World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
44
Citations
7021
World Ranking
1639
National Ranking
27

John Hock Lye Pang publication distribution in Mechanical and Aerospace Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where John Hock Lye Pang sits on this spectrum.

47–56 publications: 10 scientists 57–66 publications: 23 scientists 67–76 publications: 32 scientists 77–86 publications: 62 scientists 87–96 publications: 67 scientists 97–106 publications: 91 scientists 107–116 publications: 113 scientists 117–126 publications: 115 scientists 127–136 publications: 130 scientists 137–146 publications: 140 scientists 147–156 publications: 155 scientists 157–166 publications: 132 scientists 167–176 publications: 133 scientists 177–186 publications: 130 scientists 187–196 publications: 140 scientists 197–206 publications: 115 scientists 207–216 publications: 125 scientists 217–226 publications: 117 scientists 227–236 publications: 99 scientists 237–246 publications: 92 scientists 247–256 publications: 100 scientists 257–266 publications: 95 scientists 267–276 publications: 88 scientists 277–286 publications: 77 scientists 287–296 publications: 74 scientists 297–306 publications: 74 scientists 307–316 publications: 62 scientists 317–326 publications: 70 scientists 327–336 publications: 59 scientists 337–346 publications: 58 scientists 347–356 publications: 45 scientists 357–366 publications: 44 scientists 367–376 publications: 36 scientists 377–386 publications: 41 scientists 387–396 publications: 32 scientists 397–406 publications: 23 scientists 407–416 publications: 28 scientists 417–426 publications: 27 scientists 427–436 publications: 25 scientists 437–446 publications: 23 scientists 447–456 publications: 23 scientists 457–466 publications: 20 scientists 467–476 publications: 12 scientists 477–486 publications: 24 scientists 487–496 publications: 18 scientists 497–506 publications: 12 scientists 507–516 publications: 13 scientists 517–526 publications: 21 scientists 527–536 publications: 12 scientists 537–546 publications: 8 scientists 547–556 publications: 16 scientists 557–566 publications: 3 scientists 567–576 publications: 11 scientists 577–586 publications: 6 scientists 587–596 publications: 5 scientists 597–606 publications: 6 scientists 607–616 publications: 7 scientists 617–626 publications: 7 scientists 627–636 publications: 10 scientists 637–646 publications: 4 scientists 647–656 publications: 3 scientists 657–658 publications: 2 scientists 659+ publications: 100 scientists
47 publications 659+

This scientist: 155 publications — 27th percentile

27% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 659 publications or more.

John Hock Lye Pang D-index placement in Mechanical and Aerospace Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where John Hock Lye Pang sits on this spectrum.

30 D-Index: 83 scientists 31 D-Index: 113 scientists 32 D-Index: 144 scientists 33 D-Index: 153 scientists 34 D-Index: 189 scientists 35 D-Index: 158 scientists 36 D-Index: 139 scientists 37 D-Index: 127 scientists 38 D-Index: 130 scientists 39 D-Index: 126 scientists 40 D-Index: 104 scientists 41 D-Index: 100 scientists 42 D-Index: 107 scientists 43 D-Index: 101 scientists 44 D-Index: 103 scientists 45 D-Index: 79 scientists 46 D-Index: 88 scientists 47 D-Index: 70 scientists 48 D-Index: 83 scientists 49 D-Index: 44 scientists 50 D-Index: 64 scientists 51 D-Index: 56 scientists 52 D-Index: 50 scientists 53 D-Index: 48 scientists 54 D-Index: 58 scientists 55 D-Index: 52 scientists 56 D-Index: 48 scientists 57 D-Index: 42 scientists 58 D-Index: 34 scientists 59 D-Index: 42 scientists 60 D-Index: 37 scientists 61 D-Index: 42 scientists 62 D-Index: 44 scientists 63 D-Index: 22 scientists 64 D-Index: 33 scientists 65 D-Index: 29 scientists 66 D-Index: 23 scientists 67 D-Index: 29 scientists 68 D-Index: 24 scientists 69 D-Index: 19 scientists 70 D-Index: 34 scientists 71 D-Index: 26 scientists 72 D-Index: 19 scientists 73 D-Index: 18 scientists 74 D-Index: 19 scientists 75 D-Index: 14 scientists 76 D-Index: 19 scientists 77 D-Index: 8 scientists 78 D-Index: 18 scientists 79 D-Index: 16 scientists 80 D-Index: 12 scientists 81 D-Index: 17 scientists 82 D-Index: 11 scientists 83 D-Index: 16 scientists 84 D-Index: 7 scientists 85 D-Index: 9 scientists 86 D-Index: 8 scientists 87 D-Index: 6 scientists 88 D-Index: 6 scientists 89 D-Index: 7 scientists 90 D-Index: 10 scientists 91 D-Index: 4 scientists 92 D-Index: 4 scientists 93+ D-Index: 100 scientists
30 D-Index 93+

This scientist: 44 D-Index — 54th percentile

54% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 93 D-Index or more.

Best Publications

  • Study of optimal subset size in digital image correlation of speckle pattern images

    Sun Yaofeng;John H.L. Pang

  • Dependence of elastic and optical properties on surface terminated groups in two-dimensional MXene monolayers: a first-principles study

    Yuelei Bai;Yuelei Bai;Kun Zhou;Narasimalu Srikanth;John H. L. Pang

  • Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength

    John H.L. Pang;T.H. Low;B.S. Xiong;Xu Luhua

  • Finite element formulation for a digital image correlation method

    Yaofeng Sun;John H L Pang;Chee Khuen Wong;Fei Su

  • A review of recent works on inclusions

    Kun Zhou;Hsin Jen Hoh;Xu Wang;Leon M. Keer

  • Drop impact reliability testing for lead-free and lead-based soldered IC packages

    Desmond Y.R. Chong;F.X. Che;John H.L. Pang;Kellin Ng

  • Thermal cycling analysis of flip-chip solder joint reliability

    J.H.L. Pang;D.Y.R. Chong;T.H. Low

  • Thermo-mechanical model for simulating laser cladding induced residual stresses with single and multiple clad beads

    Youxiang Chew;John Hock Lye Pang;Guijun Bi;Bin Song

  • Low cycle fatigue models for lead-free solders

    John H.L. Pang;B.S. Xiong;T.H. Low

  • Electromigration induced ductile-to-brittle transition in lead-free solder joints

    Fei Ren;Jae-Woong Nah;K. N. Tu;Bingshou Xiong

  • Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints

    John H. L. Pang;Luhua Xu;X. Q. Shi;W. Zhou

  • Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

    Faxing Che;John Hock Lye Pang

  • Vibration reliability test and finite element analysis for flip chip solder joints.

    F.X. Che;John H.L. Pang

  • Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

    Luhua Xu;John H. L. Pang;Faxing Che

  • Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder

    J.H.L. Pang;B.S. Xiong;T.H. Low

  • Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

    J.H.L. Pang;D.Y.R. Chong

  • Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface

    Luhua Xu;J.H.L. Pang;K.H. Prakash;T.H. Low

  • Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging

    Luhua Xu;John H.L. Pang

  • Mechanical Properties for 95.5Sn–3.8Ag–0.7Cu Lead-Free Solder Alloy

    J.H.L. Pang;B.S. Xiong

  • Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

    Luhua Xu;Pradeep Dixit;Jianmin Miao;John H L Pang

  • Low cycle fatigue study of lead free 99.3Sn–0.7Cu solder alloy

    John H.L. Pang;B.S. Xiong;T.H. Low

  • Characterisation of porosity, density, and microstructure of directed energy deposited stainless steel AISI 316L

    Zhi’En Eddie Tan;John Hock Lye Pang;Jacek Kaminski;Helene Pepin

Frequent Co-Authors

Gengzhi Sun
Gengzhi Sun Nanjing Tech University
Lianxi Zheng
Lianxi Zheng Khalifa University
King-Ning Tu
King-Ning Tu City University of Hong Kong
Jianmin Miao
Jianmin Miao Shanghai Jiao Tong University
Kun Zhou
Kun Zhou Nanyang Technological University
Jinyuan Zhou
Jinyuan Zhou Lanzhou University
Anand Asundi
Anand Asundi d'Optron Pte
Swee Chuan Tjin
Swee Chuan Tjin Nanyang Technological University
Bahgat Sammakia
Bahgat Sammakia Binghamton University
John H. Lau
John H. Lau ASM International

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