World's Best Scientists 2026 revealed!

D-Index & Metrics

Engineering and Technology

D-Index
47
Citations
7852
World Ranking
4918
National Ranking
1410

Xuejun Fan publication distribution in Engineering and Technology in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where Xuejun Fan sits on this spectrum.

38–47 publications: 20 scientists 48–57 publications: 35 scientists 58–67 publications: 96 scientists 68–77 publications: 135 scientists 78–87 publications: 190 scientists 88–97 publications: 259 scientists 98–107 publications: 283 scientists 108–117 publications: 369 scientists 118–127 publications: 341 scientists 128–137 publications: 386 scientists 138–147 publications: 372 scientists 148–157 publications: 457 scientists 158–167 publications: 415 scientists 168–177 publications: 407 scientists 178–187 publications: 421 scientists 188–197 publications: 378 scientists 198–207 publications: 403 scientists 208–217 publications: 317 scientists 218–227 publications: 346 scientists 228–237 publications: 321 scientists 238–247 publications: 260 scientists 248–257 publications: 280 scientists 258–267 publications: 240 scientists 268–277 publications: 214 scientists 278–287 publications: 242 scientists 288–297 publications: 203 scientists 298–307 publications: 166 scientists 308–317 publications: 154 scientists 318–327 publications: 175 scientists 328–337 publications: 159 scientists 338–347 publications: 99 scientists 348–357 publications: 131 scientists 358–367 publications: 106 scientists 368–377 publications: 118 scientists 378–387 publications: 97 scientists 388–397 publications: 108 scientists 398–407 publications: 82 scientists 408–417 publications: 71 scientists 418–427 publications: 64 scientists 428–437 publications: 55 scientists 438–447 publications: 54 scientists 448–457 publications: 60 scientists 458–467 publications: 47 scientists 468–477 publications: 40 scientists 478–487 publications: 30 scientists 488–497 publications: 29 scientists 498–507 publications: 38 scientists 508–517 publications: 40 scientists 518–527 publications: 32 scientists 528–537 publications: 23 scientists 538–547 publications: 28 scientists 548–557 publications: 23 scientists 558–567 publications: 19 scientists 568–577 publications: 16 scientists 578–587 publications: 17 scientists 588–597 publications: 18 scientists 598–607 publications: 22 scientists 608–617 publications: 15 scientists 618–627 publications: 9 scientists 628–637 publications: 11 scientists 638–647 publications: 21 scientists 648–657 publications: 12 scientists 658–667 publications: 9 scientists 668–677 publications: 11 scientists 678–687 publications: 9 scientists 688–697 publications: 6 scientists 698–707 publications: 14 scientists 708–717 publications: 7 scientists 718–727 publications: 8 scientists 728–737 publications: 10 scientists 738–747 publications: 9 scientists 748–757 publications: 5 scientists 758–767 publications: 5 scientists 768–777 publications: 11 scientists 778–787 publications: 7 scientists 788–797 publications: 2 scientists 798–803 publications: 4 scientists 804+ publications: 100 scientists
38 publications 804+

This scientist: 308 publications — 77th percentile

77% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 804 publications or more.

Xuejun Fan D-index placement in Engineering and Technology in 2026

The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where Xuejun Fan sits on this spectrum.

30 D-Index: 59 scientists 31 D-Index: 114 scientists 32 D-Index: 129 scientists 33 D-Index: 189 scientists 34 D-Index: 200 scientists 35 D-Index: 262 scientists 36 D-Index: 311 scientists 37 D-Index: 312 scientists 38 D-Index: 350 scientists 39 D-Index: 385 scientists 40 D-Index: 348 scientists 41 D-Index: 362 scientists 42 D-Index: 426 scientists 43 D-Index: 380 scientists 44 D-Index: 310 scientists 45 D-Index: 341 scientists 46 D-Index: 301 scientists 47 D-Index: 306 scientists 48 D-Index: 271 scientists 49 D-Index: 246 scientists 50 D-Index: 210 scientists 51 D-Index: 253 scientists 52 D-Index: 213 scientists 53 D-Index: 221 scientists 54 D-Index: 195 scientists 55 D-Index: 186 scientists 56 D-Index: 170 scientists 57 D-Index: 167 scientists 58 D-Index: 166 scientists 59 D-Index: 144 scientists 60 D-Index: 152 scientists 61 D-Index: 141 scientists 62 D-Index: 138 scientists 63 D-Index: 131 scientists 64 D-Index: 118 scientists 65 D-Index: 114 scientists 66 D-Index: 119 scientists 67 D-Index: 95 scientists 68 D-Index: 87 scientists 69 D-Index: 77 scientists 70 D-Index: 89 scientists 71 D-Index: 69 scientists 72 D-Index: 54 scientists 73 D-Index: 46 scientists 74 D-Index: 55 scientists 75 D-Index: 54 scientists 76 D-Index: 49 scientists 77 D-Index: 53 scientists 78 D-Index: 46 scientists 79 D-Index: 28 scientists 80 D-Index: 39 scientists 81 D-Index: 36 scientists 82 D-Index: 24 scientists 83 D-Index: 26 scientists 84 D-Index: 36 scientists 85 D-Index: 18 scientists 86 D-Index: 25 scientists 87 D-Index: 19 scientists 88 D-Index: 26 scientists 89 D-Index: 27 scientists 90 D-Index: 23 scientists 91 D-Index: 15 scientists 92 D-Index: 12 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 13 scientists 97 D-Index: 13 scientists 98 D-Index: 9 scientists 99 D-Index: 7 scientists 100 D-Index: 7 scientists 101 D-Index: 8 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 9 scientists 105 D-Index: 6 scientists 106 D-Index: 9 scientists 107+ D-Index: 99 scientists
30 D-Index 107+

This scientist: 47 D-Index — 52nd percentile

52% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 107 D-Index or more.

Overview

Xuejun Fan is affiliated with Lamar University in the United States and contributes extensively to engineering research, specifically within electrical and electronic engineering as well as mechanical engineering. Their scholarly output encompasses 142 publications across various intersecting disciplines.

Their research spans multiple subfields including:

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Materials Chemistry
  • Mechanics of Materials
  • Computational Mechanics

Xuejun Fan's work covers specific topics such as:

  • Electronic Packaging and Soldering Technologies
  • Aluminum Alloys Composites Properties
  • Silicon Carbide Semiconductor Technologies
  • GaN-based semiconductor devices and materials
  • Metal and Thin Film Mechanics
  • Copper Interconnects and Reliability
  • Combustion and flame dynamics

The scientist has collaborated frequently with peers such as Guoqi Zhang, Jiajie Fan, Dong Hu, Zhen Cui, and Hongyu Tang.

Key publication venues for Xuejun Fan include:

  • Microelectronics Reliability
  • Laser & Photonics Review
  • Materials & Design
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • Applied Surface Science

Representative recent publications by Xuejun Fan are as follows:

  • Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives (2020), Journal of Materials Chemistry A
  • Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light-Emitting Diodes (2020), Laser & Photonics Review
  • Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study (2020), Results in Physics
  • Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network (2020), IEEE Electron Device Letters
  • Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm2 Heat Dissipation (2020), IEEE Transactions on Power Electronics

Best Publications

  • A review of small heat pipes for electronics

    Xianping Chen;Xianping Chen;Huaiyu Ye;Xuejun Fan;Tianling Ren

  • Mechanics of Microelectronics

    G. Q. Zhang;W. D. Van Driel;X. J. Fan

  • Experimental investigations and model study of moisture behaviors in polymeric materials

    X.J. Fan;X.J. Fan;S.W.R. Lee;Q. Han

  • Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives

    Hongyu Tang;Leandro Nicolas Sacco;Sten Vollebregt;Huaiyu Ye

  • Solid State Lighting Reliability Part 2

    Willem Dirk van Driel;Xuejun Fan;Guo Qi Zhang

  • Design and optimization of thermo-mechanical reliability in wafer level packaging

    X.J. Fan;X.J. Fan;B. Varia;Q. Han

  • Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

    X.-J. Fan;H.B. Wang;T.B. Lim

  • Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction.

    Hongyu Tang;Hongyu Tang;Yutao Li;Robert Sokolovskij;Robert Sokolovskij;Leandro Sacco

  • Convective heat transfer characteristics of China RP-3 aviation kerosene at supercritical pressure

    Xunfeng Li;Xiulan Huai;Jun Cai;Fengquan Zhong

  • An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling

    V. Vasudevan;Xuejun Fan

  • Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

    Xuejun Fan;G.Q. Zhang;W.D. van Driel;L.J. Ernst

  • PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers

    Bo Sun;Xuejun Fan;Cheng Qian;Guoqi Zhang

  • Moisture Sensitivity of Plastic Packages of IC Devices

    X.J. Fan;E. Suhir

  • Dual stage modeling of moisture absorption and desorption in epoxy mold compounds

    Mark D. Placette;Xuejun Fan;Jie-Hua Zhao;Darvin Edwards

  • Solid State Lighting Reliability

    W.D. van Driel;X.J. Fan

  • Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages

    Xuejun Fan;Min Pei;P.K. Bhatti

  • Mechanics of moisture for polymers: Fundamental concepts and model study

    Xuejun Fan

  • A Micromechanics-Based Vapor Pressure Model in Electronic Packages

    X. J. Fan;J. Zhou;G. Q. Zhang;L. J. Ernst

  • Effects of Dwell Time and Ramp Rate on Lead-Free Solder Joints in FCBGA Packages

    Xuejun Fan;G. Raiser;V.S. Vasudevan

  • High Selective Gas Detection for small molecules based on Germanium selenide monolayer

    Lian Liu;Qun Yang;Zeping Wang;Huaiyu Ye;Huaiyu Ye

  • Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

    B. Xie;X. J. Fan;X. Q. Shi;H. Ding

Frequent Co-Authors

Guoqi Zhang
Guoqi Zhang Delft University of Technology
Michael Pecht
Michael Pecht University of Maryland, College Park
Tian-Ling Ren
Tian-Ling Ren Tsinghua University
Yutao Li
Yutao Li Chinese Academy of Sciences
Erik Schlangen
Erik Schlangen Delft University of Technology
Zhi-Yi Hu
Zhi-Yi Hu Wuhan University of Technology
Signe Kjelstrup
Signe Kjelstrup Norwegian University of Science and Technology
Hongyu Yu
Hongyu Yu Southern University of Science and Technology
Abhijit Chandra
Abhijit Chandra Jadavpur University
He Tian
He Tian East China University of Science and Technology

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