World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
40
Citations
6047
World Ranking
4536
National Ranking
1607

Overview

Cornelia K. Tsang is affiliated with the IBM Thomas J. Watson Research Center in the United States. Their work is associated with this prominent research institution known for contributions to computer science and applied research.

While specific publications, co-authors, and detailed fields of study are not available, the affiliation suggests involvement in advanced computational or technological research commonly conducted at the IBM Watson Research Center.

The absence of listed recent papers or frequent publication venues indicates that publicly accessible bibliographic data about the scientist's output is limited or not provided in the current dataset.

There is also no information on awards, book publications, or defined main topics and subfields of study, which implies either an early career stage or restricted data access.

They are currently living, as no data indicates otherwise.

Best Publications

  • Three-dimensional silicon integration

    J. U. Knickerbocker;P. S. Andry;B. Dang;R. R. Horton

  • Package structures to improve on-chip antenna performance

    Bing Dang;Duixian Liu;Loïc Marnat;Atif Shamim

  • Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

    J. U. Knickerbocker;P. S. Andry;L. P. Buchwalter;A. Deutsch

  • Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies

    L. Schares;J.A. Kash;F.E. Doany;C.L. Schow

  • 3D silicon integration

    J.U. Knickerbocker;P.S. Andry;B. Dang;R.R. Horton

  • Silicon chip carrier with conductive through-vias and method for fabricating same

    Daniel Charles Edelstein;Paul Stephen Andry;Leena Paivikki Buchwalter;Jon Alfred Casey

  • 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

    J.U. Knickerbocker;C.S. Patel;P.S. Andry;C.K. Tsang

  • 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

    K. Sakuma;P. S. Andry;C. K. Tsang;S. L. Wright

  • Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

    Paul S. Andry;John M. Cotte;John U. Knickerbocker;Cornelia K. Tsang

  • Conductive through via structure and process for electronic device carriers

    Paul S. Andry;Chirag S. Patel;Edmund J. Sprogis;Cornelia K. Tsang

  • Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

    P. S. Andry;C. K. Tsang;B. C. Webb;E. J. Sprogis

  • A CMOS-compatible process for fabricating electrical through-vias in silicon

    P.S. Andry;C. Tsang;E. Sprogis;C. Patel

  • Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

    S.L. Wright;R. Polastre;H. Gan;L.P. Buchwalter

  • Si-based packaging with integrated passive components

    Michael Cotte John;Paul Gaucher Brian;Janusz Grzyb;Deneke Hoivik Nils

  • 3D copper TSV integration, testing and reliability

    M. G. Farooq;T. L. Graves-Abe;W. F. Landers;C. Kothandaraman

  • 2.5D and 3D technology challenges and test vehicle demonstrations

    J. U. Knickerbocker;P. S. Andry;E. Colgan;B. Dang

  • Small area, robust silicon via structure and process

    Paul S. Andry;John M. Cotte;John Ulrich Knickerbocker;Cornelia K. Tsang

  • Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers

    F. E. Doany;C. L. Schow;B. G. Lee;R. A. Budd

  • Through silicon via for use in integrated circuit chips

    Paul Stephen Andry;Edmund Juris Sprogis;Cornelia Kang-I Tsang

  • 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections

    K. Sakuma;P.S. Andry;B. Dang;J. Maria

Frequent Co-Authors

Paul S. Andry
Paul S. Andry IBM (United States)
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Edmund J. Sprogis
Edmund J. Sprogis IBM (United States)
Fuad E. Doany
Fuad E. Doany IBM (United States)
Christian W. Baks
Christian W. Baks IBM (United States)
Clint L. Schow
Clint L. Schow University of California, Santa Barbara
Daniel M. Kuchta
Daniel M. Kuchta IBM (United States)
Xiaoxiong Gu
Xiaoxiong Gu IBM (United States)
Subramanian S. Iyer
Subramanian S. Iyer University of California, Los Angeles
Christopher V. Jahnes
Christopher V. Jahnes IBM (United States)

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