World's Best Scientists 2026 revealed!
Jeffrey C. Suhling

Jeffrey C. Suhling

D-Index & Metrics

Discipline name D-Index World Ranking Current World Ranking National Ranking Current National Ranking Publications Citations
Mechanical and Aerospace Engineering 46 1432 1325 567 492 397 8952

Jeffrey C. Suhling publications per year

The chart shows the history of publications by Jeffrey C. Suhling between 1989 and 2025, highlighting the no. of papers published in each year and offering an overview of the publication velocity of this scholar. Jeffrey C. Suhling published across 37 years, from 1989 to 2025, averaging 12.8 papers a year. Output peaked at 56 publications in 2021. 26 of the 474 publications appeared in the last two years.

No. of publications
10 20 30 40 50
Bar chart. Horizontal axis: year, 1989 to 2025. Vertical axis: number of publications, 0 to 56. Peak 56 publications in 2021. 1989: 1 publication 1990: 3 publications 1991: 2 publications 1992: 2 publications 1993: 3 publications 1994: 5 publications 1995: 4 publications 1996: 1 publication 1997: 8 publications 1998: 6 publications 1999: 8 publications 2000: 1 publication 2001: 4 publications 2002: 1 publication 2003: 9 publications 2004: 9 publications 2005: 8 publications 2006: 15 publications 2007: 9 publications 2008: 19 publications 2009: 18 publications 2010: 9 publications 2011: 9 publications 2012: 10 publications 2013: 14 publications 2014: 18 publications 2015: 15 publications 2016: 20 publications 2017: 17 publications 2018: 30 publications 2019: 45 publications 2020: 24 publications 2021: 56 publications 2022: 24 publications 2023: 21 publications 2024: 12 publications 2025: 14 publications
1989 2025

474 publications in total across all disciplines

View publications per year as a table
Jeffrey C. Suhling: publications per year, 1989 to 2025
Year Publications
1989 1
1990 3
1991 2
1992 2
1993 3
1994 5
1995 4
1996 1
1997 8
1998 6
1999 8
2000 1
2001 4
2002 1
2003 9
2004 9
2005 8
2006 15
2007 9
2008 19
2009 18
2010 9
2011 9
2012 10
2013 14
2014 18
2015 15
2016 20
2017 17
2018 30
2019 45
2020 24
2021 56
2022 24
2023 21
2024 12
2025 14
Total 474
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Jeffrey C. Suhling publication distribution in Mechanical and Aerospace Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where Jeffrey C. Suhling sits on this spectrum.

No. of scientists
50 100 150
Bar chart with 63 bars. Horizontal axis: publications, 47–56 to 659+. Vertical axis: number of scientists, 0 to 155. Most scientists, 155, have 147–156 publications. The last bar groups every scientist with 659 publications or more. The highlighted bar, 397–406 publications, is where this scientist sits. 47–56 publications: 10 scientists 57–66 publications: 23 scientists 67–76 publications: 32 scientists 77–86 publications: 62 scientists 87–96 publications: 67 scientists 97–106 publications: 91 scientists 107–116 publications: 113 scientists 117–126 publications: 115 scientists 127–136 publications: 130 scientists 137–146 publications: 140 scientists 147–156 publications: 155 scientists 157–166 publications: 132 scientists 167–176 publications: 133 scientists 177–186 publications: 130 scientists 187–196 publications: 140 scientists 197–206 publications: 115 scientists 207–216 publications: 125 scientists 217–226 publications: 117 scientists 227–236 publications: 99 scientists 237–246 publications: 92 scientists 247–256 publications: 100 scientists 257–266 publications: 95 scientists 267–276 publications: 88 scientists 277–286 publications: 77 scientists 287–296 publications: 74 scientists 297–306 publications: 74 scientists 307–316 publications: 62 scientists 317–326 publications: 70 scientists 327–336 publications: 59 scientists 337–346 publications: 58 scientists 347–356 publications: 45 scientists 357–366 publications: 44 scientists 367–376 publications: 36 scientists 377–386 publications: 41 scientists 387–396 publications: 32 scientists 397–406 publications: 23 scientists 407–416 publications: 28 scientists 417–426 publications: 27 scientists 427–436 publications: 25 scientists 437–446 publications: 23 scientists 447–456 publications: 23 scientists 457–466 publications: 20 scientists 467–476 publications: 12 scientists 477–486 publications: 24 scientists 487–496 publications: 18 scientists 497–506 publications: 12 scientists 507–516 publications: 13 scientists 517–526 publications: 21 scientists 527–536 publications: 12 scientists 537–546 publications: 8 scientists 547–556 publications: 16 scientists 557–566 publications: 3 scientists 567–576 publications: 11 scientists 577–586 publications: 6 scientists 587–596 publications: 5 scientists 597–606 publications: 6 scientists 607–616 publications: 7 scientists 617–626 publications: 7 scientists 627–636 publications: 10 scientists 637–646 publications: 4 scientists 647–656 publications: 3 scientists 657–658 publications: 2 scientists 659+ publications: 100 scientists
47–56 publications 659+

This scientist: 397 publications — 87th percentile

87% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 659 publications or more.

View publications distribution as a table
Number of Mechanical and Aerospace Engineering scientists by publication count, Research.com 2026 ranking edition. Based on 3,445 ranked scientists.
Publications Scientists This scientist
47–56 10
57–66 23
67–76 32
77–86 62
87–96 67
97–106 91
107–116 113
117–126 115
127–136 130
137–146 140
147–156 155
157–166 132
167–176 133
177–186 130
187–196 140
197–206 115
207–216 125
217–226 117
227–236 99
237–246 92
247–256 100
257–266 95
267–276 88
277–286 77
287–296 74
297–306 74
307–316 62
317–326 70
327–336 59
337–346 58
347–356 45
357–366 44
367–376 36
377–386 41
387–396 32
397–406 23 397
407–416 28
417–426 27
427–436 25
437–446 23
447–456 23
457–466 20
467–476 12
477–486 24
487–496 18
497–506 12
507–516 13
517–526 21
527–536 12
537–546 8
547–556 16
557–566 3
567–576 11
577–586 6
587–596 5
597–606 6
607–616 7
617–626 7
627–636 10
637–646 4
647–656 3
657–658 2
659+ 100
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Jeffrey C. Suhling D-index placement in Mechanical and Aerospace Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Jeffrey C. Suhling sits on this spectrum.

No. of scientists
50 100 150
Bar chart with 64 bars. Horizontal axis: D-Index, 30 to 93+. Vertical axis: number of scientists, 0 to 189. Most scientists, 189, have 34 D-Index. The last bar groups every scientist with 93 D-Index or more. The highlighted bar, 46 D-Index, is where this scientist sits. 30 D-Index: 83 scientists 31 D-Index: 113 scientists 32 D-Index: 144 scientists 33 D-Index: 153 scientists 34 D-Index: 189 scientists 35 D-Index: 158 scientists 36 D-Index: 139 scientists 37 D-Index: 127 scientists 38 D-Index: 130 scientists 39 D-Index: 126 scientists 40 D-Index: 104 scientists 41 D-Index: 100 scientists 42 D-Index: 107 scientists 43 D-Index: 101 scientists 44 D-Index: 103 scientists 45 D-Index: 79 scientists 46 D-Index: 88 scientists 47 D-Index: 70 scientists 48 D-Index: 83 scientists 49 D-Index: 44 scientists 50 D-Index: 64 scientists 51 D-Index: 56 scientists 52 D-Index: 50 scientists 53 D-Index: 48 scientists 54 D-Index: 58 scientists 55 D-Index: 52 scientists 56 D-Index: 48 scientists 57 D-Index: 42 scientists 58 D-Index: 34 scientists 59 D-Index: 42 scientists 60 D-Index: 37 scientists 61 D-Index: 42 scientists 62 D-Index: 44 scientists 63 D-Index: 22 scientists 64 D-Index: 33 scientists 65 D-Index: 29 scientists 66 D-Index: 23 scientists 67 D-Index: 29 scientists 68 D-Index: 24 scientists 69 D-Index: 19 scientists 70 D-Index: 34 scientists 71 D-Index: 26 scientists 72 D-Index: 19 scientists 73 D-Index: 18 scientists 74 D-Index: 19 scientists 75 D-Index: 14 scientists 76 D-Index: 19 scientists 77 D-Index: 8 scientists 78 D-Index: 18 scientists 79 D-Index: 16 scientists 80 D-Index: 12 scientists 81 D-Index: 17 scientists 82 D-Index: 11 scientists 83 D-Index: 16 scientists 84 D-Index: 7 scientists 85 D-Index: 9 scientists 86 D-Index: 8 scientists 87 D-Index: 6 scientists 88 D-Index: 6 scientists 89 D-Index: 7 scientists 90 D-Index: 10 scientists 91 D-Index: 4 scientists 92 D-Index: 4 scientists 93+ D-Index: 100 scientists
30 D-Index 93+

This scientist: 46 D-Index — 59th percentile

59% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 93 D-Index or more.

View D-Index distribution as a table
Number of Mechanical and Aerospace Engineering scientists by D-index, Research.com 2026 ranking edition. Based on 3,445 ranked scientists.
D-Index Scientists This scientist
30 83
31 113
32 144
33 153
34 189
35 158
36 139
37 127
38 130
39 126
40 104
41 100
42 107
43 101
44 103
45 79
46 88 46
47 70
48 83
49 44
50 64
51 56
52 50
53 48
54 58
55 52
56 48
57 42
58 34
59 42
60 37
61 42
62 44
63 22
64 33
65 29
66 23
67 29
68 24
69 19
70 34
71 26
72 19
73 18
74 19
75 14
76 19
77 8
78 18
79 16
80 12
81 17
82 11
83 16
84 7
85 9
86 8
87 6
88 6
89 7
90 10
91 4
92 4
93+ 100
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Research.com Recognitions

  • 2009 - Fellow of the American Society of Mechanical Engineers

Overview

Jeffrey C. Suhling is affiliated with Auburn University in the United States and has a research focus primarily in the field of engineering. Their work spans various subfields including electrical and electronic engineering, mechanical engineering, aerospace engineering, mechanics of materials, and automotive engineering.

The scientist's research covers multiple topics with a strong emphasis on electronic packaging and soldering technologies. Other notable topics include 3D IC and TSV technologies, aluminum alloy microstructure properties, intermetallics and advanced alloy properties, aluminum alloys composites properties, advanced welding techniques analysis, and copper interconnects and reliability.

Jeffrey C. Suhling has contributed extensively to several publication venues, with the highest number of publications appearing in the IEEE Transactions on Components Packaging and Manufacturing Technology. Other frequent venues include the 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), the Journal of Electronic Packaging, and the Journal of Electronic Materials.

Their recent papers reflect research on the mechanical and microstructural properties of solder materials under various conditions. Selected recent publications include:

  • Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint, 2020, Journal of Electronic Materials
  • Mechanical Property Evolution in SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposure Profiles, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation, 2021, Journal of Electronic Packaging
  • Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to Different Thermal Exposure Profiles, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation During Cycling, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

Jeffrey C. Suhling frequently collaborates with several researchers, including:

  • Pradeep Lall
  • Ravi Mahajan
  • Alan Huffman
  • K Yokouchi
  • Karlheinz Bock

In recognition of their contributions, they have been awarded the status of Fellow of the American Society of Mechanical Engineers in 2009.

Best Publications

  • A review of mechanical properties of lead-free solders for electronic packaging

    Hongtao Ma;Jeffrey C. Suhling

  • Silicon piezoresistive stress sensors and their application in electronic packaging

    J.C. Suhling;R.C. Jaeger

  • Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

    D. A. Bittle;J. C. Suhling;R. E. Beaty;R. C. Jaeger

  • The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints

    Hongtao Ma;J.C. Suhling;Yifei Zhang;P. Lall

  • Reliability of the aging lead free solder joint

    Hongtao Ma;J.C. Suhling;P. Lall;M.J. Bozack

  • CMOS stress sensors on [100] silicon

    R.C. Jaeger;J.C. Suhling;R. Ramani;A.T. Bradley

  • Determination of Anand constants for SAC solders using stress-strain or creep data

    Mohammad Motalab;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall

  • Piezoresistive characteristics of short-channel MOSFETs on (100) silicon

    A.T. Bradley;R.C. Jaeger;J.C. Suhling;K.J. O'Connor

  • Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact

    P. Lall;D.R. Panchagade;Yueli Liu;R.W. Johnson

  • The effects of aging temperature on SAC solder joint material behavior and reliability

    Yifei Zhang;Zijie Cai;J.C. Suhling;P. Lall

  • Model for BGA and CSP reliability in automotive underhood applications

    P. Lall;M.N. Islam;N. Singh;J.C. Suhling

  • Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact

    P. Lall;D. Panchagade;Yueli Liu;W. Johnson

  • Reduction of lead free solder aging effects using doped SAC alloys

    Zijie Cai;Yifei Zhang;Jeffrey C. Suhling;Pradeep Lall

  • Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture

    R.E. Beaty;R.C. Jaeger;J.C. Suhling;R.W. Johnson

  • Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies

    P. Lall;P. Choudhary;S. Gupte;J. Suhling

  • Errors associated with the design, calibration and application of piezoresistive stress sensors in (100) silicon

    R.C. Jaeger;J.C. Suhling;R. Ramani

  • Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

    P. Lall;D.R. Panchagade;P. Choudhary;S. Gupte

  • Prognostics and Health Management of Electronic Packaging

    P. Lall;M.N. Islam;M.K. Rahim;J.C. Suhling

  • Improved predictions of lead free solder joint reliability that include aging effects

    Mohammad Motalab;Zijie Cai;Jeffrey C. Suhling;Jiawei Zhang

  • Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages

    Jiawei Zhang;Zhou Hai;Sivasubramanian Thirugnanasambandam;John L. Evans

  • The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders

    Muhannad Mustafa;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall

  • Correlation of reliability models including aging effects with thermal cycling reliability data

    Mohammad Motalab;Muhannad Mustafa;Jeffrey C. Suhling;Jiawei Zhang

  • The effects of SAC alloy composition on aging resistance and reliability

    Yifei Zhang;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall

  • Prognostics and Health Management of Electronics

    P. Lall;M. Hande;C. Bhat;J. Suhling

Frequent Co-Authors

Pradeep Lall
Pradeep Lall Auburn University
Richard C. Jaeger
Richard C. Jaeger Auburn University
Kai Goebel
Kai Goebel Palo Alto Research Center
Bogdan M. Wilamowski
Bogdan M. Wilamowski Auburn University
Ryan J. Lowe
Ryan J. Lowe University of Western Australia
Robert L. Jackson
Robert L. Jackson Auburn University
Song-Yul Choe
Song-Yul Choe Auburn University
Guofu Niu
Guofu Niu Auburn University
Jay Lee
Jay Lee University of Maryland, College Park
Herbert Reichl
Herbert Reichl Fraunhofer Society

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