World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
32
Citations
5068
World Ranking
6243
National Ranking
2059

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Mechanical engineering
  • Integrated circuit

His primary areas of investigation include Optoelectronics, Substrate, Electrical conductor, Microelectronics and Integrated circuit. His work carried out in the field of Optoelectronics brings together such families of science as Layer, Terminal, Die and Electronic engineering. Kyle K. Kirby has included themes like Electrical contacts and Semiconductor in his Terminal study.

As part of one scientific family, Kyle K. Kirby deals mainly with the area of Die, narrowing it down to issues related to the Wafer, and often Lens, Image sensor, Base and Wire bonding. His Electrical conductor research focuses on Conductive materials in particular. Kyle K. Kirby interconnects Parasitic extraction, Signal and Wafer-level packaging in the investigation of issues within Integrated circuit.

His most cited work include:

  • Multi-dice chip scale semiconductor components and wafer level methods of fabrication (361 citations)
  • Through-wafer interconnects for photoimager and memory wafers (190 citations)
  • Packaged microelectronic imagers and methods of packaging microelectronic imagers (180 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of study are Optoelectronics, Substrate, Electrical conductor, Electronic engineering and Semiconductor device. The concepts of his Optoelectronics study are interwoven with issues in Layer, Conductive materials and Die. In Substrate, Kyle K. Kirby works on issues like Image sensor, which are connected to Lens.

In his study, which falls under the umbrella issue of Electrical conductor, Electrically conductive is strongly linked to Microelectronics. As part of his studies on Electronic engineering, Kyle K. Kirby often connects relevant subjects like Mechanical engineering. Kyle K. Kirby has included themes like Structural engineering, Coating and Active surface in his Semiconductor device study.

He most often published in these fields:

  • Optoelectronics (68.57%)
  • Substrate (45.00%)
  • Electrical conductor (35.71%)

What were the highlights of his more recent work (between 2010-2021)?

  • Optoelectronics (68.57%)
  • Semiconductor device (29.29%)
  • Substrate (45.00%)

In recent papers he was focusing on the following fields of study:

Kyle K. Kirby mainly focuses on Optoelectronics, Semiconductor device, Substrate, Electrical conductor and Conductive materials. Kyle K. Kirby mostly deals with Semiconductor in his studies of Optoelectronics. His Semiconductor device research includes themes of Soldering, Die and Active surface.

As a part of the same scientific family, Kyle K. Kirby mostly works in the field of Substrate, focusing on Pillar and, on occasion, Thermal copper pillar bump. His Electrical conductor study integrates concerns from other disciplines, such as Dielectric and Microelectronics. Within one scientific family, Kyle K. Kirby focuses on topics pertaining to Die under Electrical engineering, and may sometimes address concerns connected to Electrical connection and Integrated circuit.

Between 2010 and 2021, his most popular works were:

  • Semiconductor with through-substrate interconnect (104 citations)
  • Disabling electrical connections using pass-through 3d interconnects and associated systems and methods (82 citations)
  • Microelectronic devices with through-substrate interconnects and associated methods of manufacturing (39 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Mechanical engineering
  • Semiconductor

Kyle K. Kirby mostly deals with Optoelectronics, Substrate, Semiconductor device, Dielectric and Electronic engineering. The concepts of his Substrate study are interwoven with issues in Die and Microelectronics. His studies deal with areas such as Integrated circuit, Tungsten, Silicon and Electrical connection as well as Microelectronics.

His studies in Semiconductor device integrate themes in fields like Conductive materials and Substrate. His Dielectric research integrates issues from Electrical conductor and Composite material. His research on Electronic engineering often connects related areas such as Semiconductor.

Best Publications

  • Semiconductor component having plate, stacked dice and conductive vias

    Warren M. Farnworth;Alan G. Wood;William M. Hiatt;James M. Wark

  • Image sensor packages and frame structure thereof

    Alan G. Wood;Kyle K. Kirby;Warren M. Farnworth;Salman Akram

  • Through-wafer interconnects for photoimager and memory wafers

    Salman Akram;Charles M. Watkins;Mark Hiatt;David R. Hembree

  • Methods of forming conductive vias and methods of forming multichip modules including such conductive vias

    Kyle K. Kirby;Warren M. Farnworth

  • Packaged microelectronic imagers and methods of packaging microelectronic imagers

    Salman Akram;Charles M. Watkins;Kyle K. Kirby;Alan G. Wood

  • Microelectronics devices, having vias, and packaged microelectronic devices having vias

    Sidney B. Rigg;Charles M. Watkins;Kyle K. Kirby;Peter A. Benson

  • Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods

    Kyle K. Kirby

  • Microelectronic devices and methods for forming interconnects in microelectronic devices

    Kyle K. Kirby;Salman Akram;David R. Hembree;Sidney B. Rigg

  • Semiconductor with through-substrate interconnect

    Kyle K. Kirby;Kunal R. Parekh

  • Pass-through interconnect structure for microelectronic dies and associated systems and methods

    David S. Pratt;Kyle K. Kirby;Dewali Ray

  • Semiconductor components and assemblies including vias of varying lateral dimensions

    Kyle K. Kirby;Warren M. Farnworth

  • Microelectronic devices and methods for filing vias in microelectronic devices

    William M. Hiatt;Kyle K. Kirby

  • Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods

    Steve Oliver;Kyle K. Kirby;Warren M. Farnworth;William M. Hiatt

  • Disabling electrical connections using pass-through 3d interconnects and associated systems and methods

    Jeffery W. Janzen;Michael Chaine;Kyle K. Kirby;William M. Hiatt

  • Microfeature workpieces and methods for forming interconnects in microfeature workpieces

    Kyle K. Kirby;William M. Hiatt;Richard L. Stocks

  • Method for fabricating semiconductor components with conductive spring contacts

    Kyle K. Kirby;Warren M. Farnworth

  • Microelectronic imagers and methods of packaging microelectronic imagers

    Warren M. Farnworth;Sidney B. Rigg;William M. Hiatt;Kyle K. Kirby

  • Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

    Kyle K. Kirby;Kunal R. Parekh

  • Chip-scale packages

    Warren Farnworth;Kyle Kirby;William Hiatt

  • Method of forming vias in semiconductor substrates and resulting structures

    Charles M. Watkins;Kyle K. Kirby;Alan G. Wood;Salman Akram

Frequent Co-Authors

Salman Akram
Salman Akram Micron (United States)
David R. Hembree
David R. Hembree Micron (United States)
Alan G. Wood
Alan G. Wood Micron (United States)
Mark E. Tuttle
Mark E. Tuttle University of Washington

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