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Overview

Changqing Liu is affiliated with Loughborough University in the United Kingdom, focusing primarily on engineering disciplines. Their research spans several subfields including Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Mechanics of Materials, and Automotive Engineering.

The main topics of Liu's work include:

  • Electronic Packaging and Soldering Technologies
  • Aluminum Alloys Composites Properties
  • 3D IC and TSV technologies
  • Intermetallics and Advanced Alloy Properties
  • Aluminum Alloy Microstructure Properties
  • Advanced Welding Techniques Analysis
  • Copper Interconnects and Reliability

Liu has contributed to multiple publication venues, with frequent appearances in:

  • Microelectronics Reliability
  • SSRN Electronic Journal
  • Journal of Manufacturing Processes
  • Materials Today Communications
  • Journal of Electronic Materials

Some of the recent papers authored by Liu include:

  • "Statistical effects of pore features on mechanical properties and fracture behaviors of heterogeneous random porous materials by phase-field modeling," 2022, International Journal of Solids and Structures
  • "Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores," 2021, Computer Methods in Applied Mechanics and Engineering
  • "Physics-Informed Neural Networks With Weighted Losses by Uncertainty Evaluation for Accurate and Stable Prediction of Manufacturing Systems," 2023, IEEE Transactions on Neural Networks and Learning Systems
  • "Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics," 2021, Journal of Materials Processing Technology
  • "Adsorption of La3+ onto trifluoroacetic acid modified UiO-66-COOH: Adsorption mechanism and application," 2023, Materials Chemistry and Physics

Liu has collaborated extensively with several co-authors, including:

  • Zhaoxia Zhou
  • Canyu Liu
  • Shuibao Liang
  • Stuart Robertson
  • Han Jiang

Best Publications

  • An electrochemical impedance spectroscopy study of the corrosion behaviour of PVD coated steels in 0.5 N NaCl aqueous solution: Part II.: EIS interpretation of corrosion behaviour

    C. Liu;C. Liu;Q. Bi;A. Leyland;A. Matthews

  • An electrochemical impedance spectroscopy study of the corrosion behaviour of PVD coated steels in 0.5 N NaCl aqueous solution: Part I. Establishment of equivalent circuits for EIS data modelling

    C Liu;C Liu;Q Bi;A Leyland;A Matthews

  • Corrosion resistance of multi-layered plasma-assisted physical vapour deposition TiN and CrN coatings

    C Liu;C Liu;A Leyland;Q Bi;A Matthews

  • Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds

    H. Xu;C. Liu;V.V. Silberschmidt;S.S. Pramana

  • Tribological and electrochemical performance of PVD TiN coatings on the femoral head of Ti-6Al-4V artificial hip joints

    C Liu;C Liu;Q Bi;A Matthews

  • Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

    Jicheng Gong;Changqing Liu;Paul P. Conway;Vadim V. Silberschmidt

  • Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects

    Dezhi Li;Changqing Liu;Paul P. Conway

  • Optimization of inkjet printed PEDOT:PSS thin films through annealing processes

    Zhaoting Xiong;Changqing Liu

  • Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets

    Guang Chen;Guang Chen;Fengshun Wu;Changqing Liu;Vadim V. Silberschmidt

  • A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

    Hui Xu;Changqing Liu;Vadim V. Silberschmidt;S. S. Pramana

  • Direct-write techniques for maskless production of microelectronics: A review of current state-of-the-art technologies

    Yan Zhang;Changqing Liu;David Whalley

  • Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization

    Hui Xu;Changqing Liu;Vadim V. Silberschmidt;Zhong Chen

  • Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

    Guang Chen;Guang Chen;Hao Peng;Vadim V. Silberschmidt;Y.C. Chan

  • Dehydration of bacterial cellulose and the water content effects on its viscoelastic and electrochemical properties

    Ana M. Rodrigues Rebelo;Andrew J. Archer;Xiuli Chen;Changqing Liu

  • A micromechanism study of thermosonic gold wire bonding on aluminum pad

    Hui Xu;Changqing Liu;Vadim V. Silberschmidt;S. S. Pramana

  • Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation

    D.A. Hutt;C. Liu;P.P. Conway;D.C. Whalley

  • Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate

    Jicheng Gong;Changqing Liu;Paul P. Conway;Vadim V. Silberschmidt

  • Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

    J F Li;Samjid Mannan;Michael Clode;K Chen

  • Reliability issues in Pb-free solder joint miniaturization

    Zhiheng Huang;Paul P. Conway;Erik Jung;Rachel C. Thomson

  • Structure and corrosion properties of PVD Cr–N coatings

    C. Liu;C. Liu;Q. Bi;H. Ziegele;H. Ziegele;A. Leyland

Frequent Co-Authors

Vadim V. Silberschmidt
Vadim V. Silberschmidt Loughborough University
Zhong Chen
Zhong Chen Nanyang Technological University
Guang Yang
Guang Yang Huazhong University of Science and Technology
Timothy J. White
Timothy J. White University of Colorado Boulder
Allan Matthews
Allan Matthews University of Manchester
Y.C. Chan
Y.C. Chan City University of Hong Kong
Adrian Leyland
Adrian Leyland University of Sheffield
Jun Wei
Jun Wei Harbin Institute of Technology
Stuart Lyon
Stuart Lyon University of Manchester
Sheng Liu
Sheng Liu Wuhan University

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