James M. Wark

What is he best known for?

The fields of study he is best known for:

• Mechanical engineering
• Electrical engineering
• Integrated circuit

James M. Wark mainly investigates Die, Electronic engineering, Optoelectronics, Electrical engineering and Wafer. The various areas that James M. Wark examines in his Die study include Wire bonding, Active surface and Flip chip. His Electronic engineering study combines topics from a wide range of disciplines, such as Semiconductor device and Integrated circuit.

The Optoelectronics study combines topics in areas such as Terminal and Substrate. His Substrate research is multidisciplinary, incorporating elements of Semiconductor chip and Heat sink. His work on Die preparation as part of general Wafer study is frequently connected to Interconnection, therefore bridging the gap between diverse disciplines of science and establishing a new relationship between them.

His most cited work include:

• Multi-dice chip scale semiconductor components and wafer level methods of fabrication (361 citations)
• Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice (202 citations)
• Through-wafer interconnects for photoimager and memory wafers (190 citations)

What are the main themes of his work throughout his whole career to date?

His main research concerns Optoelectronics, Electronic engineering, Die, Substrate and Wafer. His Optoelectronics study deals with Electrical conductor intersecting with Layer, Terminal, Base and Conductor. He interconnects Mechanical engineering, Semiconductor device, Solder ball and Chip in the investigation of issues within Electronic engineering.

His Die research is multidisciplinary, relying on both Flip chip, Electrical engineering, Integrated circuit and Wire bonding. His studies in Substrate integrate themes in fields like Semiconductor chip and Electrically conductive. While the research belongs to areas of Wafer, James M. Wark spends his time largely on the problem of Structural engineering, intersecting his research to questions surrounding Cover, Stamping, Seal and Semiconductor package.

He most often published in these fields:

• Optoelectronics (46.84%)
• Electronic engineering (46.84%)
• Die (44.30%)

What were the highlights of his more recent work (between 2005-2012)?

• Optoelectronics (46.84%)
• Electrical conductor (26.58%)
• Substrate (37.97%)

In recent papers he was focusing on the following fields of study:

His scientific interests lie mostly in Optoelectronics, Electrical conductor, Substrate, Electronic engineering and Layer. His Optoelectronics study typically links adjacent topics like Die. His research in Die intersects with topics in DIMM, Memory module, Wafer and Footprint.

His Electrical conductor research focuses on subjects like Terminal, which are linked to Conductor, Semiconductor components and Semiconductor. His work deals with themes such as Electrical contacts and Dielectric, which intersect with Substrate. His study in Electronic engineering is interdisciplinary in nature, drawing from both Flip chip, Semiconductor device, Printed circuit board and Integrated circuit.

Between 2005 and 2012, his most popular works were:

• Through-wafer interconnects for photoimager and memory wafers (190 citations)
• Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts (85 citations)
• Semiconductor component having plate, stacked dice and conductive vias (84 citations)

In his most recent research, the most cited papers focused on:

• Mechanical engineering
• Electrical engineering
• Integrated circuit

James M. Wark spends much of his time researching Optoelectronics, Terminal, Electrical conductor, Die and Wafer. James M. Wark integrates several fields in his works, including Optoelectronics, Dice and Interconnection. James M. Wark incorporates a variety of subjects into his writings, including Dice, Stencil, Base, Layer and Electrical engineering.

His Interconnection research spans across into subjects like Parasitic extraction, Signal, Integrated circuit, Wire bonding and Electronic engineering. Parasitic extraction is closely attributed to Wafer-level packaging in his study. The study incorporates disciplines such as Electrical contacts, Semiconductor components, Semiconductor and Substrate in addition to Conductor.