D-Index & Metrics Best Publications

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Mechanical and Aerospace Engineering D-index 67 Citations 12,694 314 World Ranking 237 National Ranking 125

Research.com Recognitions

Awards & Achievements

2005 - Member of the National Academy of Engineering For advances in thermal technologies for the cooling and temperature control of electronic equipment.

1997 - Fellow of the American Society of Mechanical Engineers

Overview

What is he best known for?

The fields of study he is best known for:

  • Mechanical engineering
  • Electrical engineering
  • Thermodynamics

Roger R. Schmidt mainly focuses on Mechanical engineering, Electronics, Coolant, Heat exchanger and Rack. Inlet, Airflow, Water cooling, Active cooling and Computer cooling are the core of his Mechanical engineering study. The concepts of his Electronics study are interwoven with issues in Flow and Engineering drawing.

His research in Coolant intersects with topics in Mechanics, Heat transfer and Isolation valve. Heater core and Control logic is closely connected to Control valves in his research, which is encompassed under the umbrella topic of Heat exchanger. His Rack research includes themes of Mechanism, Electronic component, Enclosure, Duct and Manifold.

His most cited work include:

  • Method and apparatus for combined air and liquid cooling of stacked electronics components (245 citations)
  • Method and system for cooling electronics racks using pre-cooled air (221 citations)
  • Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack (193 citations)

What are the main themes of his work throughout his whole career to date?

Roger R. Schmidt mostly deals with Mechanical engineering, Heat exchanger, Rack, Coolant and Electronics. His study in Air cooling, Water cooling, Computer cooling, Heat sink and Electronic component is carried out as part of his studies in Mechanical engineering. His Heat exchanger research integrates issues from Chiller, Active cooling, Automotive engineering, Control valves and Condenser.

His Rack study incorporates themes from Airflow, Inlet, Structural engineering, Raised floor and Flow. Roger R. Schmidt interconnects Nuclear engineering and Engineering drawing in the investigation of issues within Coolant. In his research, Heat pipe and Cold plate is intimately related to Thermal, which falls under the overarching field of Electronics.

He most often published in these fields:

  • Mechanical engineering (48.03%)
  • Heat exchanger (25.56%)
  • Rack (23.03%)

What were the highlights of his more recent work (between 2011-2017)?

  • Mechanical engineering (48.03%)
  • Heat exchanger (25.56%)
  • Coolant (22.47%)

In recent papers he was focusing on the following fields of study:

Roger R. Schmidt mainly investigates Mechanical engineering, Heat exchanger, Coolant, Mechanics and Heat transfer. His Mechanical engineering study frequently intersects with other fields, such as Electronics. His Heat exchanger research incorporates themes from Chiller and Computer cooling.

His biological study spans a wide range of topics, including Flow and Condenser. The various areas that Roger R. Schmidt examines in his Heat transfer study include Electrical conductor and Tube. His studies in Rack integrate themes in fields like Inlet, Airflow and Structural engineering.

Between 2011 and 2017, his most popular works were:

  • Techniques for Data Center Cooling (83 citations)
  • Server liquid cooling with chiller-less data center design to enable significant energy savings (80 citations)
  • Dynamically limiting energy consumed by cooling apparatus (58 citations)

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Method and apparatus for combined air and liquid cooling of stacked electronics components

Richard C. Chu;Michael J. Ellsworth;Edward Furey;Roger R. Schmidt.
(2002)

377 Citations

Method and apparatus for combined air and liquid cooling of stacked electronics components

Edward Furey.
(2002)

376 Citations

Method and system for cooling electronics racks using pre-cooled air

Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)

333 Citations

A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

E.G. Colgan;B. Furman;M. Gaynes;W.S. Graham.
IEEE Transactions on Components and Packaging Technologies (2007)

295 Citations

Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack

Richard C. Chu;Michael J. Ellsworth;Donald W. Porter;Roger R. Schmidt.
(2005)

291 Citations

Review of cooling technologies for computer products

R.C. Chu;R.E. Simons;M.J. Ellsworth;R.R. Schmidt.
IEEE Transactions on Device and Materials Reliability (2004)

278 Citations

Challenges of data center thermal management

R. R. Schmidt;E. E. Cruz;M. K. Iyengar.
Ibm Journal of Research and Development (2005)

278 Citations

Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack

Richard C. Chu;Michael J. Ellsworth;Roger R. Schmidt;Robert E. Simons.
(2003)

225 Citations

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages

Raschid Jose Bezama;Evan George Colgan;John Harold Magerlein;Roger Ray Schmidt.
(2004)

192 Citations

Optimization of data center room layout to minimize rack inlet air temperature

Siddharth Bhopte;Dereje Agonafer;Roger Schmidt;Bahgat Sammakia.
Journal of Electronic Packaging (2006)

190 Citations

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