Evan G. Colgan

Overview

Best Publications

• Oxidation and protection in copper and copper alloy thin films

  Jian Li;J. W. Mayer;E. G. Colgan

  371
  Citations

• Micromechanical display and fabrication method

  Evan G. Colgan;Laura L. Kosbar;Alan E. Rosenbluth

  333
  Citations

• A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

  E.G. Colgan;B. Furman;M. Gaynes;W.S. Graham

  329
  Citations

• Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling

  Shawn A. Hall;Shurong Tian;Paul W. Coteus;John P. Karidis

  195
  Citations

• Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages

  Raschid Jose Bezama;Evan George Colgan;John Harold Magerlein;Roger Ray Schmidt

  192
  Citations

• STRUCTURE AND METHOD OF MAKING ALPHA-Ta IN THIN FILMS

  Evan G. Colgan;Peter M. Fryer

  171
  Citations

• Effects of oxygen in TiNx on the diffusion of Cu in Cu/TiN/Al and Cu/TiNx/Si structures

  J. O. Olowolafe;Jian Li;J. W. Mayer;E. G. Colgan

  165
  Citations

• Method of making Alpha-Ta thin films

  Evan G. Colgan;Peter M. Fryer

  164
  Citations

• Devices and methods for side-coupling optical fibers to optoelectronic components

  Evan George Colgan;Fuad Elias Doany;Bruce Kenneth Furman;Daniel J. Stigliani

  152
  Citations

• Initial phase formation and dissociation in the thin‐film Ni/Al system

  E. G. Colgan;M. Nastasi;J. W. Mayer

  149
  Citations

• A practical implementation of silicon microchannel coolers for high power chips

  E.G. Colgan;B. Furman;A. Gaynes;W. Graham

  135
  Citations

• 2.5D and 3D technology challenges and test vehicle demonstrations

  J. U. Knickerbocker;P. S. Andry;E. Colgan;B. Dang

  130
  Citations

• Touch screen stylus with IR-coupled selection buttons

  Evan George Colgan;James Lewis Levine;Michael Alan Schappert

  129
  Citations

• Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures

  Evan George Colgan;Jeffrey D. Gelorme;Kamal K. Sikka;Hilton T. Toy

  123
  Citations

• Liquid crystal display with integrated resistive touch sensor

  Evan G. Colgan;Eisuke Kanzaki;Satoshi Karube;Mikio Kurihara

  122
  Citations

• Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale

  Evan G. Colgan;Bruce K. Furman;Christopher V. Jahnes

  119
  Citations

• Thermal interposer for thermal management of semiconductor devices

  Lawrence S. Mok;Evan G. Colgan;Minhua Lu;Da-Yuan Shih

  119
  Citations

• Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate

  Paul S. Andry;Thomas J. Brunschwiler;Evan G. Colgan;John H. Magerlein

  112
  Citations

• Highly collimating tapered light guide for uniform illumination of flat panel displays

  Evan G. Colgan;Fuad E. Doany;Akiko Nishikai;Rama N. Singh

  110
  Citations

• Apparatus and methods for cooling semiconductor integrated circuit chip packages

  Paul S. Andry;Evan G. Colgan;Lawrence S. Mok;Chirag S. Patel

  104
  Citations

• Method and apparatus of water cooling several parallel circuit cards each containing several chip packages

  Thomas M. Cipolla;Shurong Tian;Evan George Colgan;Paul W. Coteus

  102
  Citations

• Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material

  Gareth G. Hougham;Brian S. Beaman;Evan G. Colgan;Paul W. Coteus

  95
  Citations

• High performance and subambient silicon microchannel cooling

  E. G. Colgan;B. Furman;M. Gaynes;N. LaBianca

  89
  Citations

• Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages

  Thomas M. Cipolla;Evan George Colgan;Paul W. Coteus;Shawn Anthony Hall

  85
  Citations