World's Best Scientists 2026 revealed!
Kenneth E. Goodson

Kenneth E. Goodson

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Mechanical and Aerospace Engineering
USA
2026

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
102
Citations
44382
World Ranking
56
National Ranking
28

Materials Science

D-Index
96
Citations
41964
World Ranking
1248
National Ranking
403

Kenneth E. Goodson publication distribution in Mechanical and Aerospace Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where Kenneth E. Goodson sits on this spectrum.

47–56 publications: 10 scientists 57–66 publications: 23 scientists 67–76 publications: 32 scientists 77–86 publications: 62 scientists 87–96 publications: 67 scientists 97–106 publications: 91 scientists 107–116 publications: 113 scientists 117–126 publications: 115 scientists 127–136 publications: 130 scientists 137–146 publications: 140 scientists 147–156 publications: 155 scientists 157–166 publications: 132 scientists 167–176 publications: 133 scientists 177–186 publications: 130 scientists 187–196 publications: 140 scientists 197–206 publications: 115 scientists 207–216 publications: 125 scientists 217–226 publications: 117 scientists 227–236 publications: 99 scientists 237–246 publications: 92 scientists 247–256 publications: 100 scientists 257–266 publications: 95 scientists 267–276 publications: 88 scientists 277–286 publications: 77 scientists 287–296 publications: 74 scientists 297–306 publications: 74 scientists 307–316 publications: 62 scientists 317–326 publications: 70 scientists 327–336 publications: 59 scientists 337–346 publications: 58 scientists 347–356 publications: 45 scientists 357–366 publications: 44 scientists 367–376 publications: 36 scientists 377–386 publications: 41 scientists 387–396 publications: 32 scientists 397–406 publications: 23 scientists 407–416 publications: 28 scientists 417–426 publications: 27 scientists 427–436 publications: 25 scientists 437–446 publications: 23 scientists 447–456 publications: 23 scientists 457–466 publications: 20 scientists 467–476 publications: 12 scientists 477–486 publications: 24 scientists 487–496 publications: 18 scientists 497–506 publications: 12 scientists 507–516 publications: 13 scientists 517–526 publications: 21 scientists 527–536 publications: 12 scientists 537–546 publications: 8 scientists 547–556 publications: 16 scientists 557–566 publications: 3 scientists 567–576 publications: 11 scientists 577–586 publications: 6 scientists 587–596 publications: 5 scientists 597–606 publications: 6 scientists 607–616 publications: 7 scientists 617–626 publications: 7 scientists 627–636 publications: 10 scientists 637–646 publications: 4 scientists 647–656 publications: 3 scientists 657–658 publications: 2 scientists 659+ publications: 100 scientists
47 publications 659+

This scientist: 593 publications — 96th percentile

96% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 659 publications or more.

Kenneth E. Goodson D-index placement in Mechanical and Aerospace Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Kenneth E. Goodson sits on this spectrum.

30 D-Index: 83 scientists 31 D-Index: 113 scientists 32 D-Index: 144 scientists 33 D-Index: 153 scientists 34 D-Index: 189 scientists 35 D-Index: 158 scientists 36 D-Index: 139 scientists 37 D-Index: 127 scientists 38 D-Index: 130 scientists 39 D-Index: 126 scientists 40 D-Index: 104 scientists 41 D-Index: 100 scientists 42 D-Index: 107 scientists 43 D-Index: 101 scientists 44 D-Index: 103 scientists 45 D-Index: 79 scientists 46 D-Index: 88 scientists 47 D-Index: 70 scientists 48 D-Index: 83 scientists 49 D-Index: 44 scientists 50 D-Index: 64 scientists 51 D-Index: 56 scientists 52 D-Index: 50 scientists 53 D-Index: 48 scientists 54 D-Index: 58 scientists 55 D-Index: 52 scientists 56 D-Index: 48 scientists 57 D-Index: 42 scientists 58 D-Index: 34 scientists 59 D-Index: 42 scientists 60 D-Index: 37 scientists 61 D-Index: 42 scientists 62 D-Index: 44 scientists 63 D-Index: 22 scientists 64 D-Index: 33 scientists 65 D-Index: 29 scientists 66 D-Index: 23 scientists 67 D-Index: 29 scientists 68 D-Index: 24 scientists 69 D-Index: 19 scientists 70 D-Index: 34 scientists 71 D-Index: 26 scientists 72 D-Index: 19 scientists 73 D-Index: 18 scientists 74 D-Index: 19 scientists 75 D-Index: 14 scientists 76 D-Index: 19 scientists 77 D-Index: 8 scientists 78 D-Index: 18 scientists 79 D-Index: 16 scientists 80 D-Index: 12 scientists 81 D-Index: 17 scientists 82 D-Index: 11 scientists 83 D-Index: 16 scientists 84 D-Index: 7 scientists 85 D-Index: 9 scientists 86 D-Index: 8 scientists 87 D-Index: 6 scientists 88 D-Index: 6 scientists 89 D-Index: 7 scientists 90 D-Index: 10 scientists 91 D-Index: 4 scientists 92 D-Index: 4 scientists 93+ D-Index: 100 scientists
30 D-Index 93+

This scientist: 102 D-Index — 98th percentile

98% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 93 D-Index or more.

Research.com Recognitions

  • 2026 - Research.com Mechanical and Aerospace Engineering in United States Leader Award
  • 2020 - Member of the National Academy of Engineering For developments in microprocessor thermal management and nanoscale heat conduction.
  • 2020 - Semiconductor Industry Association University Researcher Award
  • 2019 - Fellow, National Academy of Inventors
  • 2016 - Charles Russ Richards Memorial Award, The American Society of Mechanical Engineers
  • 2014 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers
  • 2014 - Fellow of American Physical Society (APS) Citation For contributions to the understanding of phonon and electron conduction in solid films, nanostructures, and in semiconductor nanoelectronics
  • 2013 - Fellow of the American Association for the Advancement of Science (AAAS)
  • 2011 - Fellow of the American Society of Mechanical Engineers

Overview

Kenneth E. Goodson is affiliated with Stanford University in the United States. Their research spans multiple disciplines within engineering and materials science, with a particular focus on thermal management and heat transfer phenomena.

The primary fields of study associated with Goodson's work include:

  • Engineering
  • Materials Science

Subfields of study within these broader categories highlight a specialization in:

  • Mechanical Engineering
  • Materials Chemistry
  • Electrical and Electronic Engineering
  • Civil and Structural Engineering
  • Biomedical Engineering

The main research topics covered by Goodson's publications include:

  • Heat Transfer and Boiling Studies
  • Heat Transfer and Optimization
  • Thermal properties of materials
  • Heat Transfer Mechanisms
  • Thermal Radiation and Cooling Technologies
  • Phase-change materials and chalcogenides
  • Advanced Thermoelectric Materials and Devices

Recent papers authored or co-authored by Goodson reflect these themes and include:

  • "Non-volatile electrically programmable integrated photonics with a 5-bit operation," 2023, published in Nature Communications
  • "A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks," 2022, published in International Journal of Heat and Mass Transfer
  • "The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics," 2021, published in IEEE Transactions on Components Packaging and Manufacturing Technology
  • "Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films," 2021, published in Nano Letters
  • "Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution," 2020, published in International Journal of Heat and Mass Transfer

Frequent co-authors collaborating with Goodson include:

  • Mehdi Asheghi
  • Heungdong Kwon
  • Christopher Perez
  • James W. Palko
  • Ercan M. Dede

Goodson's work is regularly published in specific venues such as:

  • Journal of Electronic Packaging
  • SSRN Electronic Journal
  • International Journal of Heat and Mass Transfer
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • Nano Letters

The scientist has been recognized with several awards, including:

  • Semiconductor Industry Association University Researcher Award (2020)
  • Member of the National Academy of Engineering (2020), for developments in microprocessor thermal management and nanoscale heat conduction
  • Fellow, National Academy of Inventors (2019)
  • Charles Russ Richards Memorial Award, The American Society of Mechanical Engineers (2016)
  • Fellow of American Physical Society (APS) (2014), cited for contributions to understanding phonon and electron conduction in solid films, nanostructures, and semiconductor nanoelectronics
  • Heat Transfer Memorial Award, The American Society of Mechanical Engineers (2014)
  • Fellow of the American Association for the Advancement of Science (AAAS) (2013)
  • Fellow of the American Society of Mechanical Engineers (2011)

Best Publications

  • Nanoscale thermal transport

    David G. Cahill;Wayne K. Ford;Kenneth E. Goodson;Gerald D. Mahan

  • Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature

    Eric Pop;David Mann;Qian Wang;Kenneth Goodson

  • Nanoscale thermal transport. II. 2003–2012

    David G. Cahill;Paul V. Braun;Gang Chen;David R. Clarke

  • A benchmark study on the thermal conductivity of nanofluids

    Jacopo Buongiorno;David C. Venerus;Naveen Prabhat;Thomas McKrell

  • Phonon scattering in silicon films with thickness of order 100 nm

    Y. S. Ju;K. E. Goodson

  • Heat Generation and Transport in Nanometer-Scale Transistors

    E. Pop;S. Sinha;K.E. Goodson

  • Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures

    David G. Cahill;Kenneth Goodson;Arunava Majumdar

  • Subpixel displacement and deformation gradient measurement using digital image/speckle correlation (DISC)

    Peng Zhou;Kenneth E. Goodson

  • Cooling system for electroosmosis micro channel

    Chuan-Hua Chen;Kenneth E Goodson;David E Huber;Linan Jiang

  • Thermal conduction in doped single-crystal silicon films

    M. Asheghi;K. Kurabayashi;R. Kasnavi;K. E. Goodson

  • Thermal Conduction in Aligned Carbon Nanotube–Polymer Nanocomposites with High Packing Density

    Amy Marie Marconnet;Namiko Yamamoto;Matthew A. Panzer;Brian L. Wardle

  • Negative differential conductance and hot phonons in suspended nanotube molecular wires.

    Eric Pop;David Mann;Jien Cao;Qian Wang

  • Material and manufacturing cost considerations for thermoelectrics

    Saniya LeBlanc;Saniya LeBlanc;Shannon K. Yee;Shannon K. Yee;Matthew L. Scullin;Chris Dames

  • Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

    M. Asheghi;M. N. Touzelbaev;K. E. Goodson;Y. K. Leung

  • Thermal conduction phenomena in carbon nanotubes and related nanostructured materials

    Amy M. Marconnet;Matthew A. Panzer;Kenneth E. Goodson

  • PHONON-BOUNDARY SCATTERING IN THIN SILICON LAYERS

    M. Asheghi;Y. K. Leung;S. S. Wong;K. E. Goodson

  • Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates

    Eric Pop;David A. Mann;Kenneth E. Goodson;Hongjie Dai

  • Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions

    Lian Zhang;Jae-Mo Koo;Linan Jiang;M. Asheghi

  • Measurement and modeling of self-heating in SOI nMOSFET's

    L.T. Su;J.E. Chung;D.A. Antoniadis;K.E. Goodson

  • Closed-loop electroosmotic microchannel cooling system for VLSI circuits

    Linan Jiang;J. Mikkelsen;Jae-Mo Koo;D. Huber

  • Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures review recent advances in experimental methods for high spatial-resolution and high

    David G. Cahill;Kenneth Goodson;Arunava Majumdar

Frequent Co-Authors

Mehdi Asheghi
Mehdi Asheghi Stanford University
Thomas W. Kenny
Thomas W. Kenny Stanford University
Eric Pop
Eric Pop Stanford University
Juan G. Santiago
Juan G. Santiago Stanford University
John K. Eaton
John K. Eaton Stanford University
H.-S. Philip Wong
H.-S. Philip Wong Stanford University
William P. King
William P. King University of Illinois at Urbana-Champaign
Yuan Gao
Yuan Gao Northeastern University
Ankur Jain
Ankur Jain The University of Texas at Arlington

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