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Shijo Nagao

Shijo Nagao

D-Index & Metrics

Materials Science

D-Index
45
Citations
5866
World Ranking
11875
National Ranking
740

Overview

Shijo Nagao is affiliated with Osaka University in Japan and has contributed extensively to the fields of Engineering and Physics and Astronomy, with specific focus on Electrical and Electronic Engineering, Mechanical Engineering, Atomic and Molecular Physics, and Condensed Matter Physics.

Their research centers on topics including Electronic Packaging and Soldering Technologies, Silicon Carbide Semiconductor Technologies, Aluminum Alloys Composites Properties, GaN-based semiconductor devices and materials, Advanced ceramic materials synthesis, 3D IC and TSV technologies, and Atomic and Subatomic Physics Research.

Frequent coauthors in their work include:

  • Katsuaki Suganuma
  • Chuantong Chen
  • Dongjin Kim
  • T. Gogami
  • Naoki Wakasugi

Shijo Nagao has published in multiple scientific venues. The most frequent journals where their work appears are:

  • IEEE Transactions on Power Electronics
  • Journal of Materials Science
  • Journal of Materials Science Materials in Electronics
  • International Journal of Applied Ceramic Technology
  • Nano Letters

Selected recent papers include:

  • Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip, 2020, IEEE Transactions on Power Electronics
  • Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests, 2020, IEEE Transactions on Power Electronics
  • Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses, 2021, Journal of Materials Science
  • Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules, 2020, Journal of Materials Science Materials in Electronics
  • Evaluation of thermal resistance for metalized ceramic substrates using a microheater chip, 2021, International Journal of Applied Ceramic Technology

Best Publications

  • A highly sensitive and flexible pressure sensor with electrodes and elastomeric interlayer containing silver nanowires

    Jun Wang;Jun Wang;Jinting Jiu;Masaya Nogi;Tohru Sugahara

  • Facile synthesis of very-long silver nanowires for transparent electrodes

    J. Jiu;T. Araki;J. Wang;M. Nogi

  • Low haze transparent electrodes and highly conducting air dried films with ultra-long silver nanowires synthesized by one-step polyol method

    Teppei Araki;Jinting Jiu;Masaya Nogi;Hirotaka Koga

  • One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices.

    Su Ding;Su Ding;Jinting Jiu;Yue Gao;Yanhong Tian

  • The role of Zn precipitates and Cl− anions in pitting corrosion of Sn–Zn solder alloys

    Jian-Chun Liu;Jian-Chun Liu;SungWon Park;Shijo Nagao;Masaya Nogi

  • Silver Nanowire Electrodes: Conductivity Improvement Without Post-treatment and Application in Capacitive Pressure Sensors

    Jun Wang;Jun Wang;Jinting Jiu;Teppei Araki;Masaya Nogi

  • Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air

    Zheng Zhang;Chuantong Chen;Yang Yang;Hao Zhang

  • Precision of Nanoindentation Protocols for Measurement of Viscoelasticity in Cortical and Trabecular Bone

    Hanna Isaksson;Shijo Nagao;Marta Malkiewicz;Marta Malkiewicz;Petro Julkunen

  • Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

    Yue Gao;Wanli Li;Chuantong Chen;Hao Zhang

  • Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres

    Yue Gao;Hao Zhang;Wanli Li;Jinting Jiu

  • Role of five-fold twin boundary on the enhanced mechanical properties of fcc Fe nanowires.

    J. Y. Wu;S. Nagao;J. Y. He;Z. L. Zhang

  • Cu salt ink formulation for printed electronics using photonic sintering.

    Teppei Araki;Tohru Sugahara;Jinting Jiu;Shijo Nagao

  • Nano-volcanic Eruption of Silver.

    Shih Kang Lin;Shijo Nagao;Emi Yokoi;Chulmin Oh

  • Nanoindentation examination of yttria-stabilized zirconia (YSZ) crystal

    Masaki Fujikane;Daigo Setoyama;Shijo Nagao;Roman Nowak

  • Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices

    Chuantong Chen;Shijo Nagao;Katsuaki Suganuma;Jinting Jiu

  • Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

    Chuantong Chen;Shijo Nagao;Hao Zhang;Jinting Jiu

  • Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

    Soichi Sakamoto;Shijo Nagao;Katsuaki Suganuma

  • Die-attaching silver paste based on a novel solvent for high-power semiconductor devices

    Jinting Jiu;Hao Zhang;Shijo Nagao;Tohru Sugahara

  • Addition of SiC Particles to Ag Die-Attach Paste to Improve High-Temperature Stability; Grain Growth Kinetics of Sintered Porous Ag

    Hao Zhang;Shijo Nagao;Katsuaki Suganuma

  • An electric current spike linked to nanoscale plasticity.

    Roman Nowak;Dariusz Chrobak;Dariusz Chrobak;Shijo Nagao;David Vodnick

Frequent Co-Authors

Katsuaki Suganuma
Katsuaki Suganuma Osaka University
Jinting Jiu
Jinting Jiu Osaka University
Masaya Nogi
Masaya Nogi Osaka University
Zhiliang Zhang
Zhiliang Zhang Norwegian University of Science and Technology
Jianying He
Jianying He Norwegian University of Science and Technology
Kiyoshi Hirao
Kiyoshi Hirao National Institute of Advanced Industrial Science and Technology
Kai Nordlund
Kai Nordlund University of Helsinki
Francesco Iannuzzo
Francesco Iannuzzo Aalborg University
Shinsuke Yamanaka
Shinsuke Yamanaka Osaka University
Koichi Niihara
Koichi Niihara Nagaoka University of Technology

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