His research combines KEGG and Transcriptome. His KEGG study often links to related topics such as Transcriptome. In his papers, he integrates diverse fields, such as Bioinformatics and Microarray. His work often combines Microarray and Bioinformatics studies. He applies his multidisciplinary studies on Gene expression and Histone in his research. He undertakes multidisciplinary studies into Histone and Gene expression in his work. John H. L. Pang performs multidisciplinary study in the fields of Genetics and Computational biology via his papers. John H. L. Pang conducted interdisciplinary study in his works that combined Computational biology and Gene. In his works, he conducts interdisciplinary research on Gene and Immunohistochemistry.
This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.
Study of optimal subset size in digital image correlation of speckle pattern images
Sun Yaofeng;John H.L. Pang.
Optics and Lasers in Engineering (2007)
Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength
John H.L. Pang;T.H. Low;B.S. Xiong;Xu Luhua.
Thin Solid Films (2004)
Finite element formulation for a digital image correlation method
Yaofeng Sun;John H L Pang;Chee Khuen Wong;Fei Su.
Applied Optics (2005)
A review of recent works on inclusions
Kun Zhou;Hsin Jen Hoh;Xu Wang;Leon M. Keer.
Mechanics of Materials (2013)
Drop impact reliability testing for lead-free and lead-based soldered IC packages
Desmond Y.R. Chong;F.X. Che;John H.L. Pang;Kellin Ng.
Microelectronics Reliability (2006)
Thermal cycling analysis of flip-chip solder joint reliability
J.H.L. Pang;D.Y.R. Chong;T.H. Low.
IEEE Transactions on Components and Packaging Technologies (2001)
Dependence of elastic and optical properties on surface terminated groups in two-dimensional MXene monolayers: a first-principles study
Yuelei Bai;Yuelei Bai;Kun Zhou;Narasimalu Srikanth;John H. L. Pang.
RSC Advances (2016)
Electromigration induced ductile-to-brittle transition in lead-free solder joints
Fei Ren;Jae-Woong Nah;K. N. Tu;Bingshou Xiong.
Applied Physics Letters (2006)
Low cycle fatigue models for lead-free solders
John H.L. Pang;B.S. Xiong;T.H. Low.
Thin Solid Films (2004)
Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
John H. L. Pang;Luhua Xu;X. Q. Shi;W. Zhou.
Journal of Electronic Materials (2004)
If you think any of the details on this page are incorrect, let us know.
We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below: