Cornelia K. Tsang

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name Citations Publications World Ranking National Ranking

Electronics and Electrical Engineering D-index 37 Citations 5,725 93 World Ranking 3316 National Ranking 1276

Three-dimensional silicon integration

J. U. Knickerbocker;P. S. Andry;B. Dang;R. R. Horton.
Journal of Reproduction and Development (2008)

537 Citations

Package structures to improve on-chip antenna performance

Bing Dang;Duixian Liu;Loïc Marnat;Atif Shamim.
(2012)

331 Citations

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

J. U. Knickerbocker;P. S. Andry;L. P. Buchwalter;A. Deutsch.
Ibm Journal of Research and Development (2005)

303 Citations

Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies

L. Schares;J.A. Kash;F.E. Doany;C.L. Schow.
IEEE Journal of Selected Topics in Quantum Electronics (2006)

295 Citations

3D silicon integration

J.U. Knickerbocker;P.S. Andry;B. Dang;R.R. Horton.
electronic components and technology conference (2008)

289 Citations

Silicon chip carrier with conductive through-vias and method for fabricating same

Daniel Charles Edelstein;Paul Stephen Andry;Leena Paivikki Buchwalter;Jon Alfred Casey.
(2003)

262 Citations

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

J.U. Knickerbocker;C.S. Patel;P.S. Andry;C.K. Tsang.
IEEE Journal of Solid-state Circuits (2006)

242 Citations

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Paul S. Andry;John M. Cotte;John U. Knickerbocker;Cornelia K. Tsang.
(2009)

190 Citations

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

K. Sakuma;P. S. Andry;C. K. Tsang;S. L. Wright.
Journal of Reproduction and Development (2008)

187 Citations

Conductive through via structure and process for electronic device carriers

Paul S. Andry;Chirag S. Patel;Edmund J. Sprogis;Cornelia K. Tsang.
(2005)

168 Citations

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