What is he best known for?
The fields of study he is best known for:
- Electrical engineering
- Optics
- Mechanical engineering
Evan G. Colgan mainly investigates Optoelectronics, Layer, Electrical engineering, Electronic engineering and Substrate.
His Optoelectronics research includes themes of Pixel, Microchannel, Chip and Power density.
His biological study spans a wide range of topics, including Cold plate, Manifold and Silicon.
He has included themes like Thin film, Chemical engineering and Voltage in his Layer study.
His Electronic engineering research is multidisciplinary, incorporating elements of Thermal expansion, Thermal conductivity, Composite material and Thermal management of electronic devices and systems.
His Liquid-crystal display research is multidisciplinary, relying on both Resistor and Electrical conductor.
His most cited work include:
- A Practical Implementation of Silicon Microchannel Coolers for High Power Chips (185 citations)
- Liquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layer (165 citations)
- Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling (126 citations)
What are the main themes of his work throughout his whole career to date?
His primary areas of investigation include Optoelectronics, Electronic engineering, Chip, Electrical engineering and Layer.
Evan G. Colgan combines subjects such as Microchannel, Substrate and Thin-film transistor with his study of Optoelectronics.
He interconnects Semiconductor device, Composite material and Semiconductor in the investigation of issues within Electronic engineering.
His Chip research also works with subjects such as
- Integrated circuit which intersects with area such as Interconnection,
- Mechanical engineering together with Heat transfer and Thermal.
He works mostly in the field of Electrical engineering, limiting it down to concerns involving Interposer and, occasionally, Electrical contacts.
His Layer research is multidisciplinary, relying on both Electrical conductor and Display device.
He most often published in these fields:
- Optoelectronics (45.96%)
- Electronic engineering (20.71%)
- Chip (19.19%)
What were the highlights of his more recent work (between 2013-2021)?
- Chip (19.19%)
- Optoelectronics (45.96%)
- Mechanical engineering (11.11%)
In recent papers he was focusing on the following fields of study:
Evan G. Colgan spends much of his time researching Chip, Optoelectronics, Mechanical engineering, Coolant and Mechanics.
His Chip study combines topics from a wide range of disciplines, such as Frame, Integrated circuit, Electronic engineering, Heat spreader and Stiffening.
His Electronic engineering research includes elements of Bundle, Computer cluster, Duplex and N connector.
He usually deals with Optoelectronics and limits it to topics linked to Substrate and Soldering.
The Coolant study combines topics in areas such as Pressure drop, Thermal and Heat transfer.
His study in Mechanics is interdisciplinary in nature, drawing from both Manifold and Phase, Electrical engineering, Cable gland.
Between 2013 and 2021, his most popular works were:
- Hydrodynamics of diamond-shaped gradient nanopillar arrays for effective DNA translocation into nanochannels. (23 citations)
- Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels (21 citations)
- Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules (19 citations)
In his most recent research, the most cited papers focused on:
- Mechanical engineering
- Electrical engineering
- Optics
His primary areas of study are Coolant, Thermal, Electronic engineering, Chip and Mechanics.
Evan G. Colgan has included themes like Optoelectronics and Pressure drop in his Coolant study.
In his research, Etching is intimately related to Critical heat flux, which falls under the overarching field of Optoelectronics.
His Thermal research includes themes of Graphite, Composite material, Heat spreader and Copper.
His Electronic engineering study frequently draws connections between related disciplines such as Integrated circuit.
His research in Mechanics intersects with topics in Resistance thermometer and Phase.
This overview was generated by a machine learning system which analysed the scientist’s
body of work. If you have any feedback, you can
contact us
here.
