2005 - Member of the National Academy of Engineering For advances in thermal technologies for the cooling and temperature control of electronic equipment.
1997 - Fellow of the American Society of Mechanical Engineers
Roger R. Schmidt mainly focuses on Mechanical engineering, Electronics, Coolant, Heat exchanger and Rack. Inlet, Airflow, Water cooling, Active cooling and Computer cooling are the core of his Mechanical engineering study. The concepts of his Electronics study are interwoven with issues in Flow and Engineering drawing.
His research in Coolant intersects with topics in Mechanics, Heat transfer and Isolation valve. Heater core and Control logic is closely connected to Control valves in his research, which is encompassed under the umbrella topic of Heat exchanger. His Rack research includes themes of Mechanism, Electronic component, Enclosure, Duct and Manifold.
Roger R. Schmidt mostly deals with Mechanical engineering, Heat exchanger, Rack, Coolant and Electronics. His study in Air cooling, Water cooling, Computer cooling, Heat sink and Electronic component is carried out as part of his studies in Mechanical engineering. His Heat exchanger research integrates issues from Chiller, Active cooling, Automotive engineering, Control valves and Condenser.
His Rack study incorporates themes from Airflow, Inlet, Structural engineering, Raised floor and Flow. Roger R. Schmidt interconnects Nuclear engineering and Engineering drawing in the investigation of issues within Coolant. In his research, Heat pipe and Cold plate is intimately related to Thermal, which falls under the overarching field of Electronics.
Roger R. Schmidt mainly investigates Mechanical engineering, Heat exchanger, Coolant, Mechanics and Heat transfer. His Mechanical engineering study frequently intersects with other fields, such as Electronics. His Heat exchanger research incorporates themes from Chiller and Computer cooling.
His biological study spans a wide range of topics, including Flow and Condenser. The various areas that Roger R. Schmidt examines in his Heat transfer study include Electrical conductor and Tube. His studies in Rack integrate themes in fields like Inlet, Airflow and Structural engineering.
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Method and apparatus for combined air and liquid cooling of stacked electronics components
Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt.
(2002)
Method and apparatus for combined air and liquid cooling of stacked electronics components
Edward Furey.
(2002)
Method and system for cooling electronics racks using pre-cooled air
Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
E.G. Colgan;B. Furman;M. Gaynes;W.S. Graham.
IEEE Transactions on Components and Packaging Technologies (2007)
Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
Richard C. Chu;Michael J. Ellsworth;Donald W. Porter;Roger R. Schmidt.
(2005)
Review of cooling technologies for computer products
R.C. Chu;R.E. Simons;M.J. Ellsworth;R.R. Schmidt.
IEEE Transactions on Device and Materials Reliability (2004)
Challenges of data center thermal management
R. R. Schmidt;E. E. Cruz;M. K. Iyengar.
Ibm Journal of Research and Development (2005)
Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
Raschid Jose Bezama;Evan George Colgan;John Harold Magerlein;Roger Ray Schmidt.
(2004)
Optimization of data center room layout to minimize rack inlet air temperature
Siddharth Bhopte;Dereje Agonafer;Roger Schmidt;Bahgat Sammakia.
Journal of Electronic Packaging (2006)
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