Larry D. Kinsman

What is he best known for?

The fields of study he is best known for:

• Electrical engineering
• Mechanical engineering
• Integrated circuit

Larry D. Kinsman mainly focuses on Die, Optoelectronics, Electronic engineering, Mechanical engineering and Semiconductor device. His Die research is multidisciplinary, incorporating perspectives in Electrical conductor, Composite material, Structural engineering and Lead frame. His Lead frame research integrates issues from Ceramic and Lead.

Larry D. Kinsman has researched Optoelectronics in several fields, including Substrate and Electrical engineering. Larry D. Kinsman studied Electronic engineering and Integrated circuit packaging that intersect with Ball grid array, Microelectronics, Soldering, Chip-scale package and Printed circuit board. His study explores the link between Semiconductor device and topics such as Wafer that cross with problems in Surface mounting, Wire bonding, Electrical connection and Active surface.

His most cited work include:

• Discrete die burn-in for nonpackaged die (271 citations)
• Apparatus and methods of packaging and testing die (206 citations)
• Stackable ceramic fbga for high thermal applications (191 citations)

What are the main themes of his work throughout his whole career to date?

His primary scientific interests are in Optoelectronics, Semiconductor device, Die, Electrical engineering and Electrical conductor. His research integrates issues of Layer, Substrate, Semiconductor package and Electronic engineering in his study of Optoelectronics. His Electronic engineering research is multidisciplinary, relying on both Embedded Wafer Level Ball Grid Array, Ball grid array and Integrated circuit packaging.

His work carried out in the field of Semiconductor device brings together such families of science as Perpendicular, Bottom edge, Stub, Heat spreader and Electrical connection. The concepts of his Die study are interwoven with issues in Structural engineering, Composite material, Lead frame and Active surface. His work on Integrated circuit, Printed circuit board and Coupling as part of his general Electrical engineering study is frequently connected to Fabrication, thereby bridging the divide between different branches of science.

He most often published in these fields:

• Optoelectronics (54.17%)
• Semiconductor device (40.83%)
• Die (38.33%)

What were the highlights of his more recent work (between 2003-2018)?

• Optoelectronics (54.17%)
• Semiconductor device (40.83%)
• Substrate (26.67%)

In recent papers he was focusing on the following fields of study:

His primary areas of investigation include Optoelectronics, Semiconductor device, Substrate, Die and Electronic engineering. His research investigates the connection between Optoelectronics and topics such as Electrical conductor that intersect with problems in Active surface. His Semiconductor device study incorporates themes from Wafer, Bottom edge, Stub, Electrical connection and Interposer.

His Substrate research focuses on subjects like Image sensor, which are linked to Chip. The study incorporates disciplines such as Lead, Lead frame, Chip-scale package, Composite material and Edge in addition to Die. In his work, Integrated circuit packaging, Embedded Wafer Level Ball Grid Array, Grid and Ball grid array is strongly intertwined with Mechanical engineering, which is a subfield of Electronic engineering.

Between 2003 and 2018, his most popular works were:

• Bumped die and wire bonded board-on-chip package (92 citations)
• Microelectronic devices and methods for packaging microelectronic devices (80 citations)
• Method for fabricating a chip scale package using wafer level processing (54 citations)

In his most recent research, the most cited papers focused on:

• Electrical engineering
• Mechanical engineering
• Composite material

Optoelectronics, Die, Electrical conductor, Substrate and Electronic engineering are his primary areas of study. Larry D. Kinsman regularly ties together related areas like Electrical engineering in his Optoelectronics studies. His work on Die is being expanded to include thematically relevant topics such as Semiconductor device.

His work in Electrical conductor addresses subjects such as Active surface, which are connected to disciplines such as Semiconductor, Substrate, Chip-scale package, Solder ball and Wafer. His Substrate research is multidisciplinary, incorporating elements of Image sensor, Camera module and Soldering. His work deals with themes such as Ball, Mechanical engineering, Electronic circuit, Ball grid array and Electrical impedance, which intersect with Electronic engineering.