2013 - SPIE Fellow
2010 - Fellow of the American Society of Mechanical Engineers
2002 - Fellow of American Physical Society (APS) Citation For distinguished contributions to the field of analytical modeling of the physical behavior and reliability of microelectronic and photonic materials and systems
1999 - Charles Russ Richards Memorial Award, The American Society of Mechanical Engineers
1996 - IEEE Fellow For contributions to the application of mechanical and reliability engineering to physical design and analysis of microelectronic and fiber optic systems
Ephraim Suhir focuses on Composite material, Stress, Optical fiber, Thermal expansion and Microelectronics. His Composite material study frequently links to adjacent areas such as Thermal. His Stress research incorporates themes from Soldering, Bimetal, Integrated circuit, Thermostat and Thermoelastic damping.
His studies in Thermostat integrate themes in fields like Stress field, Mechanics, Interfacial stress and Shearing deformation. His research in Optical fiber intersects with topics in Fiber and Photonics, Optoelectronics. His Microelectronics research is multidisciplinary, incorporating perspectives in Telecommunications, Engineering ethics and Elongation.
His main research concerns Composite material, Stress, Optical fiber, Structural engineering and Reliability engineering. In his work, Adhesive is strongly intertwined with Thermal, which is a subfield of Composite material. His Stress research focuses on Bending and how it connects with Compression.
His work deals with themes such as Fiber, Glass fiber, Coating and Photonics, which intersect with Optical fiber. Ephraim Suhir works mostly in the field of Structural engineering, limiting it down to concerns involving Printed circuit board and, occasionally, Nonlinear system. His Reliability engineering research is multidisciplinary, incorporating elements of Probabilistic logic, Electronics and Aerospace.
Ephraim Suhir mainly focuses on Reliability engineering, Composite material, Soldering, Probabilistic logic and Stress. His Reliability engineering study integrates concerns from other disciplines, such as Electronics and Aerospace. In most of his Composite material studies, his work intersects topics such as Silicon.
Ephraim Suhir combines subjects such as Joint, Epoxy, Finite element method and Reliability with his study of Soldering. As a part of the same scientific study, Ephraim Suhir usually deals with the Probabilistic logic, concentrating on Predictive modelling and frequently concerns with Avionics. His Stress study combines topics in areas such as Mechanical engineering and Shearing.
Ephraim Suhir spends much of his time researching Composite material, Ball grid array, Reliability engineering, Soldering and Forensic engineering. Ephraim Suhir combines Composite material and Arrhenius equation in his studies. His work carried out in the field of Ball grid array brings together such families of science as Grid, Beam and Stress.
His Reliability engineering study incorporates themes from Probabilistic logic, Electronics and Aerospace. In his research on the topic of Soldering, Stress relief and Epoxy is strongly related with Low modulus. His Forensic engineering study combines topics from a wide range of disciplines, such as Thermal, Temperature cycling and Interfacial stress.
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Stresses in Bi-Metal Thermostats
Ephraim Suhir.
Journal of Applied Mechanics (1986)
New approach to the high quality epitaxial growth of lattice‐mismatched materials
Serge Luryi;Ephraim Suhir.
Applied Physics Letters (1986)
Interfacial Stresses in Bimetal Thermostats
E. Suhir.
Journal of Applied Mechanics (1989)
An approximate analysis of stresses in multilayered elastic thin films
E. Suhir.
Journal of Applied Mechanics (1988)
Applied Probability for Engineers and Scientists
Ephraim Suhir;Anthony J. Rafanelli.
Journal of Electronic Packaging (1997)
Calculated thermally induced stresses in adhesively bonded and soldered assemblies.
Suhir E.
Proceedings of the International Symposium on Microelectronics (1986)
Thermal properties of carbon nanotube array used for integrated circuit cooling
Yuan Xu;Yi Zhang;Ephraim Suhir;Xinwei Wang.
Journal of Applied Physics (2006)
Analysis of interfacial thermal stresses in a trimaterial assembly
E. Suhir.
Journal of Applied Physics (2001)
Mechanical approach to the evaluation of the low temperature threshold of added transmission losses in single-coated optical fibers
E. Suhir.
Journal of Lightwave Technology (1990)
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Ephraim Suhir;Yung-Cheng Lee;C. P. Wong.
moem (2007)
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