D-Index & Metrics Best Publications

D-Index & Metrics

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Mechanical and Aerospace Engineering D-index 75 Citations 12,924 195 World Ranking 55 National Ranking 31

Research.com Recognitions

Awards & Achievements

1988 - Fellow of the American Association for the Advancement of Science (AAAS)

1986 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers

Overview

What is he best known for?

The fields of study he is best known for:

  • Mechanical engineering
  • Electrical engineering
  • Thermodynamics

Richard C. Chu spends much of his time researching Mechanical engineering, Coolant, Electronics, Water cooling and Heat exchanger. Rack, Active cooling, Heat sink, Air cooling and Airflow are the subjects of his Mechanical engineering studies. The study incorporates disciplines such as Flow, Heat transfer and Enclosure in addition to Coolant.

His biological study spans a wide range of topics, including Mechanism and Component. His work deals with themes such as Electronic engineering, Engineering drawing and Refrigerant, which intersect with Water cooling. The Heat exchanger study combines topics in areas such as Manifold, Condenser and Computer cooling.

His most cited work include:

  • Method and apparatus for combined air and liquid cooling of stacked electronics components (245 citations)
  • Method and system for cooling electronics racks using pre-cooled air (221 citations)
  • Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack (193 citations)

What are the main themes of his work throughout his whole career to date?

Richard C. Chu mostly deals with Mechanical engineering, Coolant, Electronics, Heat exchanger and Electronic component. His Mechanical engineering study frequently involves adjacent topics like Enclosure. His studies in Coolant integrate themes in fields like Mechanics, Heat transfer and Heat sink.

His research in Heat transfer intersects with topics in Composite material and Chip. His Electronics course of study focuses on Electrical conductor and Optoelectronics. His Heat exchanger research is multidisciplinary, incorporating perspectives in Control valves, Waste management, Dew point and Computer cooling.

He most often published in these fields:

  • Mechanical engineering (52.40%)
  • Coolant (42.81%)
  • Electronics (26.20%)

What were the highlights of his more recent work (between 2009-2015)?

  • Mechanical engineering (52.40%)
  • Coolant (42.81%)
  • Electronic component (19.49%)

In recent papers he was focusing on the following fields of study:

Richard C. Chu focuses on Mechanical engineering, Coolant, Electronic component, Heat exchanger and Heat sink. His Mechanical engineering study frequently links to related topics such as Electronics. His work on Pressurizer as part of general Coolant study is frequently linked to Engine coolant temperature sensor, therefore connecting diverse disciplines of science.

His study on Electronic component also encompasses disciplines like

  • Immersion that intertwine with fields like Liquid dielectric,
  • Enclosure that intertwine with fields like Structural engineering and Flow. His Heat exchanger research includes themes of Airflow, Inlet, Line and Gravity. His Heat sink research is multidisciplinary, incorporating elements of Heat transfer and Heat pipe.

Between 2009 and 2015, his most popular works were:

  • Electronic module with pump-enhanced, dielectric fluid immersion-cooling (94 citations)
  • Liquid-cooled electronics rack with immersion-cooled electronic subsystems (91 citations)
  • Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit (59 citations)

In his most recent research, the most cited papers focused on:

  • Mechanical engineering
  • Electrical engineering
  • Thermodynamics

Richard C. Chu mainly investigates Mechanical engineering, Coolant, Electronic component, Rack and Electronics. His Diaphragm pump study in the realm of Mechanical engineering interacts with subjects such as Loop. Richard C. Chu interconnects Condensation, Heat exchanger and Air cooling, Active cooling in the investigation of issues within Coolant.

His Electronic component study combines topics in areas such as Electrical conduit, Immersion, Thermal and Heat sink. The concepts of his Rack study are interwoven with issues in Power, Frame and Computer hardware. His work in Electronics covers topics such as Liquid dielectric which are related to areas like Manifold, Coupling and Mechanics.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Method and apparatus for combined air and liquid cooling of stacked electronics components

Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt.
(2002)

375 Citations

Gas encapsulated cooling module

Richard C. Chu;Omkarnath R. Gupta;Un-Pah Hwang;Robert E. Simons.
(1975)

342 Citations

Method and system for cooling electronics racks using pre-cooled air

Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)

330 Citations

Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack

Richard C. Chu;Michael J. Ellsworth;Donald W. Porter;Roger R. Schmidt.
(2005)

293 Citations

Modular refrigeration system

Jeffrey J. Hare;Willard S. Harris;Jody A. Hickey;Roger R. Schmidt.
(1997)

255 Citations

Review of cooling technologies for computer products

R.C. Chu;R.E. Simons;M.J. Ellsworth;R.R. Schmidt.
IEEE Transactions on Device and Materials Reliability (2004)

234 Citations

Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack

Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)

219 Citations

Two stage cooling system employing thermoelectric modules

Richard C. Chu;Michael J. Ellsworth;Robert E. Simons.
(2002)

188 Citations

Air flow system and method for facilitating cooling of stacked electronics components

Richard Chu;Michael Ellsworth;Roger Schmidt;Robert Simons.
(2004)

187 Citations

Method for combined air and liquid cooling of stacked electronics components

Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt.
(2004)

179 Citations

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