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Michael J. Ellsworth

Michael J. Ellsworth

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
70
Citations
13036
World Ranking
405
National Ranking
185

Overview

Michael J. Ellsworth is affiliated with IBM (United States) and conducts research primarily within the United States. Their work spans multiple disciplines, with a focus on both the Arts and Humanities as well as Computer Science. Ellsworth's research integrates various subfields, including Literature and Literary Theory, Sociology and Political Science, Computer Vision and Pattern Recognition, Artificial Intelligence, and Information Systems and Management.

The main topics covered in Ellsworth's publications reflect interdisciplinary approaches, coupling literary and cultural studies with computational methodologies. Key themes in their work include:

  • Themes in Literature Analysis
  • Digital Games and Media
  • Folklore, Mythology, and Literature Studies
  • Data Visualization and Analytics
  • Advanced Text Analysis Techniques
  • Scientific Computing and Data Management

Ellsworth has contributed to scholarly literature with recent papers such as:
• "Lord of the Words" (2023), published in Zeitschrift für Literaturwissenschaft und Linguistik.
• "Producing Usable Taxonomies Cheaply and Rapidly at Pinterest Using Discovered Dynamic μ-Topics" (2023), published on arXiv (Cornell University).

Their frequent coauthors include:

  • Vera Cuntz-Leng
  • Christof Leng
  • Abhijit Mahabal
  • Jiyun Luo
  • Rui Huang

Ellsworth's publications are often found in venues such as:

  • Zeitschrift für Literaturwissenschaft und Linguistik
  • arXiv (Cornell University)

Their research draws on interdisciplinary methods, reflecting expertise in both humanities-based literary analysis and computational techniques involving data science and machine learning. This dual approach is evident across their studies linking thematic exploration in literature and folklore with automated topic discovery and visualization strategies.

Best Publications

  • Method and apparatus for combined air and liquid cooling of stacked electronics components

    Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt

  • Method and system for cooling electronics racks using pre-cooled air

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Review of cooling technologies for computer products

    R.C. Chu;R.E. Simons;M.J. Ellsworth;R.R. Schmidt

  • Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack

    Richard C. Chu;Michael J. Ellsworth;Donald W. Porter;Roger R. Schmidt

  • Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Two stage cooling system employing thermoelectric modules

    Richard C. Chu;Michael J. Ellsworth;Robert E. Simons

  • System and method for facilitating cooling of a liquid-cooled electronics rack

    Michael J. Ellsworth;Francis R. Krug;Robert K. Mullady;Roger R. Schmidt

  • Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Air flow system and method for facilitating cooling of stacked electronics components

    Richard Chu;Michael Ellsworth;Roger Schmidt;Robert Simons

  • Electronic module with integral refrigerant evaporator assembly and control system therefore

    Richard C. Chu;Michael J. Ellsworth;Robert E. Simons

  • Impingment cooled compliant heat sink

    Richard C. Chu;Michael J. Ellsworth;David T. Vader

  • Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Intersecting flow network for a cold plate cooling system

    Richard C. Chu;Michael J. Ellsworth;Robert E. Simons;David T. Vader

  • System of facilitating cooling of electronics racks of a data center employing multiple cooling stations

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • The evolution of water cooling for IBM large server systems: Back to the future

    M.J. Ellsworth;L.A. Campbell;R.E. Simons;R.R.S. Iyengar

Frequent Co-Authors

Robert E. Simons
Robert E. Simons IBM (United States)
Richard C. Chu
Richard C. Chu IBM (United States)
Madhusudan K. Iyengar
Madhusudan K. Iyengar Google (United States)
Roger R. Schmidt
Roger R. Schmidt IBM (United States)
Evan G. Colgan
Evan G. Colgan IBM (United States)
Bahgat Sammakia
Bahgat Sammakia Binghamton University
Yogendra Joshi
Yogendra Joshi Georgia Institute of Technology
Casimer M. DeCusatis
Casimer M. DeCusatis Marist College
Ravi Kumar Arimilli
Ravi Kumar Arimilli IBM (United States)
Da-Yuan Shih
Da-Yuan Shih IBM (United States)

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