What is he best known for?
The fields of study he is best known for:
- Mechanical engineering
- Electrical engineering
- Thermodynamics
Richard C. Chu spends much of his time researching Mechanical engineering, Coolant, Electronics, Water cooling and Heat exchanger.
Rack, Active cooling, Heat sink, Air cooling and Airflow are the subjects of his Mechanical engineering studies.
The study incorporates disciplines such as Flow, Heat transfer and Enclosure in addition to Coolant.
His biological study spans a wide range of topics, including Mechanism and Component.
His work deals with themes such as Electronic engineering, Engineering drawing and Refrigerant, which intersect with Water cooling.
The Heat exchanger study combines topics in areas such as Manifold, Condenser and Computer cooling.
His most cited work include:
- Method and apparatus for combined air and liquid cooling of stacked electronics components (245 citations)
- Method and system for cooling electronics racks using pre-cooled air (221 citations)
- Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack (193 citations)
What are the main themes of his work throughout his whole career to date?
Richard C. Chu mostly deals with Mechanical engineering, Coolant, Electronics, Heat exchanger and Electronic component.
His Mechanical engineering study frequently involves adjacent topics like Enclosure.
His studies in Coolant integrate themes in fields like Mechanics, Heat transfer and Heat sink.
His research in Heat transfer intersects with topics in Composite material and Chip.
His Electronics course of study focuses on Electrical conductor and Optoelectronics.
His Heat exchanger research is multidisciplinary, incorporating perspectives in Control valves, Waste management, Dew point and Computer cooling.
He most often published in these fields:
- Mechanical engineering (52.40%)
- Coolant (42.81%)
- Electronics (26.20%)
What were the highlights of his more recent work (between 2009-2015)?
- Mechanical engineering (52.40%)
- Coolant (42.81%)
- Electronic component (19.49%)
In recent papers he was focusing on the following fields of study:
Richard C. Chu focuses on Mechanical engineering, Coolant, Electronic component, Heat exchanger and Heat sink.
His Mechanical engineering study frequently links to related topics such as Electronics.
His work on Pressurizer as part of general Coolant study is frequently linked to Engine coolant temperature sensor, therefore connecting diverse disciplines of science.
His study on Electronic component also encompasses disciplines like
- Immersion that intertwine with fields like Liquid dielectric,
- Enclosure that intertwine with fields like Structural engineering and Flow.
His Heat exchanger research includes themes of Airflow, Inlet, Line and Gravity.
His Heat sink research is multidisciplinary, incorporating elements of Heat transfer and Heat pipe.
Between 2009 and 2015, his most popular works were:
- Electronic module with pump-enhanced, dielectric fluid immersion-cooling (94 citations)
- Liquid-cooled electronics rack with immersion-cooled electronic subsystems (91 citations)
- Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit (59 citations)
In his most recent research, the most cited papers focused on:
- Mechanical engineering
- Electrical engineering
- Thermodynamics
Richard C. Chu mainly investigates Mechanical engineering, Coolant, Electronic component, Rack and Electronics.
His Diaphragm pump study in the realm of Mechanical engineering interacts with subjects such as Loop.
Richard C. Chu interconnects Condensation, Heat exchanger and Air cooling, Active cooling in the investigation of issues within Coolant.
His Electronic component study combines topics in areas such as Electrical conduit, Immersion, Thermal and Heat sink.
The concepts of his Rack study are interwoven with issues in Power, Frame and Computer hardware.
His work in Electronics covers topics such as Liquid dielectric which are related to areas like Manifold, Coupling and Mechanics.
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