World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
81
Citations
16190
World Ranking
203
National Ranking
100

Research.com Recognitions

  • 1988 - Fellow of the American Association for the Advancement of Science (AAAS)
  • 1986 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers

Overview

Richard C. Chu was affiliated with IBM in the United States and produced research primarily within the fields of Engineering and Environmental Science. Their scholarly output mainly addressed topics intersecting wind and air flow studies, aerodynamics, fluid dynamics, and heat transfer.

Their research spanned several subfields, including mechanical engineering, environmental engineering, aerospace engineering, atmospheric science, and global and planetary change.

Major topics covered in their work included:

  • Wind and Air Flow Studies
  • Aerodynamics and Fluid Dynamics Research
  • Wind Energy Research and Development
  • Heat Transfer and Optimization
  • Heat Transfer and Boiling Studies
  • Refrigeration and Air Conditioning Technologies
  • Tropical and Extratropical Cyclones Research

Richard C. Chu had multiple publications appearing in a variety of venues. Frequent publication outlets included:

  • Energies
  • Journal for Activist Science and Technology Education
  • 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
  • Building and Environment

Notable recent papers by Richard C. Chu were:

  • CFD in Urban Wind Resource Assessments: A Review, 2025, Energies
  • "No Car Day", 2020, Journal for Activist Science and Technology Education
  • Richard Chu ITherm Award, 2022, 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
  • Assessing the probability density function of urban wind-induced risk under typhoon conditions, 2025, Building and Environment

The scientist collaborated regularly with several individuals including Kai Wang, Vijey Jeevakumaran, Itherm Award, Michael Ohadi, and Xiaoxue Wang.

Throughout their career, Richard C. Chu received recognition in the form of awards such as the Heat Transfer Memorial Award from The American Society of Mechanical Engineers in 1986 and was named a Fellow of the American Association for the Advancement of Science (AAAS) in 1988.

Best Publications

  • Method and apparatus for combined air and liquid cooling of stacked electronics components

    Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt

  • Method and system for cooling electronics racks using pre-cooled air

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Review of cooling technologies for computer products

    R.C. Chu;R.E. Simons;M.J. Ellsworth;R.R. Schmidt

  • Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack

    Richard C. Chu;Michael J. Ellsworth;Donald W. Porter;Roger R. Schmidt

  • Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Gas encapsulated cooling module

    Richard C. Chu;Omkarnath R. Gupta;Un-Pah Hwang;Robert E. Simons

  • Two stage cooling system employing thermoelectric modules

    Richard C. Chu;Michael J. Ellsworth;Robert E. Simons

  • Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems

    Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons

  • Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Air flow system and method for facilitating cooling of stacked electronics components

    Richard Chu;Michael Ellsworth;Roger Schmidt;Robert Simons

  • Electronic module with integral refrigerant evaporator assembly and control system therefore

    Richard C. Chu;Michael J. Ellsworth;Robert E. Simons

  • Impingment cooled compliant heat sink

    Richard C. Chu;Michael J. Ellsworth;David T. Vader

  • Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Immersion cooled circuit module with improved fins

    Gregory M. Chrysler;Richard Chao-Fan Chu;Robert E. Simmons

  • Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Orientation independent evaporator

    Timothy Merrill Anderson;Gregory Martin Chrysler;Richard Chao-Fan Chu

  • Heat transfer in a liquid cooling system

    Richard C Chu;Martin G Cohen;Omkarnath Gupta

  • Intersecting flow network for a cold plate cooling system

    Richard C. Chu;Michael J. Ellsworth;Robert E. Simons;David T. Vader

  • Cooling computer systems

    Gregory M. Chrysler;Richard C. Chu;Gary F. Goth;Robert E. Simons

  • Thermal Management of Microelectronic Equipment

    Unknown

  • Modular cooling system

    Richard C Chu

Frequent Co-Authors

Robert E. Simons
Robert E. Simons IBM (United States)
Michael J. Ellsworth
Michael J. Ellsworth IBM (United States)
Madhusudan K. Iyengar
Madhusudan K. Iyengar Google (United States)
Roger R. Schmidt
Roger R. Schmidt IBM (United States)
Hendrik F. Hamann
Hendrik F. Hamann IBM (United States)
Evan G. Colgan
Evan G. Colgan IBM (United States)
Da-Yuan Shih
Da-Yuan Shih IBM (United States)
Suresh V. Garimella
Suresh V. Garimella University of Arizona
Louis L. Hsu
Louis L. Hsu IBM (United States)
Bahgat Sammakia
Bahgat Sammakia Binghamton University

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