World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
43
Citations
7492
World Ranking
3901
National Ranking
1405

Overview

Fuad E. Doany is affiliated with IBM in the United States. Their work is centered within this organization, contributing to the research environment of a major technology company.

There are no records available for recent papers authored by Fuad E. Doany, nor listings of frequent co-authors or prominent publication venues. Likewise, information on book publications, fields of study, subfields, or specific research topics is not documented.

No awards or distinctions have been recorded for this scientist, and it is noted that they are currently living.

Best Publications

  • A 71-Gb/s NRZ Modulated 850-nm VCSEL-Based Optical Link

    Daniel M. Kuchta;Alexander V. Rylyakov;Fuad E. Doany;Clint L. Schow

  • Carrier lifetime versus ion‐implantation dose in silicon on sapphire

    F. E. Doany;D. Grischkowsky;C.‐C. Chi

  • Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies

    L. Schares;J.A. Kash;F.E. Doany;C.L. Schow

  • Efficient optical system for a high resolution projection display employing reflection light valves

    George Liang-Tai Chiu;Thomas Mario Cipolla;Fuad Elias Doany;Derek Brian Dove

  • Sputter deposition of hydrogenated amorphous carbon film and applications thereof

    Edward D. Babich;Alessandro Cesare Callegari;Fuad Elias Doany;Sampath Purushothaman

  • Non-Blocking 4x4 Electro-Optic Silicon Switch for On-Chip Photonic Networks

    Min Yang;William M. J. Green;Solomon Assefa;Joris Van Campenhout

  • 160 Gb/s Bidirectional Polymer-Waveguide Board-Level Optical Interconnects Using CMOS-Based Transceivers

    F.E. Doany;C.L. Schow;C.W. Baks;D.M. Kuchta

  • Devices and methods for side-coupling optical fibers to optoelectronic components

    Evan George Colgan;Fuad Elias Doany;Bruce Kenneth Furman;Daniel J. Stigliani

  • Parallel optical transceiver module

    Fuad E. Doany;Christopher V. Jahnes;Clint L. Schow;Mehmet Soyuer

  • Method for fabricating multi-layer thin film structure having a separation layer

    Gnanalingam Arjavalingam;Alina Deutsch;Fuad E. Doany;Bruce K. Furman

  • Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers

    F. E. Doany;C. L. Schow;B. G. Lee;R. A. Budd

  • Highly efficient and compact frontlighting for polarization-based reflection light valves

    Russell Alan Budd;Fuad Elias Doany;Rama Nand Singh

  • Highly collimating tapered light guide for uniform illumination of flat panel displays

    Evan G. Colgan;Fuad E. Doany;Akiko Nishikai;Rama N. Singh

  • Terabit/Sec VCSEL-Based 48-Channel Optical Module Based on Holey CMOS Transceiver IC

    F. E. Doany;B. G. Lee;D. M. Kuchta;A. V. Rylyakov

  • Low power and high density optical interconnects for future supercomputers

    Petar Pepeljugoski;Jeffrey Kash;Fuad Doany;Daniel Kuchta

  • Structural design and processes to control probe position accuracy in a wafer test probe assembly

    Brian Beaman;Fuad Doany;Keith Fogel;James Hedrick

  • Ge-on-SOI-Detector/Si-CMOS-Amplifier Receivers for High-Performance Optical-Communication Applications

    S.J. Koester;C.L. Schow;L. Schares;G. Dehlinger

  • High efficiency field-sequential color projector using two SLMs

    Fuad Elias Doany;Alan Edward Rosenbluth

  • Multichannel High-Bandwidth Coupling of Ultradense Silicon Photonic Waveguide Array to Standard-Pitch Fiber Array

    Fuad E Doany;Benjamin G Lee;Solomon Assefa;William M J Green

  • High-performance 850 nm VCSEL and photodetector arrays for 25 Gb/s parallel optical interconnects

    N. Y. Li;C. L. Schow;D. M. Kuchta;F. E. Doany

  • End-to-End Multicore Multimode Fiber Optic Link Operating up to 120 Gb/s

    B. G. Lee;D. M. Kuchta;F. E. Doany;C. L. Schow

Frequent Co-Authors

Clint L. Schow
Clint L. Schow University of California, Santa Barbara
Daniel M. Kuchta
Daniel M. Kuchta IBM (United States)
Christian W. Baks
Christian W. Baks IBM (United States)
Benjamin G. Lee
Benjamin G. Lee Nvidia (United States)
Alexander V. Rylyakov
Alexander V. Rylyakov Nokia (United States)
Christopher V. Jahnes
Christopher V. Jahnes IBM (United States)
Sampath Purushothaman
Sampath Purushothaman IBM (United States)
Yurii A. Vlasov
Yurii A. Vlasov University of Illinois at Urbana-Champaign
Cornelia K. Tsang
Cornelia K. Tsang IBM Thomas J. Watson Research Center
Da-Yuan Shih
Da-Yuan Shih IBM (United States)

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