World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
53
Citations
8171
World Ranking
1025
National Ranking
422

Research.com Recognitions

  • 2002 - Fellow of the American Society of Mechanical Engineers

Overview

Yung-Cheng Lee is affiliated with the University of Colorado Boulder in the United States. Their academic profile includes a recognized fellowship awarded by a professional organization in mechanical engineering, highlighting a notable engagement in this field.

Their award includes:

  • Fellow of the American Society of Mechanical Engineers, 2002

No recent papers, co-authors, publication venues, book publications, or detailed fields of study and specific topics have been listed. Therefore, the scope of their research topics and contributions cannot be further elaborated.

Best Publications

  • Al2O3 and TiO2 atomic layer deposition on copper for water corrosion resistance.

    A. I. Abdulagatov;Y. Yan;J. R. Cooper;Y. Zhang

  • Three-Dimensional Ni/TiO2 Nanowire Network for High Areal Capacity Lithium Ion Microbattery Applications

    Wei Wang;Miao Tian;Aziz Abdulagatov;Steven M. George

  • Three-Dimensional Superhydrophobic Nanowire Networks for Enhancing Condensation Heat Transfer

    Rongfu Wen;Shanshan Xu;Xuehu Ma;Yung-Cheng Lee

  • Enhanced bubble nucleation and liquid rewetting for highly efficient boiling heat transfer on two-level hierarchical surfaces with patterned copper nanowire arrays

    Rongfu Wen;Qian Li;Wei Wang;Wei Wang;Benoit Latour

  • Liquid-Vapor Phase-Change Heat Transfer on Functionalized Nanowired Surfaces and Beyond

    Rongfu Wen;Rongfu Wen;Xuehu Ma;Yung-Cheng Lee;Ronggui Yang;Ronggui Yang

  • Particle dynamics and particle heat and mass transfer in thermal plasmas. Part I. The motion of a single particle without thermal effects

    E. Pfender;Y. C. Lee

  • Particle Dynamics and Particle Heat and Mass Transfer in Thermal Plasmas. Part II. Particle Heat and Mass Transfer in Thermal Plasmas

    Y. C. Lee;Y. P. Chyou;E. Pfender

  • Atomic layer deposited protective coatings for micro-electromechanical systems

    Nils D. Hoivik;Jeffrey W. Elam;Ryan J. Linderman;Victor M. Bright

  • Capillary-driven liquid film boiling heat transfer on hybrid mesh wicking structures

    Rongfu Wen;Rongfu Wen;Shanshan Xu;Yung-Cheng Lee;Ronggui Yang;Ronggui Yang

  • Solder self-assembly for three-dimensional microelectromechanical systems

    Kevin F. Harsh;Victor M. Bright;Y.C. Lee

  • Hierarchical Superhydrophobic Surfaces with Micropatterned Nanowire Arrays for High-Efficiency Jumping Droplet Condensation.

    Rongfu Wen;Shanshan Xu;Dongliang Zhao;Yung-Cheng Lee

  • RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill

    Zhiping Feng;Wenge Zhang;Bingzhi Su;K.C. Gupta

  • The Mechanical Robustness of Atomic-Layer- and Molecular-Layer-Deposited Coatings on Polymer Substrates

    David C. Miller;Ross R. Foster;Yadong Zhang;Shih-Hui Jen

  • Optical beam steering using MEMS-controllable microlens array

    Adisorn Tuantranont;V.M. Bright;J. Zhang;W. Zhang

  • The Development of Polymer-Based Flat Heat Pipes

    C Oshman;Bo Shi;Chen Li;Ronggui Yang

  • Flat flexible polymer heat pipes

    Christopher Oshman;Qian Li;Li-Anne Liew;Ronggui Yang

  • Micromembrane-enhanced capillary evaporation

    Xianming Dai;Fanghao Yang;Ronggui Yang;Yung-Cheng Lee

  • Ultralow Thermal Conductivity of Atomic/Molecular Layer-Deposited Hybrid Organic–Inorganic Zincone Thin Films

    Jun Liu;Byunghoon Yoon;Eli Kuhlmann;Miao Tian

  • Design and modeling of RF MEMS tunable capacitors using electro-thermal actuators

    Zhiping Feng;Wenge Zhang;Bingzhi Su;K.F. Harsh

  • Thermo-Mechanical Properties of Alumina Films Created Using the Atomic Layer Deposition Technique

    David C. Miller;Ross R. Foster;Shih-Hui Jen;Jacob A. Bertrand

  • Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging

    Ephraim Suhir;Yung-Cheng Lee;C. P. Wong

Frequent Co-Authors

Victor M. Bright
Victor M. Bright University of Colorado Boulder
Ronggui Yang
Ronggui Yang Peking University
Steven M. George
Steven M. George University of Colorado Boulder
Adisorn Tuantranont
Adisorn Tuantranont National Science and Technology Development Agency
Martin L. Dunn
Martin L. Dunn University of Colorado Denver
Marcia L. Huber
Marcia L. Huber National Institute of Standards and Technology
Kristina M. Johnson
Kristina M. Johnson The Ohio State University
Xuehu Ma
Xuehu Ma Dalian University of Technology
Emil Pfender
Emil Pfender University of Minnesota
Douglas C. Rees
Douglas C. Rees California Institute of Technology

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