D-Index & Metrics Best Publications

D-Index & Metrics

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Mechanical and Aerospace Engineering D-index 69 Citations 11,429 216 World Ranking 83 National Ranking 47

Overview

What is he best known for?

The fields of study he is best known for:

  • Mechanical engineering
  • Thermodynamics
  • Composite material

The scientist’s investigation covers issues in Mechanical engineering, Coolant, Electronics, Heat exchanger and Water cooling. Rack, Active cooling, Air cooling, Computer cooling and Airflow are among the areas of Mechanical engineering where the researcher is concentrating his efforts. His Coolant research incorporates elements of Control valves and Heat sink.

His study explores the link between Electronics and topics such as Isolation valve that cross with problems in Plate heat exchanger, Expansion tank and Coupling. His Heat exchanger research is multidisciplinary, incorporating perspectives in Composite material, Enclosure and Condenser. His work deals with themes such as Engineering drawing, Electronic engineering, Evaporator and Component, which intersect with Water cooling.

His most cited work include:

  • Method and apparatus for combined air and liquid cooling of stacked electronics components (245 citations)
  • Method and system for cooling electronics racks using pre-cooled air (221 citations)
  • Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack (193 citations)

What are the main themes of his work throughout his whole career to date?

Michael J. Ellsworth focuses on Mechanical engineering, Coolant, Electronics, Heat exchanger and Electronic component. Rack, Water cooling, Heat sink, Air cooling and Airflow are the subjects of his Mechanical engineering studies. His study in the fields of Pressurizer under the domain of Coolant overlaps with other disciplines such as Engine coolant temperature sensor.

He interconnects Inlet, Cold plate and Substrate in the investigation of issues within Electronics. His Heat exchanger study combines topics from a wide range of disciplines, such as Control valves, Waste management, Dew point and Computer cooling. His Electronic component research focuses on subjects like Immersion, which are linked to Liquid dielectric.

He most often published in these fields:

  • Mechanical engineering (55.66%)
  • Coolant (43.08%)
  • Electronics (30.50%)

What were the highlights of his more recent work (between 2012-2019)?

  • Mechanical engineering (55.66%)
  • Electronic component (22.33%)
  • Coolant (43.08%)

In recent papers he was focusing on the following fields of study:

Michael J. Ellsworth mainly focuses on Mechanical engineering, Electronic component, Coolant, Heat sink and Structural engineering. His work carried out in the field of Mechanical engineering brings together such families of science as Thermal and Electronics. His Electronic component study incorporates themes from Liquid dielectric, Mechanics and Enclosure.

His Coolant study focuses on Pressurizer in particular. His Heat sink study integrates concerns from other disciplines, such as Heat transfer, Heat pipe, Waste management and Computer cooling. His studies examine the connections between Heat exchanger and genetics, as well as such issues in Thermoelectric effect, with regards to Thermal contact.

Between 2012 and 2019, his most popular works were:

  • Condenser fin structures facilitating vapor condensation cooling of coolant (44 citations)
  • Valve controlled, node-level vapor condensation for two-phase heat sink(s) (42 citations)
  • Pump-enhanced, immersion-cooling of electronic component(s) (39 citations)

In his most recent research, the most cited papers focused on:

  • Mechanical engineering
  • Thermodynamics
  • Composite material

Michael J. Ellsworth spends much of his time researching Electronic component, Coolant, Mechanical engineering, Heat sink and Electrical conductor. His biological study spans a wide range of topics, including Liquid dielectric, Mechanics and Enclosure. His studies in Coolant integrate themes in fields like Condensation and Condenser.

The various areas that he examines in his Mechanical engineering study include Waste management, Structural engineering and Electronics. He has included themes like Heat transfer and Pressurizer in his Heat sink study. His Rack research focuses on Heat exchanger and how it relates to Airflow.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Method and apparatus for combined air and liquid cooling of stacked electronics components

Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt.
(2002)

375 Citations

Method and system for cooling electronics racks using pre-cooled air

Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)

330 Citations

Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack

Richard C. Chu;Michael J. Ellsworth;Donald W. Porter;Roger R. Schmidt.
(2005)

293 Citations

Review of cooling technologies for computer products

R.C. Chu;R.E. Simons;M.J. Ellsworth;R.R. Schmidt.
IEEE Transactions on Device and Materials Reliability (2004)

234 Citations

Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack

Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)

219 Citations

Two stage cooling system employing thermoelectric modules

Richard C. Chu;Michael J. Ellsworth;Robert E. Simons.
(2002)

188 Citations

Air flow system and method for facilitating cooling of stacked electronics components

Richard Chu;Michael Ellsworth;Roger Schmidt;Robert Simons.
(2004)

187 Citations

Method for combined air and liquid cooling of stacked electronics components

Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt.
(2004)

179 Citations

Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems

Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)

176 Citations

Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly

Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar.
(2004)

174 Citations

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