2009 - Fellow of the American Society of Mechanical Engineers
Jeffrey C. Suhling focuses on Metallurgy, Soldering, Temperature cycling, Creep and Stress. Soldering is a subfield of Composite material that he studies. His work investigates the relationship between Temperature cycling and topics such as Microstructure that intersect with problems in Isothermal process.
The concepts of his Creep study are interwoven with issues in Joint, Eutectic system and Viscoplasticity. His work carried out in the field of Stress brings together such families of science as Mechanical engineering, Die, Integrated circuit, Resistor and Piezoresistive effect. Silicon and Reliability engineering is closely connected to Electronic engineering in his research, which is encompassed under the umbrella topic of Die.
His primary areas of investigation include Composite material, Soldering, Temperature cycling, Stress and Metallurgy. His Composite material research is multidisciplinary, incorporating perspectives in Operating temperature and Viscoplasticity. The study incorporates disciplines such as Creep, Nanoindentation, Microstructure and Isothermal process in addition to Soldering.
The various areas that he examines in his Temperature cycling study include Joint, Structural engineering and Electronic packaging. His Stress study also includes
The scientist’s investigation covers issues in Composite material, Soldering, Creep, Stress and Temperature cycling. His Composite material study combines topics in areas such as Operating temperature, Viscoplasticity and Isothermal process. His Soldering research focuses on Ball grid array in particular.
His research in Creep intersects with topics in Viscoelasticity and Microelectronics. His studies in Stress integrate themes in fields like Plasticity, High strain rate, Hysteresis, Temperature measurement and Piezoresistive effect. His Temperature cycling research is multidisciplinary, incorporating elements of Quad Flat No-leads package, Metallurgy, Lead and Die.
Jeffrey C. Suhling mostly deals with Composite material, Soldering, Microstructure, Creep and Temperature cycling. His research investigates the connection between Composite material and topics such as Lead that intersect with problems in Cyclic loading, Strain and Microstructural evolution. His biological study spans a wide range of topics, including Alloy, Thermal expansion, Nanoindentation and Viscoplasticity.
His Microstructure research includes themes of Printed circuit board and Intermetallic. His Creep research incorporates themes from Dynamic mechanical analysis, Series expansion, Relaxation, Mechanics and Viscoelasticity. The Temperature cycling study combines topics in areas such as Surface finish, Material properties and Isothermal process.
This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.
A review of mechanical properties of lead-free solders for electronic packaging
Hongtao Ma;Jeffrey C. Suhling.
Journal of Materials Science (2009)
Silicon piezoresistive stress sensors and their application in electronic packaging
J.C. Suhling;R.C. Jaeger.
IEEE Sensors Journal (2001)
Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages
D. A. Bittle;J. C. Suhling;R. E. Beaty;R. C. Jaeger.
Journal of Electronic Packaging (1991)
The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints
Hongtao Ma;J.C. Suhling;Yifei Zhang;P. Lall.
electronic components and technology conference (2007)
Reliability of the aging lead free solder joint
Hongtao Ma;J.C. Suhling;P. Lall;M.J. Bozack.
electronic components and technology conference (2006)
CMOS stress sensors on  silicon
R.C. Jaeger;J.C. Suhling;R. Ramani;A.T. Bradley.
IEEE Journal of Solid-state Circuits (2000)
Piezoresistive characteristics of short-channel MOSFETs on (100) silicon
A.T. Bradley;R.C. Jaeger;J.C. Suhling;K.J. O'Connor.
IEEE Transactions on Electron Devices (2001)
Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact
P. Lall;D.R. Panchagade;Yueli Liu;R.W. Johnson.
IEEE Transactions on Components and Packaging Technologies (2006)
Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact
P. Lall;D. Panchagade;Yueli Liu;W. Johnson.
electronic components and technology conference (2004)
Model for BGA and CSP reliability in automotive underhood applications
P. Lall;M.N. Islam;N. Singh;J.C. Suhling.
IEEE Transactions on Components and Packaging Technologies (2004)
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