World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
37
Citations
7977
World Ranking
2354
National Ranking
848

Bahgat Sammakia publication distribution in Mechanical and Aerospace Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where Bahgat Sammakia sits on this spectrum.

47–56 publications: 10 scientists 57–66 publications: 23 scientists 67–76 publications: 32 scientists 77–86 publications: 62 scientists 87–96 publications: 67 scientists 97–106 publications: 91 scientists 107–116 publications: 113 scientists 117–126 publications: 115 scientists 127–136 publications: 130 scientists 137–146 publications: 140 scientists 147–156 publications: 155 scientists 157–166 publications: 132 scientists 167–176 publications: 133 scientists 177–186 publications: 130 scientists 187–196 publications: 140 scientists 197–206 publications: 115 scientists 207–216 publications: 125 scientists 217–226 publications: 117 scientists 227–236 publications: 99 scientists 237–246 publications: 92 scientists 247–256 publications: 100 scientists 257–266 publications: 95 scientists 267–276 publications: 88 scientists 277–286 publications: 77 scientists 287–296 publications: 74 scientists 297–306 publications: 74 scientists 307–316 publications: 62 scientists 317–326 publications: 70 scientists 327–336 publications: 59 scientists 337–346 publications: 58 scientists 347–356 publications: 45 scientists 357–366 publications: 44 scientists 367–376 publications: 36 scientists 377–386 publications: 41 scientists 387–396 publications: 32 scientists 397–406 publications: 23 scientists 407–416 publications: 28 scientists 417–426 publications: 27 scientists 427–436 publications: 25 scientists 437–446 publications: 23 scientists 447–456 publications: 23 scientists 457–466 publications: 20 scientists 467–476 publications: 12 scientists 477–486 publications: 24 scientists 487–496 publications: 18 scientists 497–506 publications: 12 scientists 507–516 publications: 13 scientists 517–526 publications: 21 scientists 527–536 publications: 12 scientists 537–546 publications: 8 scientists 547–556 publications: 16 scientists 557–566 publications: 3 scientists 567–576 publications: 11 scientists 577–586 publications: 6 scientists 587–596 publications: 5 scientists 597–606 publications: 6 scientists 607–616 publications: 7 scientists 617–626 publications: 7 scientists 627–636 publications: 10 scientists 637–646 publications: 4 scientists 647–656 publications: 3 scientists 657–658 publications: 2 scientists 659+ publications: 100 scientists
47 publications 659+

This scientist: 372 publications — 84th percentile

84% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 659 publications or more.

Bahgat Sammakia D-index placement in Mechanical and Aerospace Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Bahgat Sammakia sits on this spectrum.

30 D-Index: 83 scientists 31 D-Index: 113 scientists 32 D-Index: 144 scientists 33 D-Index: 153 scientists 34 D-Index: 189 scientists 35 D-Index: 158 scientists 36 D-Index: 139 scientists 37 D-Index: 127 scientists 38 D-Index: 130 scientists 39 D-Index: 126 scientists 40 D-Index: 104 scientists 41 D-Index: 100 scientists 42 D-Index: 107 scientists 43 D-Index: 101 scientists 44 D-Index: 103 scientists 45 D-Index: 79 scientists 46 D-Index: 88 scientists 47 D-Index: 70 scientists 48 D-Index: 83 scientists 49 D-Index: 44 scientists 50 D-Index: 64 scientists 51 D-Index: 56 scientists 52 D-Index: 50 scientists 53 D-Index: 48 scientists 54 D-Index: 58 scientists 55 D-Index: 52 scientists 56 D-Index: 48 scientists 57 D-Index: 42 scientists 58 D-Index: 34 scientists 59 D-Index: 42 scientists 60 D-Index: 37 scientists 61 D-Index: 42 scientists 62 D-Index: 44 scientists 63 D-Index: 22 scientists 64 D-Index: 33 scientists 65 D-Index: 29 scientists 66 D-Index: 23 scientists 67 D-Index: 29 scientists 68 D-Index: 24 scientists 69 D-Index: 19 scientists 70 D-Index: 34 scientists 71 D-Index: 26 scientists 72 D-Index: 19 scientists 73 D-Index: 18 scientists 74 D-Index: 19 scientists 75 D-Index: 14 scientists 76 D-Index: 19 scientists 77 D-Index: 8 scientists 78 D-Index: 18 scientists 79 D-Index: 16 scientists 80 D-Index: 12 scientists 81 D-Index: 17 scientists 82 D-Index: 11 scientists 83 D-Index: 16 scientists 84 D-Index: 7 scientists 85 D-Index: 9 scientists 86 D-Index: 8 scientists 87 D-Index: 6 scientists 88 D-Index: 6 scientists 89 D-Index: 7 scientists 90 D-Index: 10 scientists 91 D-Index: 4 scientists 92 D-Index: 4 scientists 93+ D-Index: 100 scientists
30 D-Index 93+

This scientist: 37 D-Index — 32nd percentile

32% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 93 D-Index or more.

Research.com Recognitions

  • 2020 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers
  • 2015 - Fellow, National Academy of Inventors
  • 2014 - IEEE Fellow For contributions to thermal management applications in electronic systems
  • 1997 - Fellow of the American Society of Mechanical Engineers

Overview

Bahgat Sammakia is affiliated with Binghamton University in the United States. Their research focuses primarily within the field of Engineering, with significant contributions in Mechanical Engineering, Electrical and Electronic Engineering, and Computational Mechanics. Other related subfields include Renewable Energy, Sustainability and the Environment, as well as Aerospace Engineering.

Their research topics span diverse and specialized areas such as:

  • Heat Transfer and Optimization
  • Heat Transfer and Boiling Studies
  • Heat Transfer Mechanisms
  • Solar Thermal and Photovoltaic Systems
  • Building Energy and Comfort Optimization
  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies

Bahgat Sammakia has published extensively in several scientific journals. Frequent publication venues include:

  • Journal of Electronic Packaging
  • Applied Thermal Engineering
  • International Journal of Heat and Mass Transfer
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • SSRN Electronic Journal

Recent papers authored by them demonstrate active research in thermal management and cooling technologies. Notable publications include:

  • "An experimental and numerical investigation of novel solution for energy management enhancement in data centers using underfloor plenum porous obstructions", 2021, Applied Energy
  • "Multi-objective optimization of a chip-attached micro pin fin liquid cooling system", 2021, Applied Thermal Engineering
  • "Multi-objective optimization of 3D printed liquid cooled heat sink with guide vanes for targeting hotspots in high heat flux electronics", 2021, International Journal of Heat and Mass Transfer
  • "A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices", 2021, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "A Review of Recent Developments in "On-Chip" Embedded Cooling Technologies for Heterogeneous Integrated Applications", 2023, Engineering

Frequent collaborators include:

  • Srikanth Rangarajan
  • Mohammad Tradat
  • Ahmad R. Gharaibeh
  • Yaman Manaserh
  • Cong Hiep Hoang

Bahgat Sammakia has received several professional recognitions over the years. These include:

  • Heat Transfer Memorial Award, The American Society of Mechanical Engineers, 2020
  • Fellow, National Academy of Inventors, 2015
  • IEEE Fellow, 2014, for contributions to thermal management applications in electronic systems
  • Fellow of the American Society of Mechanical Engineers, 1997

Best Publications

  • Buoyancy-Induced Flows And Transport

    Benjamin Gebhart;Yogesh Jaluria;Roop L. Mahajan;Bahgat Sammakia

  • Thermal Challenges in Next-Generation Electronic Systems

    S.V. Garimella;A.S. Fleischer;J.Y. Murthy;A. Keshavarzi

  • Bending Fatigue Study of Sputtered ITO on Flexible Substrate

    K. Alzoubi;M. M. Hamasha;S. Lu;B. Sammakia

  • Optimization of data center room layout to minimize rack inlet air temperature

    Siddharth Bhopte;Dereje Agonafer;Roger Schmidt;Bahgat Sammakia

  • A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages

    S. Sathe;B. Sammakia

  • A Brief Overview of Recent Developments in Thermal Management in Data Centers

    Sami Alkharabsheh;John Fernandes;Betsegaw Gebrehiwot;Dereje Agonafer

  • Comparative Analysis of Different Data Center Airflow Management Configurations

    Saurabh Shrivastava;Bahgat Sammakia;Roger Schmidt;Madhusudan Iyengar

  • A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

    Vikram Venkatadri;Bahgat Sammakia;Krishnaswami Srihari;Daryl Santos

  • Experimental-Numerical Comparison for a High-Density Data Center: Hot Spot Heat Fluxes in Excess of 500 W/FT2

    S.K. Shrivastava;B.G. Sammakia;R. Schmidt;M. Iyengar

  • Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

    S.V. Garimella;Y.K. Joshi;A. Bar-Cohen;R. Mahajan

  • Electronic package with pliant heat sink

    Joseph Funari;Mary C. Green;Scott D. Reynolds;Bahgat G. Sammakia

  • Optimization of data center room layout to minimize rack inlet air temperature

    Siddharth Bhopte;Dereje Agonafer;Roger Schmidt;Bahgat Sammakia

  • Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations.

    Sanket S. Mahajan;Ganesh Subbarayan;Bahgat G. Sammakia

  • An electronic package having active means to maintain its operating temperature constant

    Lawrence S.-W. Mok;Sampath Purushothaman;Bahgat G. Sammakia;Janusz S. Wilczynski

  • A numerical study of the thermal performance of an impingement heat sink-fin shape optimization

    A. Shah;B.G. Sammakia;H. Srihari;K. Ramakrishna

  • Flexible chemiresistor sensors: thin film assemblies of nanoparticles on a polyethylene terephthalate substrate

    Lingyan Wang;Jin Luo;Jun Yin;Hao Zhang

  • Electronic assembly with enhanced heat sinking

    Don L. Baker;Joseph Funari;William Fred Otto;Bahgat Ghaleb Sammakia

  • Predictive Model for Optimized Design Parameters in Flip-Chip Packages and Assemblies

    Seungbae Park;H.C. Lee;B. Sammakia;K. Raghunathan

  • An Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

    S. Kanuparthi;G. Subbarayan;T. Siegmund;B. Sammakia

  • Composite thermal interface material system and method using nano-scale components

    Hao Howard Wang;Bahgat Sammakia;Yayong Liu;Kaikun Yang

  • A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications

    Unknown

  • An experimental and numerical investigation of novel solution for energy management enhancement in data centers using underfloor plenum porous obstructions

    Mohammad I. Tradat;Yaman “Mohammad Ali” Manaserh;Bahgat G. Sammakia;Cong Hiep Hoang

  • Multi-objective optimization of a chip-attached micro pin fin liquid cooling system

    Vahideh Radmard;Yaser Hadad;Srikanth Rangarajan;Cong H. Hoang

  • Thermo-Mechanical Analysis of Thru-Silicon-Via Based High Density Compliant Interconnect

    P. Arunasalam;Fan Zhou;H.D. Ackler;B.G. Sammakia

  • Airflow and temperature distribution optimization in data centers using artificial neural networks

    Zhihang Song;Bruce T. Murray;Bahgat Sammakia

Frequent Co-Authors

Roger R. Schmidt
Roger R. Schmidt IBM (United States)
Kanad Ghose
Kanad Ghose Binghamton University
Madhusudan K. Iyengar
Madhusudan K. Iyengar Google (United States)
Benjamin Gebhart
Benjamin Gebhart University of Pennsylvania
Yogendra Joshi
Yogendra Joshi Georgia Institute of Technology
Cristina H. Amon
Cristina H. Amon University of Toronto
Omowunmi A. Sadik
Omowunmi A. Sadik New Jersey Institute of Technology
Thomas Siegmund
Thomas Siegmund Purdue University West Lafayette
Michael J. Ellsworth
Michael J. Ellsworth IBM (United States)
Suresh V. Garimella
Suresh V. Garimella University of Arizona

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