The scientist’s investigation covers issues in Mechanical engineering, Coolant, Electronics, Heat exchanger and Water cooling. Rack, Active cooling, Air cooling, Computer cooling and Airflow are among the areas of Mechanical engineering where the researcher is concentrating his efforts. His Coolant research incorporates elements of Control valves and Heat sink.
His study explores the link between Electronics and topics such as Isolation valve that cross with problems in Plate heat exchanger, Expansion tank and Coupling. His Heat exchanger research is multidisciplinary, incorporating perspectives in Composite material, Enclosure and Condenser. His work deals with themes such as Engineering drawing, Electronic engineering, Evaporator and Component, which intersect with Water cooling.
Michael J. Ellsworth focuses on Mechanical engineering, Coolant, Electronics, Heat exchanger and Electronic component. Rack, Water cooling, Heat sink, Air cooling and Airflow are the subjects of his Mechanical engineering studies. His study in the fields of Pressurizer under the domain of Coolant overlaps with other disciplines such as Engine coolant temperature sensor.
He interconnects Inlet, Cold plate and Substrate in the investigation of issues within Electronics. His Heat exchanger study combines topics from a wide range of disciplines, such as Control valves, Waste management, Dew point and Computer cooling. His Electronic component research focuses on subjects like Immersion, which are linked to Liquid dielectric.
Michael J. Ellsworth mainly focuses on Mechanical engineering, Electronic component, Coolant, Heat sink and Structural engineering. His work carried out in the field of Mechanical engineering brings together such families of science as Thermal and Electronics. His Electronic component study incorporates themes from Liquid dielectric, Mechanics and Enclosure.
His Coolant study focuses on Pressurizer in particular. His Heat sink study integrates concerns from other disciplines, such as Heat transfer, Heat pipe, Waste management and Computer cooling. His studies examine the connections between Heat exchanger and genetics, as well as such issues in Thermoelectric effect, with regards to Thermal contact.
Michael J. Ellsworth spends much of his time researching Electronic component, Coolant, Mechanical engineering, Heat sink and Electrical conductor. His biological study spans a wide range of topics, including Liquid dielectric, Mechanics and Enclosure. His studies in Coolant integrate themes in fields like Condensation and Condenser.
The various areas that he examines in his Mechanical engineering study include Waste management, Structural engineering and Electronics. He has included themes like Heat transfer and Pressurizer in his Heat sink study. His Rack research focuses on Heat exchanger and how it relates to Airflow.
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Method and apparatus for combined air and liquid cooling of stacked electronics components
Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt.
(2002)
Method and system for cooling electronics racks using pre-cooled air
Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)
Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
Richard C. Chu;Michael J. Ellsworth;Donald W. Porter;Roger R. Schmidt.
(2005)
Review of cooling technologies for computer products
R.C. Chu;R.E. Simons;M.J. Ellsworth;R.R. Schmidt.
IEEE Transactions on Device and Materials Reliability (2004)
Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)
Two stage cooling system employing thermoelectric modules
Richard C. Chu;Michael J. Ellsworth;Robert E. Simons.
(2002)
Air flow system and method for facilitating cooling of stacked electronics components
Richard Chu;Michael Ellsworth;Roger Schmidt;Robert Simons.
(2004)
Method for combined air and liquid cooling of stacked electronics components
Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt.
(2004)
Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems
Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)
Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar.
(2004)
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