The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where Jeffrey C. Suhling sits on this spectrum.
This scientist: 397 publications — 87th percentile
87% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 659 publications or more.
The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Jeffrey C. Suhling sits on this spectrum.
This scientist: 46 D-Index — 59th percentile
59% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 93 D-Index or more.
Jeffrey C. Suhling is affiliated with Auburn University in the United States and has a research focus primarily in the field of engineering. Their work spans various subfields including electrical and electronic engineering, mechanical engineering, aerospace engineering, mechanics of materials, and automotive engineering.
The scientist's research covers multiple topics with a strong emphasis on electronic packaging and soldering technologies. Other notable topics include 3D IC and TSV technologies, aluminum alloy microstructure properties, intermetallics and advanced alloy properties, aluminum alloys composites properties, advanced welding techniques analysis, and copper interconnects and reliability.
Jeffrey C. Suhling has contributed extensively to several publication venues, with the highest number of publications appearing in the IEEE Transactions on Components Packaging and Manufacturing Technology. Other frequent venues include the 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), the Journal of Electronic Packaging, and the Journal of Electronic Materials.
Their recent papers reflect research on the mechanical and microstructural properties of solder materials under various conditions. Selected recent publications include:
Jeffrey C. Suhling frequently collaborates with several researchers, including:
In recognition of their contributions, they have been awarded the status of Fellow of the American Society of Mechanical Engineers in 2009.
Hongtao Ma;Jeffrey C. Suhling
J.C. Suhling;R.C. Jaeger
D. A. Bittle;J. C. Suhling;R. E. Beaty;R. C. Jaeger
Hongtao Ma;J.C. Suhling;Yifei Zhang;P. Lall
Hongtao Ma;J.C. Suhling;P. Lall;M.J. Bozack
R.C. Jaeger;J.C. Suhling;R. Ramani;A.T. Bradley
Mohammad Motalab;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall
A.T. Bradley;R.C. Jaeger;J.C. Suhling;K.J. O'Connor
P. Lall;D.R. Panchagade;Yueli Liu;R.W. Johnson
Yifei Zhang;Zijie Cai;J.C. Suhling;P. Lall
P. Lall;M.N. Islam;N. Singh;J.C. Suhling
P. Lall;D. Panchagade;Yueli Liu;W. Johnson
Zijie Cai;Yifei Zhang;Jeffrey C. Suhling;Pradeep Lall
R.E. Beaty;R.C. Jaeger;J.C. Suhling;R.W. Johnson
P. Lall;P. Choudhary;S. Gupte;J. Suhling
R.C. Jaeger;J.C. Suhling;R. Ramani
P. Lall;D.R. Panchagade;P. Choudhary;S. Gupte
P. Lall;M.N. Islam;M.K. Rahim;J.C. Suhling
Mohammad Motalab;Zijie Cai;Jeffrey C. Suhling;Jiawei Zhang
Jiawei Zhang;Zhou Hai;Sivasubramanian Thirugnanasambandam;John L. Evans
Muhannad Mustafa;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall
Mohammad Motalab;Muhannad Mustafa;Jeffrey C. Suhling;Jiawei Zhang
Yifei Zhang;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall
P. Lall;M. Hande;C. Bhat;J. Suhling
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