2026 Xuejun Fan: Engineering and Technology Researcher – H-Index, Publications & Awards

Discipline name	D-Index	World Ranking	Current World Ranking	National Ranking	Current National Ranking	Publications	Citations
Engineering and Technology	47	4916	4732	1409	1301	308	7852

Overview

Xuejun Fan is affiliated with Lamar University in the United States and contributes extensively to engineering research, specifically within electrical and electronic engineering as well as mechanical engineering. Their scholarly output encompasses 142 publications across various intersecting disciplines.

Their research spans multiple subfields including:

Electrical and Electronic Engineering
Mechanical Engineering
Materials Chemistry
Mechanics of Materials
Computational Mechanics

Xuejun Fan's work covers specific topics such as:

Electronic Packaging and Soldering Technologies
Aluminum Alloys Composites Properties
Silicon Carbide Semiconductor Technologies
GaN-based semiconductor devices and materials
Metal and Thin Film Mechanics
Copper Interconnects and Reliability
Combustion and flame dynamics

The scientist has collaborated frequently with peers such as Guoqi Zhang, Jiajie Fan, Dong Hu, Zhen Cui, and Hongyu Tang.

Key publication venues for Xuejun Fan include:

Microelectronics Reliability
Laser & Photonics Review
Materials & Design
IEEE Transactions on Components Packaging and Manufacturing Technology
Applied Surface Science

Representative recent publications by Xuejun Fan are as follows:

Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives (2020), Journal of Materials Chemistry A
Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light-Emitting Diodes (2020), Laser & Photonics Review
Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study (2020), Results in Physics
Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network (2020), IEEE Electron Device Letters
Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm² Heat Dissipation (2020), IEEE Transactions on Power Electronics

Best Publications

A review of small heat pipes for electronics

Xianping Chen;Xianping Chen;Huaiyu Ye;Xuejun Fan;Tianling Ren

340
Citations
Mechanics of Microelectronics

G. Q. Zhang;W. D. Van Driel;X. J. Fan

245
Citations
Experimental investigations and model study of moisture behaviors in polymeric materials

X.J. Fan;X.J. Fan;S.W.R. Lee;Q. Han

205
Citations
Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives

Hongyu Tang;Leandro Nicolas Sacco;Sten Vollebregt;Huaiyu Ye

202
Citations
Solid State Lighting Reliability Part 2

Willem Dirk van Driel;Xuejun Fan;Guo Qi Zhang

196
Citations
Design and optimization of thermo-mechanical reliability in wafer level packaging

X.J. Fan;X.J. Fan;B. Varia;Q. Han

147
Citations
Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

X.-J. Fan;H.B. Wang;T.B. Lim

138
Citations
Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction.

Hongyu Tang;Hongyu Tang;Yutao Li;Robert Sokolovskij;Robert Sokolovskij;Leandro Sacco

128
Citations
Convective heat transfer characteristics of China RP-3 aviation kerosene at supercritical pressure

Xunfeng Li;Xiulan Huai;Jun Cai;Fengquan Zhong

127
Citations
An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling

V. Vasudevan;Xuejun Fan

122
Citations
Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

Xuejun Fan;G.Q. Zhang;W.D. van Driel;L.J. Ernst

118
Citations
PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers

Bo Sun;Xuejun Fan;Cheng Qian;Guoqi Zhang

113
Citations
Moisture Sensitivity of Plastic Packages of IC Devices

X.J. Fan;E. Suhir

112
Citations
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds

Mark D. Placette;Xuejun Fan;Jie-Hua Zhao;Darvin Edwards

103
Citations
Solid State Lighting Reliability

W.D. van Driel;X.J. Fan

102
Citations
Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages

Xuejun Fan;Min Pei;P.K. Bhatti

98
Citations
Mechanics of moisture for polymers: Fundamental concepts and model study

Xuejun Fan

92
Citations
A Micromechanics-Based Vapor Pressure Model in Electronic Packages

X. J. Fan;J. Zhou;G. Q. Zhang;L. J. Ernst

91
Citations
Effects of Dwell Time and Ramp Rate on Lead-Free Solder Joints in FCBGA Packages

Xuejun Fan;G. Raiser;V.S. Vasudevan

88
Citations
High Selective Gas Detection for small molecules based on Germanium selenide monolayer

Lian Liu;Qun Yang;Zeping Wang;Huaiyu Ye;Huaiyu Ye

85
Citations
Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

B. Xie;X. J. Fan;X. Q. Shi;H. Ding

84
Citations