Mehdi Asheghi is affiliated with Stanford University in the United States. Their research primarily spans the fields of Engineering and Materials Science, with significant contributions distributed across subfields such as Mechanical Engineering, Materials Chemistry, Electrical and Electronic Engineering, Civil and Structural Engineering, and Biomedical Engineering.
The scientist's work focuses on key topics related to heat transfer and material thermal properties. These main topics include:
Mehdi Asheghi has contributed to several recent papers spanning research on heat transfer, cooling techniques, and thermophysical characterization. Notable publications include:
Frequently publishing in venues geared toward electronic packaging and thermal studies, their key publication outlets include:
Collaborations are a significant aspect of Mehdi Asheghi's career. Frequent co-authors include Kenneth E. Goodson, Heungdong Kwon, James W. Palko, Ercan M. Dede, and Christopher Perez, with collaboration counts ranging from 15 to 71 joint works.
In addition to journal papers, Mehdi Asheghi has contributed to academic literature through a book published by World Scientific titled Embedded Cooling of Electronic Devices, released in 2023.
H P Wong;S Raoux;S Kim;J Liang
M. Asheghi;K. Kurabayashi;R. Kasnavi;K. E. Goodson
M. Asheghi;M. N. Touzelbaev;K. E. Goodson;Y. K. Leung
M. Asheghi;Y. K. Leung;S. S. Wong;K. E. Goodson
Lian Zhang;Jae-Mo Koo;Linan Jiang;M. Asheghi
W. Liu;M. Asheghi
Wenjun Liu;Mehdi Asheghi
Mohamed M. Sabry Aly;Mingyu Gao;Gage Hills;Chi-Shuen Lee
Wenjun Liu;Mehdi Asheghi
K. Kurabayashi;M. Asheghi;M. Touzelbaev;K.E. Goodson
S. Uma;A. D. McConnell;M. Asheghi;K. Kurabayashi
M. T. Barako;W. Park;A. M. Marconnet;M. Asheghi
Wenjun Liu;K. Etessam-Yazdani;R. Hussin;M. Asheghi
Ki Wook Jung;Chirag R. Kharangate;Hyoungsoon Lee;James Palko
Yoonjin Won;Jungwan Cho;Damena Agonafer;Mehdi Asheghi
Chiyui Ahn;Scott W. Fong;Yongsung Kim;Seunghyun Lee
Jungwan Cho;Zijian Li;E. Bozorg-Grayeli;T. Kodama
P. G. Sverdrup;S. Sinha;M. Asheghi;S. Uma
J.P. Reifenberg;Kuo-Wei Chang;M.A. Panzer;Sangbum Kim
Michael T. Barako;Shilpi Roy-Panzer;Timothy S. English;Takashi Kodama
Rakesh Jeyasingh;Scott W. Fong;Jaeho Lee;Zijian Li
Peng Li;L. T. Pileggi;M. Asheghi;R. Chandra
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