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D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
37
Citations
7977
World Ranking
2351
National Ranking
847

Research.com Recognitions

  • 2020 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers
  • 2015 - Fellow, National Academy of Inventors
  • 2014 - IEEE Fellow For contributions to thermal management applications in electronic systems
  • 1997 - Fellow of the American Society of Mechanical Engineers

Overview

Bahgat Sammakia is affiliated with Binghamton University in the United States. Their research focuses primarily within the field of Engineering, with significant contributions in Mechanical Engineering, Electrical and Electronic Engineering, and Computational Mechanics. Other related subfields include Renewable Energy, Sustainability and the Environment, as well as Aerospace Engineering.

Their research topics span diverse and specialized areas such as:

  • Heat Transfer and Optimization
  • Heat Transfer and Boiling Studies
  • Heat Transfer Mechanisms
  • Solar Thermal and Photovoltaic Systems
  • Building Energy and Comfort Optimization
  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies

Bahgat Sammakia has published extensively in several scientific journals. Frequent publication venues include:

  • Journal of Electronic Packaging
  • Applied Thermal Engineering
  • International Journal of Heat and Mass Transfer
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • SSRN Electronic Journal

Recent papers authored by them demonstrate active research in thermal management and cooling technologies. Notable publications include:

  • "An experimental and numerical investigation of novel solution for energy management enhancement in data centers using underfloor plenum porous obstructions", 2021, Applied Energy
  • "Multi-objective optimization of a chip-attached micro pin fin liquid cooling system", 2021, Applied Thermal Engineering
  • "Multi-objective optimization of 3D printed liquid cooled heat sink with guide vanes for targeting hotspots in high heat flux electronics", 2021, International Journal of Heat and Mass Transfer
  • "A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices", 2021, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "A Review of Recent Developments in "On-Chip" Embedded Cooling Technologies for Heterogeneous Integrated Applications", 2023, Engineering

Frequent collaborators include:

  • Srikanth Rangarajan
  • Mohammad Tradat
  • Ahmad R. Gharaibeh
  • Yaman Manaserh
  • Cong Hiep Hoang

Bahgat Sammakia has received several professional recognitions over the years. These include:

  • Heat Transfer Memorial Award, The American Society of Mechanical Engineers, 2020
  • Fellow, National Academy of Inventors, 2015
  • IEEE Fellow, 2014, for contributions to thermal management applications in electronic systems
  • Fellow of the American Society of Mechanical Engineers, 1997

Best Publications

  • Buoyancy-Induced Flows And Transport

    Benjamin Gebhart;Yogesh Jaluria;Roop L. Mahajan;Bahgat Sammakia

  • Thermal Challenges in Next-Generation Electronic Systems

    S.V. Garimella;A.S. Fleischer;J.Y. Murthy;A. Keshavarzi

  • Bending Fatigue Study of Sputtered ITO on Flexible Substrate

    K. Alzoubi;M. M. Hamasha;S. Lu;B. Sammakia

  • Optimization of data center room layout to minimize rack inlet air temperature

    Siddharth Bhopte;Dereje Agonafer;Roger Schmidt;Bahgat Sammakia

  • A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages

    S. Sathe;B. Sammakia

  • A Brief Overview of Recent Developments in Thermal Management in Data Centers

    Sami Alkharabsheh;John Fernandes;Betsegaw Gebrehiwot;Dereje Agonafer

  • Comparative Analysis of Different Data Center Airflow Management Configurations

    Saurabh Shrivastava;Bahgat Sammakia;Roger Schmidt;Madhusudan Iyengar

  • A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

    Vikram Venkatadri;Bahgat Sammakia;Krishnaswami Srihari;Daryl Santos

  • Experimental-Numerical Comparison for a High-Density Data Center: Hot Spot Heat Fluxes in Excess of 500 W/FT2

    S.K. Shrivastava;B.G. Sammakia;R. Schmidt;M. Iyengar

  • Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

    S.V. Garimella;Y.K. Joshi;A. Bar-Cohen;R. Mahajan

  • Electronic package with pliant heat sink

    Joseph Funari;Mary C. Green;Scott D. Reynolds;Bahgat G. Sammakia

  • Optimization of data center room layout to minimize rack inlet air temperature

    Siddharth Bhopte;Dereje Agonafer;Roger Schmidt;Bahgat Sammakia

  • Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations.

    Sanket S. Mahajan;Ganesh Subbarayan;Bahgat G. Sammakia

  • An electronic package having active means to maintain its operating temperature constant

    Lawrence S.-W. Mok;Sampath Purushothaman;Bahgat G. Sammakia;Janusz S. Wilczynski

  • A numerical study of the thermal performance of an impingement heat sink-fin shape optimization

    A. Shah;B.G. Sammakia;H. Srihari;K. Ramakrishna

  • Flexible chemiresistor sensors: thin film assemblies of nanoparticles on a polyethylene terephthalate substrate

    Lingyan Wang;Jin Luo;Jun Yin;Hao Zhang

  • Electronic assembly with enhanced heat sinking

    Don L. Baker;Joseph Funari;William Fred Otto;Bahgat Ghaleb Sammakia

  • Predictive Model for Optimized Design Parameters in Flip-Chip Packages and Assemblies

    Seungbae Park;H.C. Lee;B. Sammakia;K. Raghunathan

  • An Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

    S. Kanuparthi;G. Subbarayan;T. Siegmund;B. Sammakia

  • Composite thermal interface material system and method using nano-scale components

    Hao Howard Wang;Bahgat Sammakia;Yayong Liu;Kaikun Yang

  • A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications

    Unknown

  • An experimental and numerical investigation of novel solution for energy management enhancement in data centers using underfloor plenum porous obstructions

    Mohammad I. Tradat;Yaman “Mohammad Ali” Manaserh;Bahgat G. Sammakia;Cong Hiep Hoang

  • Multi-objective optimization of a chip-attached micro pin fin liquid cooling system

    Vahideh Radmard;Yaser Hadad;Srikanth Rangarajan;Cong H. Hoang

  • Thermo-Mechanical Analysis of Thru-Silicon-Via Based High Density Compliant Interconnect

    P. Arunasalam;Fan Zhou;H.D. Ackler;B.G. Sammakia

  • Airflow and temperature distribution optimization in data centers using artificial neural networks

    Zhihang Song;Bruce T. Murray;Bahgat Sammakia

Frequent Co-Authors

Roger R. Schmidt
Roger R. Schmidt IBM (United States)
Kanad Ghose
Kanad Ghose Binghamton University
Madhusudan K. Iyengar
Madhusudan K. Iyengar Google (United States)
Benjamin Gebhart
Benjamin Gebhart University of Pennsylvania
Yogendra Joshi
Yogendra Joshi Georgia Institute of Technology
Cristina H. Amon
Cristina H. Amon University of Toronto
Omowunmi A. Sadik
Omowunmi A. Sadik New Jersey Institute of Technology
Thomas Siegmund
Thomas Siegmund Purdue University West Lafayette
Michael J. Ellsworth
Michael J. Ellsworth IBM (United States)
Suresh V. Garimella
Suresh V. Garimella University of Arizona

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