What is he best known for?
The fields of study he is best known for:
- Composite material
- Thermodynamics
- Mechanical engineering
His main research concerns Composite material, Moisture, Structural engineering, Temperature cycling and Soldering.
Porosity, Viscoelasticity, Material properties, Flip chip and Thermosetting polymer are subfields of Composite material in which his conducts study.
His Porosity research integrates issues from Glass transition and Water content.
His Moisture study combines topics in areas such as Polymer, Sensitivity, Volume fraction, Vapor pressure and Diffusion.
His research in Structural engineering is mostly concerned with Finite element method.
His research integrates issues of Ball and Wafer, Wafer-level packaging in his study of Soldering.
His most cited work include:
- Mechanics of Microelectronics (120 citations)
- A review of small heat pipes for electronics (109 citations)
- Experimental investigations and model study of moisture behaviors in polymeric materials (109 citations)
What are the main themes of his work throughout his whole career to date?
His primary areas of study are Composite material, Light-emitting diode, Moisture, Finite element method and Electronic engineering.
He combines topics linked to Die with his work on Composite material.
His Light-emitting diode research incorporates elements of Diode, Luminous flux, Phosphor and LED lamp.
As a part of the same scientific family, he mostly works in the field of Moisture, focusing on Desorption and, on occasion, Fick's laws of diffusion.
His Finite element method study is related to the wider topic of Structural engineering.
In his study, which falls under the umbrella issue of Soldering, Ball is strongly linked to Wafer-level packaging.
He most often published in these fields:
- Composite material (33.85%)
- Light-emitting diode (20.77%)
- Moisture (18.46%)
What were the highlights of his more recent work (between 2018-2021)?
- Composite material (33.85%)
- Optoelectronics (14.23%)
- Light-emitting diode (20.77%)
In recent papers he was focusing on the following fields of study:
Xuejun Fan spends much of his time researching Composite material, Optoelectronics, Light-emitting diode, Phosphor and Diode.
His research links Copper with Composite material.
His work carried out in the field of Optoelectronics brings together such families of science as Thin-film transistor, Prognostics, Humidity, Relative humidity and Reliability.
The Light-emitting diode study combines topics in areas such as Material Degradation, Spectral power distribution, Thermal and Optical materials.
His work in Phosphor tackles topics such as Composite number which are related to areas like Silicone, Ultimate tensile strength and Coating.
His studies in Moisture integrate themes in fields like Fourier transform infrared spectroscopy, Thermal expansion, Thermal diffusivity and Swelling.
Between 2018 and 2021, his most popular works were:
- Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction. (24 citations)
- Computational realization of multiple flame stabilization modes in DLR strut-injection hydrogen supersonic combustor (19 citations)
- Degradation of optical materials in solid-state lighting systems (16 citations)
In his most recent research, the most cited papers focused on:
- Composite material
- Thermodynamics
- Mechanical engineering
His primary areas of investigation include Optoelectronics, Light-emitting diode, Composite material, Phosphor and Sintering.
His work on Solid-state lighting as part of general Optoelectronics research is often related to Chemical substance and Imagination, thus linking different fields of science.
In his study, Die, Junction temperature, Luminous flux, Luminous efficacy and Reliability is strongly linked to Spectral power distribution, which falls under the umbrella field of Light-emitting diode.
His research in Composite material intersects with topics in Finite element method and Chip.
Xuejun Fan has researched Phosphor in several fields, including Laser diode, Drop and Light emission.
The study incorporates disciplines such as Soldering, Strain rate, Joint, Modulus and Power module in addition to Sintering.
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