World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
81
Citations
16190
World Ranking
204
National Ranking
101

Richard C. Chu publication distribution in Mechanical and Aerospace Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where Richard C. Chu sits on this spectrum.

47–56 publications: 10 scientists 57–66 publications: 23 scientists 67–76 publications: 32 scientists 77–86 publications: 62 scientists 87–96 publications: 67 scientists 97–106 publications: 91 scientists 107–116 publications: 113 scientists 117–126 publications: 115 scientists 127–136 publications: 130 scientists 137–146 publications: 140 scientists 147–156 publications: 155 scientists 157–166 publications: 132 scientists 167–176 publications: 133 scientists 177–186 publications: 130 scientists 187–196 publications: 140 scientists 197–206 publications: 115 scientists 207–216 publications: 125 scientists 217–226 publications: 117 scientists 227–236 publications: 99 scientists 237–246 publications: 92 scientists 247–256 publications: 100 scientists 257–266 publications: 95 scientists 267–276 publications: 88 scientists 277–286 publications: 77 scientists 287–296 publications: 74 scientists 297–306 publications: 74 scientists 307–316 publications: 62 scientists 317–326 publications: 70 scientists 327–336 publications: 59 scientists 337–346 publications: 58 scientists 347–356 publications: 45 scientists 357–366 publications: 44 scientists 367–376 publications: 36 scientists 377–386 publications: 41 scientists 387–396 publications: 32 scientists 397–406 publications: 23 scientists 407–416 publications: 28 scientists 417–426 publications: 27 scientists 427–436 publications: 25 scientists 437–446 publications: 23 scientists 447–456 publications: 23 scientists 457–466 publications: 20 scientists 467–476 publications: 12 scientists 477–486 publications: 24 scientists 487–496 publications: 18 scientists 497–506 publications: 12 scientists 507–516 publications: 13 scientists 517–526 publications: 21 scientists 527–536 publications: 12 scientists 537–546 publications: 8 scientists 547–556 publications: 16 scientists 557–566 publications: 3 scientists 567–576 publications: 11 scientists 577–586 publications: 6 scientists 587–596 publications: 5 scientists 597–606 publications: 6 scientists 607–616 publications: 7 scientists 617–626 publications: 7 scientists 627–636 publications: 10 scientists 637–646 publications: 4 scientists 647–656 publications: 3 scientists 657–658 publications: 2 scientists 659+ publications: 100 scientists
47 publications 659+

This scientist: 319 publications — 76th percentile

76% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 659 publications or more.

Richard C. Chu D-index placement in Mechanical and Aerospace Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Richard C. Chu sits on this spectrum.

30 D-Index: 83 scientists 31 D-Index: 113 scientists 32 D-Index: 144 scientists 33 D-Index: 153 scientists 34 D-Index: 189 scientists 35 D-Index: 158 scientists 36 D-Index: 139 scientists 37 D-Index: 127 scientists 38 D-Index: 130 scientists 39 D-Index: 126 scientists 40 D-Index: 104 scientists 41 D-Index: 100 scientists 42 D-Index: 107 scientists 43 D-Index: 101 scientists 44 D-Index: 103 scientists 45 D-Index: 79 scientists 46 D-Index: 88 scientists 47 D-Index: 70 scientists 48 D-Index: 83 scientists 49 D-Index: 44 scientists 50 D-Index: 64 scientists 51 D-Index: 56 scientists 52 D-Index: 50 scientists 53 D-Index: 48 scientists 54 D-Index: 58 scientists 55 D-Index: 52 scientists 56 D-Index: 48 scientists 57 D-Index: 42 scientists 58 D-Index: 34 scientists 59 D-Index: 42 scientists 60 D-Index: 37 scientists 61 D-Index: 42 scientists 62 D-Index: 44 scientists 63 D-Index: 22 scientists 64 D-Index: 33 scientists 65 D-Index: 29 scientists 66 D-Index: 23 scientists 67 D-Index: 29 scientists 68 D-Index: 24 scientists 69 D-Index: 19 scientists 70 D-Index: 34 scientists 71 D-Index: 26 scientists 72 D-Index: 19 scientists 73 D-Index: 18 scientists 74 D-Index: 19 scientists 75 D-Index: 14 scientists 76 D-Index: 19 scientists 77 D-Index: 8 scientists 78 D-Index: 18 scientists 79 D-Index: 16 scientists 80 D-Index: 12 scientists 81 D-Index: 17 scientists 82 D-Index: 11 scientists 83 D-Index: 16 scientists 84 D-Index: 7 scientists 85 D-Index: 9 scientists 86 D-Index: 8 scientists 87 D-Index: 6 scientists 88 D-Index: 6 scientists 89 D-Index: 7 scientists 90 D-Index: 10 scientists 91 D-Index: 4 scientists 92 D-Index: 4 scientists 93+ D-Index: 100 scientists
30 D-Index 93+

This scientist: 81 D-Index — 95th percentile

95% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 93 D-Index or more.

Research.com Recognitions

  • 1988 - Fellow of the American Association for the Advancement of Science (AAAS)
  • 1986 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers

Overview

Richard C. Chu was affiliated with IBM in the United States and produced research primarily within the fields of Engineering and Environmental Science. Their scholarly output mainly addressed topics intersecting wind and air flow studies, aerodynamics, fluid dynamics, and heat transfer.

Their research spanned several subfields, including mechanical engineering, environmental engineering, aerospace engineering, atmospheric science, and global and planetary change.

Major topics covered in their work included:

  • Wind and Air Flow Studies
  • Aerodynamics and Fluid Dynamics Research
  • Wind Energy Research and Development
  • Heat Transfer and Optimization
  • Heat Transfer and Boiling Studies
  • Refrigeration and Air Conditioning Technologies
  • Tropical and Extratropical Cyclones Research

Richard C. Chu had multiple publications appearing in a variety of venues. Frequent publication outlets included:

  • Energies
  • Journal for Activist Science and Technology Education
  • 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
  • Building and Environment

Notable recent papers by Richard C. Chu were:

  • CFD in Urban Wind Resource Assessments: A Review, 2025, Energies
  • "No Car Day", 2020, Journal for Activist Science and Technology Education
  • Richard Chu ITherm Award, 2022, 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
  • Assessing the probability density function of urban wind-induced risk under typhoon conditions, 2025, Building and Environment

The scientist collaborated regularly with several individuals including Kai Wang, Vijey Jeevakumaran, Itherm Award, Michael Ohadi, and Xiaoxue Wang.

Throughout their career, Richard C. Chu received recognition in the form of awards such as the Heat Transfer Memorial Award from The American Society of Mechanical Engineers in 1986 and was named a Fellow of the American Association for the Advancement of Science (AAAS) in 1988.

Best Publications

  • Method and apparatus for combined air and liquid cooling of stacked electronics components

    Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt

  • Method and system for cooling electronics racks using pre-cooled air

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Review of cooling technologies for computer products

    R.C. Chu;R.E. Simons;M.J. Ellsworth;R.R. Schmidt

  • Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack

    Richard C. Chu;Michael J. Ellsworth;Donald W. Porter;Roger R. Schmidt

  • Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Gas encapsulated cooling module

    Richard C. Chu;Omkarnath R. Gupta;Un-Pah Hwang;Robert E. Simons

  • Two stage cooling system employing thermoelectric modules

    Richard C. Chu;Michael J. Ellsworth;Robert E. Simons

  • Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Air flow system and method for facilitating cooling of stacked electronics components

    Richard Chu;Michael Ellsworth;Roger Schmidt;Robert Simons

  • Electronic module with integral refrigerant evaporator assembly and control system therefore

    Richard C. Chu;Michael J. Ellsworth;Robert E. Simons

  • Impingment cooled compliant heat sink

    Richard C. Chu;Michael J. Ellsworth;David T. Vader

  • Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Immersion cooled circuit module with improved fins

    Gregory M. Chrysler;Richard Chao-Fan Chu;Robert E. Simmons

  • Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Orientation independent evaporator

    Timothy Merrill Anderson;Gregory Martin Chrysler;Richard Chao-Fan Chu

  • Heat transfer in a liquid cooling system

    Richard C Chu;Martin G Cohen;Omkarnath Gupta

  • Intersecting flow network for a cold plate cooling system

    Richard C. Chu;Michael J. Ellsworth;Robert E. Simons;David T. Vader

  • Cooling computer systems

    Gregory M. Chrysler;Richard C. Chu;Gary F. Goth;Robert E. Simons

  • Thermal Management of Microelectronic Equipment

    Unknown

  • Modular cooling system

    Richard C Chu

Frequent Co-Authors

Robert E. Simons
Robert E. Simons IBM (United States)
Michael J. Ellsworth
Michael J. Ellsworth IBM (United States)
Madhusudan K. Iyengar
Madhusudan K. Iyengar Google (United States)
Roger R. Schmidt
Roger R. Schmidt IBM (United States)
Hendrik F. Hamann
Hendrik F. Hamann IBM (United States)
Evan G. Colgan
Evan G. Colgan IBM (United States)
Da-Yuan Shih
Da-Yuan Shih IBM (United States)
Suresh V. Garimella
Suresh V. Garimella University of Arizona
Louis L. Hsu
Louis L. Hsu IBM (United States)
Bahgat Sammakia
Bahgat Sammakia Binghamton University

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