World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
32
Citations
5068
World Ranking
6242
National Ranking
2060

Kyle K. Kirby publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Kyle K. Kirby sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 63 publications — 1st percentile

1% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Kyle K. Kirby D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Kyle K. Kirby sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 32 D-Index — 10th percentile

10% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Mechanical engineering
  • Integrated circuit

His primary areas of investigation include Optoelectronics, Substrate, Electrical conductor, Microelectronics and Integrated circuit. His work carried out in the field of Optoelectronics brings together such families of science as Layer, Terminal, Die and Electronic engineering. Kyle K. Kirby has included themes like Electrical contacts and Semiconductor in his Terminal study.

As part of one scientific family, Kyle K. Kirby deals mainly with the area of Die, narrowing it down to issues related to the Wafer, and often Lens, Image sensor, Base and Wire bonding. His Electrical conductor research focuses on Conductive materials in particular. Kyle K. Kirby interconnects Parasitic extraction, Signal and Wafer-level packaging in the investigation of issues within Integrated circuit.

His most cited work include:

  • Multi-dice chip scale semiconductor components and wafer level methods of fabrication (361 citations)
  • Through-wafer interconnects for photoimager and memory wafers (190 citations)
  • Packaged microelectronic imagers and methods of packaging microelectronic imagers (180 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of study are Optoelectronics, Substrate, Electrical conductor, Electronic engineering and Semiconductor device. The concepts of his Optoelectronics study are interwoven with issues in Layer, Conductive materials and Die. In Substrate, Kyle K. Kirby works on issues like Image sensor, which are connected to Lens.

In his study, which falls under the umbrella issue of Electrical conductor, Electrically conductive is strongly linked to Microelectronics. As part of his studies on Electronic engineering, Kyle K. Kirby often connects relevant subjects like Mechanical engineering. Kyle K. Kirby has included themes like Structural engineering, Coating and Active surface in his Semiconductor device study.

He most often published in these fields:

  • Optoelectronics (68.57%)
  • Substrate (45.00%)
  • Electrical conductor (35.71%)

What were the highlights of his more recent work (between 2010-2021)?

  • Optoelectronics (68.57%)
  • Semiconductor device (29.29%)
  • Substrate (45.00%)

In recent papers he was focusing on the following fields of study:

Kyle K. Kirby mainly focuses on Optoelectronics, Semiconductor device, Substrate, Electrical conductor and Conductive materials. Kyle K. Kirby mostly deals with Semiconductor in his studies of Optoelectronics. His Semiconductor device research includes themes of Soldering, Die and Active surface.

As a part of the same scientific family, Kyle K. Kirby mostly works in the field of Substrate, focusing on Pillar and, on occasion, Thermal copper pillar bump. His Electrical conductor study integrates concerns from other disciplines, such as Dielectric and Microelectronics. Within one scientific family, Kyle K. Kirby focuses on topics pertaining to Die under Electrical engineering, and may sometimes address concerns connected to Electrical connection and Integrated circuit.

Between 2010 and 2021, his most popular works were:

  • Semiconductor with through-substrate interconnect (104 citations)
  • Disabling electrical connections using pass-through 3d interconnects and associated systems and methods (82 citations)
  • Microelectronic devices with through-substrate interconnects and associated methods of manufacturing (39 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Mechanical engineering
  • Semiconductor

Kyle K. Kirby mostly deals with Optoelectronics, Substrate, Semiconductor device, Dielectric and Electronic engineering. The concepts of his Substrate study are interwoven with issues in Die and Microelectronics. His studies deal with areas such as Integrated circuit, Tungsten, Silicon and Electrical connection as well as Microelectronics.

His studies in Semiconductor device integrate themes in fields like Conductive materials and Substrate. His Dielectric research integrates issues from Electrical conductor and Composite material. His research on Electronic engineering often connects related areas such as Semiconductor.

Best Publications

  • Semiconductor component having plate, stacked dice and conductive vias

    Warren M. Farnworth;Alan G. Wood;William M. Hiatt;James M. Wark

  • Image sensor packages and frame structure thereof

    Alan G. Wood;Kyle K. Kirby;Warren M. Farnworth;Salman Akram

  • Through-wafer interconnects for photoimager and memory wafers

    Salman Akram;Charles M. Watkins;Mark Hiatt;David R. Hembree

  • Methods of forming conductive vias and methods of forming multichip modules including such conductive vias

    Kyle K. Kirby;Warren M. Farnworth

  • Packaged microelectronic imagers and methods of packaging microelectronic imagers

    Salman Akram;Charles M. Watkins;Kyle K. Kirby;Alan G. Wood

  • Microelectronics devices, having vias, and packaged microelectronic devices having vias

    Sidney B. Rigg;Charles M. Watkins;Kyle K. Kirby;Peter A. Benson

  • Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods

    Kyle K. Kirby

  • Microelectronic devices and methods for forming interconnects in microelectronic devices

    Kyle K. Kirby;Salman Akram;David R. Hembree;Sidney B. Rigg

  • Semiconductor with through-substrate interconnect

    Kyle K. Kirby;Kunal R. Parekh

  • Pass-through interconnect structure for microelectronic dies and associated systems and methods

    David S. Pratt;Kyle K. Kirby;Dewali Ray

  • Semiconductor components and assemblies including vias of varying lateral dimensions

    Kyle K. Kirby;Warren M. Farnworth

  • Microelectronic devices and methods for filing vias in microelectronic devices

    William M. Hiatt;Kyle K. Kirby

  • Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods

    Steve Oliver;Kyle K. Kirby;Warren M. Farnworth;William M. Hiatt

  • Disabling electrical connections using pass-through 3d interconnects and associated systems and methods

    Jeffery W. Janzen;Michael Chaine;Kyle K. Kirby;William M. Hiatt

  • Microfeature workpieces and methods for forming interconnects in microfeature workpieces

    Kyle K. Kirby;William M. Hiatt;Richard L. Stocks

  • Method for fabricating semiconductor components with conductive spring contacts

    Kyle K. Kirby;Warren M. Farnworth

  • Microelectronic imagers and methods of packaging microelectronic imagers

    Warren M. Farnworth;Sidney B. Rigg;William M. Hiatt;Kyle K. Kirby

  • Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

    Kyle K. Kirby;Kunal R. Parekh

  • Chip-scale packages

    Warren Farnworth;Kyle Kirby;William Hiatt

  • Method of forming vias in semiconductor substrates and resulting structures

    Charles M. Watkins;Kyle K. Kirby;Alan G. Wood;Salman Akram

Frequent Co-Authors

Salman Akram
Salman Akram Micron (United States)
David R. Hembree
David R. Hembree Micron (United States)
Alan G. Wood
Alan G. Wood Micron (United States)
James M. Wark
James M. Wark Micron (United States)
Garo J. Derderian
Garo J. Derderian Intel (United States)
Mark E. Tuttle
Mark E. Tuttle University of Washington

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