Study of optimal subset size in digital image correlation of speckle pattern images
Sun Yaofeng;John H.L. Pang.
Optics and Lasers in Engineering (2007)
344 Citations
Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength
John H.L. Pang;T.H. Low;B.S. Xiong;Xu Luhua.
Thin Solid Films (2004)
244 Citations
Finite element formulation for a digital image correlation method
Yaofeng Sun;John H L Pang;Chee Khuen Wong;Fei Su.
Applied Optics (2005)
219 Citations
A review of recent works on inclusions
Kun Zhou;Hsin Jen Hoh;Xu Wang;Leon M. Keer.
Mechanics of Materials (2013)
214 Citations
Drop impact reliability testing for lead-free and lead-based soldered IC packages
Desmond Y.R. Chong;F.X. Che;John H.L. Pang;Kellin Ng.
Microelectronics Reliability (2006)
210 Citations
Thermal cycling analysis of flip-chip solder joint reliability
J.H.L. Pang;D.Y.R. Chong;T.H. Low.
IEEE Transactions on Components and Packaging Technologies (2001)
206 Citations
Dependence of elastic and optical properties on surface terminated groups in two-dimensional MXene monolayers: a first-principles study
Yuelei Bai;Yuelei Bai;Kun Zhou;Narasimalu Srikanth;John H. L. Pang.
RSC Advances (2016)
152 Citations
Electromigration induced ductile-to-brittle transition in lead-free solder joints
Fei Ren;Jae-Woong Nah;K. N. Tu;Bingshou Xiong.
Applied Physics Letters (2006)
144 Citations
Low cycle fatigue models for lead-free solders
John H.L. Pang;B.S. Xiong;T.H. Low.
Thin Solid Films (2004)
132 Citations
Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
John H. L. Pang;Luhua Xu;X. Q. Shi;W. Zhou.
Journal of Electronic Materials (2004)
126 Citations
