2002 - Fellow of the American Society of Mechanical Engineers
His primary areas of study are Optoelectronics, Atomic layer deposition, Flip chip, Microelectromechanical systems and Soldering. His work carried out in the field of Optoelectronics brings together such families of science as Microlens and Beam steering. His Atomic layer deposition research is multidisciplinary, incorporating perspectives in Electroplating, Conformal film and Copper.
His research integrates issues of Electronic engineering, CMOS, Electrical engineering and Microelectronics in his study of Flip chip. In Microelectromechanical systems, Yung-Cheng Lee works on issues like Capacitor, which are connected to Silicon. Yung-Cheng Lee has researched Soldering in several fields, including Mechanical engineering and Joint.
Yung-Cheng Lee mainly investigates Microelectromechanical systems, Optoelectronics, Soldering, Composite material and Flip chip. He usually deals with Microelectromechanical systems and limits it to topics linked to Electrical engineering and Capacitance. The concepts of his Optoelectronics study are interwoven with issues in Vertical-cavity surface-emitting laser, Laser, Optics and Thermal.
His Soldering research incorporates themes from Mechanical engineering, Electronic packaging, Joint and Integrated circuit packaging. His study in Composite material is interdisciplinary in nature, drawing from both Structural engineering and Heat pipe. His Flip chip study deals with Wire bonding intersecting with Ultrasonic sensor.
Yung-Cheng Lee focuses on Composite material, Nanotechnology, Thermal, Refrigerant and Nanowire. His Composite material research is multidisciplinary, relying on both Thermal resistance and Heat pipe. Much of his study explores Thermal relationship to Mechanical engineering.
His Nanowire research includes elements of Wetting, Condensation, Nanowire battery and Nucleation. The study incorporates disciplines such as Flexible electronics, Lithium-ion battery, Anode and Polymer in addition to Atomic layer deposition. The Microelectromechanical systems study combines topics in areas such as Actuator and Silicon.
The scientist’s investigation covers issues in Nanowire, Nanotechnology, Composite material, Heat transfer and Atomic layer deposition. His studies examine the connections between Nanowire and genetics, as well as such issues in Nucleation, with regards to Work and Chemical engineering. The various areas that Yung-Cheng Lee examines in his Nanotechnology study include Wetting and Nanowire battery.
His research integrates issues of Nanoscale Science, Silicon and Microelectromechanical systems in his study of Nanowire battery. His studies deal with areas such as Thermal transmittance, Thermal resistance, Evaporation and Heat pipe as well as Composite material. His Atomic layer deposition research is multidisciplinary, incorporating perspectives in Lithium-ion battery and Anode.
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Al2O3 and TiO2 atomic layer deposition on copper for water corrosion resistance.
A. I. Abdulagatov;Y. Yan;J. R. Cooper;Y. Zhang.
ACS Applied Materials & Interfaces (2011)
Three-Dimensional Ni/TiO2 Nanowire Network for High Areal Capacity Lithium Ion Microbattery Applications
Wei Wang;Miao Tian;Aziz Abdulagatov;Steven M. George.
Nano Letters (2012)
Particle dynamics and particle heat and mass transfer in thermal plasmas. Part I. The motion of a single particle without thermal effects
E. Pfender;Y. C. Lee.
Plasma Chemistry and Plasma Processing (1985)
Particle Dynamics and Particle Heat and Mass Transfer in Thermal Plasmas. Part II. Particle Heat and Mass Transfer in Thermal Plasmas
Y. C. Lee;Y. P. Chyou;E. Pfender.
Plasma Chemistry and Plasma Processing (1985)
Atomic layer deposited protective coatings for micro-electromechanical systems
Nils D. Hoivik;Jeffrey W. Elam;Ryan J. Linderman;Victor M. Bright.
Sensors and Actuators A-physical (2003)
Solder self-assembly for three-dimensional microelectromechanical systems
Kevin F. Harsh;Victor M. Bright;Y.C. Lee.
Sensors and Actuators A-physical (1999)
Three-Dimensional Superhydrophobic Nanowire Networks for Enhancing Condensation Heat Transfer
Rongfu Wen;Shanshan Xu;Xuehu Ma;Yung-Cheng Lee.
RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill
Zhiping Feng;Wenge Zhang;Bingzhi Su;K.C. Gupta.
international microwave symposium (1998)
The Mechanical Robustness of Atomic-Layer- and Molecular-Layer-Deposited Coatings on Polymer Substrates
David C. Miller;Ross R. Foster;Yadong Zhang;Shih-Hui Jen.
Journal of Applied Physics (2009)
Optical beam steering using MEMS-controllable microlens array
Adisorn Tuantranont;V.M. Bright;J. Zhang;W. Zhang.
Sensors and Actuators A-physical (2001)
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