The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where Evan G. Colgan sits on this spectrum.
This scientist: 170 publications — 36th percentile
36% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 804 publications or more.
The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where Evan G. Colgan sits on this spectrum.
This scientist: 43 D-Index — 39th percentile
39% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 107 D-Index or more.
Evan G. Colgan is affiliated with IBM in the United States. Their research has primarily focused on the fields of engineering, with specific expertise in mechanical engineering and civil and structural engineering. The main topics addressed in their work include heat transfer and optimization, thermal radiation and cooling technologies, and heat transfer and boiling studies.
Their scholarly output features a paper titled "Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler", published in 2023 in the IEEE Transactions on Components Packaging and Manufacturing Technology. This paper has garnered citations indicating engagement within the academic community.
Coauthors who frequently collaborate with Evan G. Colgan include:
Their publications have appeared predominantly in the IEEE Transactions on Components Packaging and Manufacturing Technology venue. This reflects a consistent focus on technology related to components and packaging within engineering disciplines.
The scientific contributions of Evan G. Colgan concentrate on understanding and developing technologies related to heat transfer processes and cooling methods, addressing practical challenges in thermal management and optimization. Their interdisciplinary work spans several engineering subfields with applications relevant to both mechanical and structural aspects.
Jian Li;J. W. Mayer;E. G. Colgan
Evan G. Colgan;Laura L. Kosbar;Alan E. Rosenbluth
E.G. Colgan;B. Furman;M. Gaynes;W.S. Graham
Shawn A. Hall;Shurong Tian;Paul W. Coteus;John P. Karidis
Raschid Jose Bezama;Evan George Colgan;John Harold Magerlein;Roger Ray Schmidt
Evan G. Colgan;Peter M. Fryer
J. O. Olowolafe;Jian Li;J. W. Mayer;E. G. Colgan
Evan G. Colgan;Peter M. Fryer
Evan George Colgan;Fuad Elias Doany;Bruce Kenneth Furman;Daniel J. Stigliani
E. G. Colgan;M. Nastasi;J. W. Mayer
E.G. Colgan;B. Furman;A. Gaynes;W. Graham
J. U. Knickerbocker;P. S. Andry;E. Colgan;B. Dang
Evan George Colgan;James Lewis Levine;Michael Alan Schappert
Evan George Colgan;Jeffrey D. Gelorme;Kamal K. Sikka;Hilton T. Toy
Evan G. Colgan;Eisuke Kanzaki;Satoshi Karube;Mikio Kurihara
Evan G. Colgan;Bruce K. Furman;Christopher V. Jahnes
Lawrence S. Mok;Evan G. Colgan;Minhua Lu;Da-Yuan Shih
Paul S. Andry;Thomas J. Brunschwiler;Evan G. Colgan;John H. Magerlein
Evan G. Colgan;Fuad E. Doany;Akiko Nishikai;Rama N. Singh
Paul S. Andry;Evan G. Colgan;Lawrence S. Mok;Chirag S. Patel
Thomas M. Cipolla;Shurong Tian;Evan George Colgan;Paul W. Coteus
Gareth G. Hougham;Brian S. Beaman;Evan G. Colgan;Paul W. Coteus
E. G. Colgan;B. Furman;M. Gaynes;N. LaBianca
Thomas M. Cipolla;Evan George Colgan;Paul W. Coteus;Shawn Anthony Hall
If you think any of the details on this page are incorrect, let us know.
Colorado State University
University of Louisville
Tel Aviv University
University of Toronto
United States Geological Survey
University of Toronto
Yamaguchi University
University of Western Australia
Tampere University
Bocconi University
Nanjing University
Pfizer (United States)
University of Nairobi
Centers for Disease Control and Prevention
Nagoya University
TU Bergakademie Freiberg
