What is he best known for?
The fields of study he is best known for:
- Composite material
- Electrical engineering
- Thermodynamics
Jeffrey C. Suhling focuses on Metallurgy, Soldering, Temperature cycling, Creep and Stress. Soldering is a subfield of Composite material that he studies. His work investigates the relationship between Temperature cycling and topics such as Microstructure that intersect with problems in Isothermal process.
The concepts of his Creep study are interwoven with issues in Joint, Eutectic system and Viscoplasticity. His work carried out in the field of Stress brings together such families of science as Mechanical engineering, Die, Integrated circuit, Resistor and Piezoresistive effect. Silicon and Reliability engineering is closely connected to Electronic engineering in his research, which is encompassed under the umbrella topic of Die.
His most cited work include:
- A review of mechanical properties of lead-free solders for electronic packaging (378 citations)
- Silicon piezoresistive stress sensors and their application in electronic packaging (265 citations)
- Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages (186 citations)
What are the main themes of his work throughout his whole career to date?
His primary areas of investigation include Composite material, Soldering, Temperature cycling, Stress and Metallurgy. His Composite material research is multidisciplinary, incorporating perspectives in Operating temperature and Viscoplasticity. The study incorporates disciplines such as Creep, Nanoindentation, Microstructure and Isothermal process in addition to Soldering.
The various areas that he examines in his Temperature cycling study include Joint, Structural engineering and Electronic packaging. His Stress study also includes
- Die which connect with Electronic engineering and Flip chip,
- Piezoresistive effect that connect with fields like Silicon, Wafer, Resistor and Integrated circuit. He interconnects Doping and Dopant in the investigation of issues within Metallurgy.
He most often published in these fields:
- Composite material (47.71%)
- Soldering (46.86%)
- Temperature cycling (27.43%)
What were the highlights of his more recent work (between 2018-2021)?
- Composite material (47.71%)
- Soldering (46.86%)
- Creep (20.29%)
In recent papers he was focusing on the following fields of study:
The scientist’s investigation covers issues in Composite material, Soldering, Creep, Stress and Temperature cycling. His Composite material study combines topics in areas such as Operating temperature, Viscoplasticity and Isothermal process. His Soldering research focuses on Ball grid array in particular.
His research in Creep intersects with topics in Viscoelasticity and Microelectronics. His studies in Stress integrate themes in fields like Plasticity, High strain rate, Hysteresis, Temperature measurement and Piezoresistive effect. His Temperature cycling research is multidisciplinary, incorporating elements of Quad Flat No-leads package, Metallurgy, Lead and Die.
Between 2018 and 2021, his most popular works were:
- Microstructural Evolution in SAC+X Solders Subjected to Aging (6 citations)
- Atomistic analysis of the thermomechanical properties of Sn–Ag–Cu solder materials at the nanoscale with the MEAM potential (5 citations)
- Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material (4 citations)
In his most recent research, the most cited papers focused on:
- Composite material
- Electrical engineering
- Thermodynamics
Jeffrey C. Suhling mostly deals with Composite material, Soldering, Microstructure, Creep and Temperature cycling. His research investigates the connection between Composite material and topics such as Lead that intersect with problems in Cyclic loading, Strain and Microstructural evolution. His biological study spans a wide range of topics, including Alloy, Thermal expansion, Nanoindentation and Viscoplasticity.
His Microstructure research includes themes of Printed circuit board and Intermetallic. His Creep research incorporates themes from Dynamic mechanical analysis, Series expansion, Relaxation, Mechanics and Viscoelasticity. The Temperature cycling study combines topics in areas such as Surface finish, Material properties and Isothermal process.
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