World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
44
Citations
7021
World Ranking
1638
National Ranking
27

Best Publications

  • Study of optimal subset size in digital image correlation of speckle pattern images

    Sun Yaofeng;John H.L. Pang

  • Dependence of elastic and optical properties on surface terminated groups in two-dimensional MXene monolayers: a first-principles study

    Yuelei Bai;Yuelei Bai;Kun Zhou;Narasimalu Srikanth;John H. L. Pang

  • Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength

    John H.L. Pang;T.H. Low;B.S. Xiong;Xu Luhua

  • Finite element formulation for a digital image correlation method

    Yaofeng Sun;John H L Pang;Chee Khuen Wong;Fei Su

  • A review of recent works on inclusions

    Kun Zhou;Hsin Jen Hoh;Xu Wang;Leon M. Keer

  • Drop impact reliability testing for lead-free and lead-based soldered IC packages

    Desmond Y.R. Chong;F.X. Che;John H.L. Pang;Kellin Ng

  • Thermal cycling analysis of flip-chip solder joint reliability

    J.H.L. Pang;D.Y.R. Chong;T.H. Low

  • Thermo-mechanical model for simulating laser cladding induced residual stresses with single and multiple clad beads

    Youxiang Chew;John Hock Lye Pang;Guijun Bi;Bin Song

  • Low cycle fatigue models for lead-free solders

    John H.L. Pang;B.S. Xiong;T.H. Low

  • Electromigration induced ductile-to-brittle transition in lead-free solder joints

    Fei Ren;Jae-Woong Nah;K. N. Tu;Bingshou Xiong

  • Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints

    John H. L. Pang;Luhua Xu;X. Q. Shi;W. Zhou

  • Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

    Faxing Che;John Hock Lye Pang

  • Vibration reliability test and finite element analysis for flip chip solder joints.

    F.X. Che;John H.L. Pang

  • Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

    Luhua Xu;John H. L. Pang;Faxing Che

  • Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder

    J.H.L. Pang;B.S. Xiong;T.H. Low

  • Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

    J.H.L. Pang;D.Y.R. Chong

  • Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface

    Luhua Xu;J.H.L. Pang;K.H. Prakash;T.H. Low

  • Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging

    Luhua Xu;John H.L. Pang

  • Mechanical Properties for 95.5Sn–3.8Ag–0.7Cu Lead-Free Solder Alloy

    J.H.L. Pang;B.S. Xiong

  • Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

    Luhua Xu;Pradeep Dixit;Jianmin Miao;John H L Pang

  • Low cycle fatigue study of lead free 99.3Sn–0.7Cu solder alloy

    John H.L. Pang;B.S. Xiong;T.H. Low

  • Characterisation of porosity, density, and microstructure of directed energy deposited stainless steel AISI 316L

    Zhi’En Eddie Tan;John Hock Lye Pang;Jacek Kaminski;Helene Pepin

Frequent Co-Authors

Gengzhi Sun
Gengzhi Sun Nanjing Tech University
Lianxi Zheng
Lianxi Zheng Khalifa University
King-Ning Tu
King-Ning Tu City University of Hong Kong
Jianmin Miao
Jianmin Miao Shanghai Jiao Tong University
Kun Zhou
Kun Zhou Nanyang Technological University
Jinyuan Zhou
Jinyuan Zhou Lanzhou University
Anand Asundi
Anand Asundi d'Optron Pte
Swee Chuan Tjin
Swee Chuan Tjin Nanyang Technological University
Bahgat Sammakia
Bahgat Sammakia Binghamton University
John H. Lau
John H. Lau ASM International

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