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D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
34
Citations
7037
World Ranking
2776
National Ranking
963

Research.com Recognitions

  • 2013 - SPIE Fellow
  • 2010 - Fellow of the American Society of Mechanical Engineers
  • 2002 - Fellow of American Physical Society (APS) Citation For distinguished contributions to the field of analytical modeling of the physical behavior and reliability of microelectronic and photonic materials and systems
  • 1999 - Charles Russ Richards Memorial Award, The American Society of Mechanical Engineers
  • 1996 - IEEE Fellow For contributions to the application of mechanical and reliability engineering to physical design and analysis of microelectronic and fiber optic systems

Overview

Ephraim Suhir is affiliated with Portland State University in the United States. Their research spans multiple fields of engineering, with a focus on Electrical and Electronic Engineering, Statistics, Probability and Uncertainty, Social Psychology, Aerospace Engineering, and Automotive Engineering.

The main topics covered in their work include:

  • Human-Automation Interaction and Safety
  • Risk and Safety Analysis
  • Electronic Packaging and Soldering Technologies
  • Autonomous Vehicle Technology and Safety
  • Integrated Circuits and Semiconductor Failure Analysis
  • Probabilistic and Robust Engineering Design
  • Occupational Health and Safety Research

Frequent coauthors of Ephraim Suhir include Gunther Paul, Inna Bedny, Rajeev Gupta, Rajesh Singh, and Anita Gehlot.

Their recent papers reflect a broad range of applications and venues. Selected works include:

  • "Silicon photonics interfaced with microelectronics for integrated photonic quantum technologies: a new era in advanced quantum computers and quantum communications?", 2022, published in Nanoscale
  • "Remaining Useful Lifetime (RUL): Probabilistic Predictive Model", 2021, International Journal of Prognostics and Health Management
  • "Astronaut's performance vs. his/hers human-capacity-factor and state-of-health: Application of double-exponential-probability-distribution function", 2020, Acta Astronautica
  • "Landing on Mars: probabilistic modeling enables quantifying the last "six minutes of terror"", 2020, Acta Astronautica
  • "Predictive modeling sheds useful light on burn-in testing (BIT): Brief review and recent extension", 2021, Microelectronics Reliability

Publication venues where Ephraim Suhir has frequently contributed include Acta Astronautica, Journal of Space Safety Engineering, Theoretical Issues in Ergonomics Science, Journal of Aerospace Engineering and Mechanics, and Microelectronics Reliability.

Their professional recognitions include fellowships and awards such as:

  • SPIE Fellow (2013)
  • Fellow of the American Society of Mechanical Engineers (2010)
  • Fellow of American Physical Society (APS) (2002) for contributions to analytical modeling of physical behavior and reliability of microelectronic and photonic materials and systems
  • Charles Russ Richards Memorial Award from the American Society of Mechanical Engineers (1999)
  • IEEE Fellow (1996) for contributions to mechanical and reliability engineering in physical design and analysis of microelectronic and fiber optic systems

Best Publications

  • Stresses in Bi-Metal Thermostats

    Ephraim Suhir

  • Interfacial Stresses in Bimetal Thermostats

    E. Suhir

  • An approximate analysis of stresses in multilayered elastic thin films

    E. Suhir

  • Calculated thermally induced stresses in adhesively bonded and soldered assemblies.

    Suhir E

  • Thermal properties of carbon nanotube array used for integrated circuit cooling

    Yuan Xu;Yi Zhang;Ephraim Suhir;Xinwei Wang

  • Analysis of interfacial thermal stresses in a trimaterial assembly

    E. Suhir

  • Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging

    Ephraim Suhir;Yung-Cheng Lee;C. P. Wong

  • Moisture Sensitivity of Plastic Packages of IC Devices

    X.J. Fan;E. Suhir

  • Mechanical approach to the evaluation of the low temperature threshold of added transmission losses in single-coated optical fibers

    E. Suhir

  • Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

    E. Suhir

  • Structural Analysis in Microelectronic And Fiber Optic Systems

    Ephraim Suhir

  • Effect of initial curvature on low temperature microbending in optical fibers

    E. Suhir

  • Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic product

    E. Suhir

  • Thermally induced stresses in an optical glass fiber soldered into a ferrule

    E. Suhir

  • Predictive Analytical Thermal Stress Modeling in Electronics and Photonics

    E. Suhir

  • Could shock tests adequately mimic drop test conditions

    E. Suhir

  • Thermal stress in a polymer-coated optical glass fiber with a low-modulus coating at the ends

    E. Suhir

  • Stresses in Adhesively Bonded Bi-Material Assemblies Used in Electronic Packaging

    E. Suhir

  • Could electronics reliability be predicted, quantified and assured?

    Ephraim Suhir

  • On a Paradoxical Phenomenon Related to Beams on Elastic Foundation: Could External Compliant Leads Reduce the Strength of a Surface-Mounted Device?

    E. Suhir

  • Adhesively bonded assemblies with identical nondeformable adherends and ‘piecewise continuous’ adhesive layer: predicted thermal stresses in the adhesive

    E Suhir

  • Approximate evaluation of the elastic interfacial stresses in thin films with application to high-Tc superconducting ceramics

    E. Suhir

  • BOLTZMANN–ARRHENIUS–ZHURKOV (BAZ) MODEL IN PHYSICS-OF-MATERIALS PROBLEMS

    E. Suhir;S. M. Kang

  • Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?

    E. Suhir;Ali Shakouri

  • Solder-Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability

    E. Suhir;B. Poborets

  • The Future of Microelectronics and Photonics and the Role of Mechanics and Materials

    E. Suhir

  • Axisymmetric Elastic Deformations of a Finite Circular Cylinder With Application to Low Temperature Strains and Stresses in Solder Joints

    E. Suhir

  • Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical Techniques

    E. Suhir

  • Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

    M. Uschitsky;E. Suhir

Frequent Co-Authors

Ali Shakouri
Ali Shakouri Purdue University West Lafayette
Tongxi Yu
Tongxi Yu Hong Kong University of Science and Technology
Ilker S. Bayer
Ilker S. Bayer Italian Institute of Technology
Yung-Cheng Lee
Yung-Cheng Lee University of Colorado Boulder
Victor Birman
Victor Birman Missouri University of Science and Technology
Xuejun Fan
Xuejun Fan Lamar University
Xinwei Wang
Xinwei Wang Iowa State University
Sung-Mo Kang
Sung-Mo Kang University of California, Santa Cruz
D.K. Avasthi
D.K. Avasthi University of Petroleum and Energy Studies
Alexandru S. Biris
Alexandru S. Biris University of Arkansas at Little Rock

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