Mingyu Li

Overview

Best Publications

• Killing dental pathogens using antibacterial graphene oxide.

  Jianliang He;Xiaodan Zhu;Zhengnan Qi;Chang Wang

  268
  Citations

• Highly Conductive Cu-Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

  Jingdong Liu;Hongtao Chen;Hongjun Ji;Mingyu Li;Mingyu Li

  211
  Citations

• Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications

  Mingyu Li;Yong Xiao;Zhihao Zhang;Jie Yu

  195
  Citations

• Interrupted Glucagon Signaling Reveals Hepatic α Cell Axis and Role for L-Glutamine in α Cell Proliferation

  E Danielle Dean;Mingyu Li;Mingyu Li;Nripesh Prasad;Scott N Wisniewski

  187
  Citations

• Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

  Shuai Wang;Mingyu Li;Mingyu Li;Hongjun Ji;Chunqing Wang

  176
  Citations

• Effects of B2O3 content variation on the Bi ions in Bi2O3–B2O3–SiO2 glass structure

  Xiaomeng Zhu;Chengle Mai;Mingyu Li

  137
  Citations

• Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

  Hongjun Ji;Yunfei Qiao;Mingyu Li

  132
  Citations

• Photocatalytically Powered Matchlike Nanomotor for Light-Guided Active SERS Sensing.

  Yong Wang;Chao Zhou;Wei Wang;Dandan Xu

  120
  Citations

• Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

  Ming Yang;Ming Yang;Hongjun Ji;Shuai Wang;Yong-Ho Ko

  119
  Citations

• Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding

  Tianqi Hu;Hongtao Chen;Mingyu Li;Zhenqing Zhao

  112
  Citations

• Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation

  Unknown

  108
  Citations

• Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal

  Yong Xiao;Hongjun Ji;Mingyu Li;Jongmyung Kim

  105
  Citations

• Phoretic Liquid Metal Micro/Nanomotors as Intelligent Filler for Targeted Microwelding.

  Yong Wang;Wendi Duan;Chao Zhou;Qing Liu

  99
  Citations

• Lightweight carbon foam from coal liquefaction residue with broad-band microwave absorbing capability

  Shuai Wang;Nan Xiao;Ying Zhou;Zheng Ling

  99
  Citations

• Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces

  Z.H. Zhang;Z.H. Zhang;M.Y. Li;Z.Q. Liu;Z.Q. Liu;S.H. Yang

  91
  Citations

• Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles

  Shuai Wang;Hongjun Ji;Mingyu Li;Mingyu Li;Chunqing Wang

  90
  Citations

• Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests

  Ying Ding;Chunqing Wang;Yanhong Tian;Mingyu Li

  89
  Citations

• Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature

  Mingyu Li;Zhuolin Li;Yong Xiao;Chunqing Wang

  88
  Citations

• Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging.

  Hongjun Ji;Junbo Zhou;Meng Liang;Huajun Lu

  87
  Citations

• Fabrication of calcium carbonate coated-stainless steel mesh for efficient oil-water separation via bacterially induced biomineralization technique

  Unknown

  87
  Citations

• Wearable Circuits Sintered at Room Temperature Directly on the Skin Surface for Health Monitoring.

  Ling Zhang;Ling Zhang;Hongjun Ji;Houbing Huang;Ning Yi

  86
  Citations

• A Competitive Solvation of Ternary Eutectic Electrolytes Tailoring the Electrode/Electrolyte Interphase for Lithium Metal Batteries.

  Unknown

  85
  Citations

• Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy

  X. Chen;M. Li;X. X. Ren;A. M. Hu

  83
  Citations

• Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves.

  Zhuolin Li;Mingyu Li;Mingyu Li;Yong Xiao;Chunqing Wang

  82
  Citations

• In situ synthesis of TiB2 particulate reinforced copper matrix composite with a rotating magnetic field

  Tongmin Wang;Cunlei Zou;Zongning Chen;Mingyu Li

  80
  Citations

• Ni 3 Sn 4 -composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging

  Hongjun Ji;Minggang Li;Shu Ma;Mingyu Li

  79
  Citations