World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
40
Citations
6047
World Ranking
4536
National Ranking
1608

Cornelia K. Tsang publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Cornelia K. Tsang sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 97 publications — 3rd percentile

3% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Cornelia K. Tsang D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Cornelia K. Tsang sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 40 D-Index — 36th percentile

36% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Cornelia K. Tsang is affiliated with the IBM Thomas J. Watson Research Center in the United States. Their work is associated with this prominent research institution known for contributions to computer science and applied research.

While specific publications, co-authors, and detailed fields of study are not available, the affiliation suggests involvement in advanced computational or technological research commonly conducted at the IBM Watson Research Center.

The absence of listed recent papers or frequent publication venues indicates that publicly accessible bibliographic data about the scientist's output is limited or not provided in the current dataset.

There is also no information on awards, book publications, or defined main topics and subfields of study, which implies either an early career stage or restricted data access.

They are currently living, as no data indicates otherwise.

Best Publications

  • Three-dimensional silicon integration

    J. U. Knickerbocker;P. S. Andry;B. Dang;R. R. Horton

  • Package structures to improve on-chip antenna performance

    Bing Dang;Duixian Liu;Loïc Marnat;Atif Shamim

  • Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

    J. U. Knickerbocker;P. S. Andry;L. P. Buchwalter;A. Deutsch

  • Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies

    L. Schares;J.A. Kash;F.E. Doany;C.L. Schow

  • 3D silicon integration

    J.U. Knickerbocker;P.S. Andry;B. Dang;R.R. Horton

  • Silicon chip carrier with conductive through-vias and method for fabricating same

    Daniel Charles Edelstein;Paul Stephen Andry;Leena Paivikki Buchwalter;Jon Alfred Casey

  • 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

    J.U. Knickerbocker;C.S. Patel;P.S. Andry;C.K. Tsang

  • 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

    K. Sakuma;P. S. Andry;C. K. Tsang;S. L. Wright

  • Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

    Paul S. Andry;John M. Cotte;John U. Knickerbocker;Cornelia K. Tsang

  • Conductive through via structure and process for electronic device carriers

    Paul S. Andry;Chirag S. Patel;Edmund J. Sprogis;Cornelia K. Tsang

  • Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

    P. S. Andry;C. K. Tsang;B. C. Webb;E. J. Sprogis

  • A CMOS-compatible process for fabricating electrical through-vias in silicon

    P.S. Andry;C. Tsang;E. Sprogis;C. Patel

  • Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

    S.L. Wright;R. Polastre;H. Gan;L.P. Buchwalter

  • Si-based packaging with integrated passive components

    Michael Cotte John;Paul Gaucher Brian;Janusz Grzyb;Deneke Hoivik Nils

  • 3D copper TSV integration, testing and reliability

    M. G. Farooq;T. L. Graves-Abe;W. F. Landers;C. Kothandaraman

  • 2.5D and 3D technology challenges and test vehicle demonstrations

    J. U. Knickerbocker;P. S. Andry;E. Colgan;B. Dang

  • Small area, robust silicon via structure and process

    Paul S. Andry;John M. Cotte;John Ulrich Knickerbocker;Cornelia K. Tsang

  • Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers

    F. E. Doany;C. L. Schow;B. G. Lee;R. A. Budd

  • Through silicon via for use in integrated circuit chips

    Paul Stephen Andry;Edmund Juris Sprogis;Cornelia Kang-I Tsang

  • 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections

    K. Sakuma;P.S. Andry;B. Dang;J. Maria

Frequent Co-Authors

Paul S. Andry
Paul S. Andry IBM (United States)
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Edmund J. Sprogis
Edmund J. Sprogis IBM (United States)
Fuad E. Doany
Fuad E. Doany IBM (United States)
Clint L. Schow
Clint L. Schow University of California, Santa Barbara
Jeffrey A. Kash
Jeffrey A. Kash Columbia University
Christian W. Baks
Christian W. Baks IBM (United States)
Daniel M. Kuchta
Daniel M. Kuchta IBM (United States)
Evan G. Colgan
Evan G. Colgan IBM (United States)
Subramanian S. Iyer
Subramanian S. Iyer University of California, Los Angeles

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Related Online Degrees & Career Pathways

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