and specializes in engineering research, with a primary focus on electrical and electronic engineering. Their work extends into several closely related subfields, including materials chemistry, mechanical engineering, electronic, optical and magnetic materials, and automotive engineering.

The research topics covered by Khai D. T. Ngo reveal a concentration in advanced semiconductor and power electronics technologies. These include:

  • Silicon Carbide Semiconductor Technologies
  • Advanced DC-DC Converters
  • Wireless Power Transfer Systems
  • Multilevel Inverters and Converters
  • High voltage insulation and dielectric phenomena
  • Electromagnetic Compatibility and Noise Suppression
  • Electrostatic Discharge in Electronics

Their publication record spans across notable journals, with the majority of papers appearing in venues such as:

  • IEEE Transactions on Power Electronics
  • IEEE Transactions on Industrial Electronics
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • IEEE Transactions on Magnetics
  • IEEE Journal of Emerging and Selected Topics in Power Electronics

Key recent papers authored by Khai D. T. Ngo include:

  • "A compact mechanical power take-off for wave energy converters: Design, analysis, and test verification" (2020), Applied Energy
  • "A Double-Side Cooled SiC MOSFET Power Module With Sintered-Silver Interposers: I-Design, Simulation, Fabrication, and Performance Characterization" (2021), IEEE Transactions on Power Electronics
  • "A Scalable Electronic-Embedded Transformer, a New Concept Toward Ultra-High-Frequency High-Power Transformer in DC-DC Converters" (2023), IEEE Transactions on Power Electronics
  • "Characterization of a Nonlinear Resistive Polymer-Nanoparticle Composite Coating for Electric Field Reduction in a Medium-Voltage Power Module" (2021), IEEE Transactions on Power Electronics
  • "Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite" (2022), IEEE Transactions on Power Electronics

Khai D. T. Ngo has collaborated frequently with several coauthors, including:

  • Guo-Quan Lu
  • Zichen Zhang
  • Shengchang Lu
  • Chao Ding
  • Lanbing Liu

Their work demonstrates expertise in the integration of cutting-edge materials and power electronics technologies, advancing the understanding of silicon carbide semiconductors and power conversion systems across multiple applications in engineering.

Best Publications

  • Switching converter with pseudo-resonant DC link

    Khai D. T. Ngo

  • A 1200-V, 60-A SiC MOSFET Multichip Phase-Leg Module for High-Temperature, High-Frequency Applications

    Zheng Chen;Yiying Yao;Dushan Boroyevich;Khai D. T. Ngo

  • New Core Loss Measurement Method for High-Frequency Magnetic Materials

    Mingkai Mu;Qiang Li;David Joel Gilham;Fred C. Lee

  • Steady-state analysis and design of a switched-capacitor DC-DC converter

    K.D.T. Ngo;R. Webster

  • A PWM method for reduction of switching loss in a full-bridge inverter

    Ray-Shyang Lai;K.D.T. Ngo

  • Full-bridge lossless switching converter

    Robert L. Steigerwald;Khai D. T. Ngo

  • A High-Temperature SiC Three-Phase AC - DC Converter Design for > 100/spl deg/C Ambient Temperature

    Ruxi Wang;D. Boroyevich;Puqi Ning;Zhiqiang Wang

  • Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

    Yiying Yao;Guo-Quan Lu;Dushan Boroyevich;Khai D. T. Ngo

  • A novel active power decoupling single-phase PWM rectifier topology

    Wenlong Qi;Hui Wang;Xingguo Tan;Guangzhu Wang

  • A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

    Puqi Ning;Thomas Guangyin Lei;Fei Wang;Guo-Quan Lu

  • Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance

    Xiao Cao;Tao Wang;K D T Ngo;Guo-Quan Lu

  • SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

    Puqi Ning;Rixin Lai;D. Huff;Fei Wang

  • A compact mechanical power take-off for wave energy converters: Design, analysis, and test verification

    Xiaofan Li;ChienAn Chen;Qiaofeng Li;Lin Xu

  • Behavioral modeling of the IGBT using the Hammerstein configuration

    J.-T. Hsu;K.D.T. Ngo

  • Balancing of Peak Currents Between Paralleled SiC MOSFETs by Drive-Source Resistors and Coupled Power-Source Inductors

    Yincan Mao;Zichen Miao;Chi-Ming Wang;Khai D. T. Ngo

  • Low Frequency Pulsed Resonant Converter for Energy Harvesting

    Shengwen Xu;K.D.T. Ngo;T. Nishida;Gyo-Bum Chung

  • A frequency-domain study on the effect of DC-link decoupling capacitors

    Zheng Chen;Dushan Boroyevich;Paolo Mattavelli;Khai Ngo

  • Ac vs. dc distribution for off-shore power delivery

    F. Wang;Yunqing Pei;D. Boroyevich;R. Burgos

  • A high frequency core loss measurement method for arbitrary excitations

    Mingkai Mu;Fred C. Lee;Qiang Li;David Gilham

  • Power switched-capacitor DC-DC converter: analysis and design

    W.S. Harris;K.D.T. Ngo

  • Dual-permeability core structure for use in high-frequency magnetic components

    Khai D. T. Ngo;Richard J. Charles

  • A Class of Ceramic-Based Chip Inductors for Hybrid Integration in Power Supplies

    M.H. Lim;J.D. van Wyk;F.C. Lee;K.D.T. Ngo

Frequent Co-Authors

Dushan Boroyevich
Dushan Boroyevich Virginia Tech
Fred Wang
Fred Wang University of Tennessee at Knoxville
Rolando Burgos
Rolando Burgos Virginia Tech
Paolo Mattavelli
Paolo Mattavelli University of Padua
Toshikazu Nishida
Toshikazu Nishida University of Florida
Shashank Priya
Shashank Priya Pennsylvania State University
Fred C. Lee
Fred C. Lee Virginia Tech
J.D. van Wyk
J.D. van Wyk University of Johannesburg
Qiang Li
Qiang Li Virginia Tech
Robert L. Steigerwald
Robert L. Steigerwald General Electric (United States)

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