World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
48
Citations
6424
World Ranking
3134
National Ranking
55

Yaojian Lin publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Yaojian Lin sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 142 publications — 12th percentile

12% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Yaojian Lin D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Yaojian Lin sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 48 D-Index — 56th percentile

56% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Yaojian Lin is affiliated with STATS ChipPAC Ltd in Singapore and has a research portfolio spanning biochemistry, genetics, molecular biology, and medicine. Their work extensively covers subfields such as biomedical engineering, cell biology, molecular biology, artificial intelligence, and pulmonary and respiratory medicine.

Lin's research topics include cellular mechanics and interactions, 3D printing in biomedical research, cancer cells and metastasis, cell image analysis techniques, microfluidic and bio-sensing technologies, tendon structure and treatment, and genomics and chromatin dynamics.

The scientist has published multiple papers in various peer-reviewed journals. Recent significant publications include:

  • Prostate lineage-specific metabolism governs luminal differentiation and response to antiandrogen treatment, 2023, Nature Cell Biology
  • Investigating heterogeneities of live mesenchymal stromal cells using AI-based label-free imaging, 2021, Scientific Reports
  • Stress decomposition in LAOS of dense colloidal suspensions, 2020, Journal of Rheology
  • Cell-cell adhesion impacts epithelia response to substrate stiffness: Morphology and gene expression, 2021, Biophysical Journal
  • Effect of luminal flow on doming of mpkCCD cells in a 3D perfusable kidney cortical collecting duct model, 2020, American Journal of Physiology-Cell Physiology

Frequent co-authors collaborating with Lin include Alexandra Bermudez, Jimmy K. Hu, Cho-Jui Hsieh, Marie C. Payne, and Sara Imboden.

The scientist's work is frequently published in venues such as Biophysical Journal, SSRN Electronic Journal, bioRxiv (Cold Spring Harbor Laboratory), arXiv (Cornell University), and Lab on a Chip.

Best Publications

  • Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

    Yaojian Lin;XuSheng Bao;Kang Chen;Jianmin Fang

  • Semiconductor Package with Semiconductor Core Structure and Method of Forming Same

    Yaojian Lin;Jianmin Fang;Kang Chen;Haijing Cao

  • Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure

    Il Kwon Shim;Seng Guan Chow;Yaojian Lin

  • Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units

    Yaojian Lin;Pandi Chelvam Marimuthu;Kang Chen;Yu Gu

  • Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

    Reza A. Pagaila;Yaojian Lin;Seung Uk Yoon

  • Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

    Reza A. Pagaila;Yaojian Lin;Seung Wook Yoon

  • Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

    Pandi C. Marimuthu;Yaojian Lin;Kang Chen;Yu Gu

  • Semiconductor Device and Method of Forming UBM Fixed Relative to Interconnect Structure for Alignment of Semiconductor Die

    Il Kwon Shim;Seng Guan Chow;Yaojian Lin;Rui Huang

  • SEMICONDUCTOR DEVICE WITH THREE-DIMENSIONAL VERTICALLY ORIENTED INTEGRATED CAPACITORS

    Huang Rui;Kuan Heap Hoe;Lin Yaojian;Chow Seng Guan

  • Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

    Reza A. Pagaila;Rui Huang;Yaojian Lin

  • Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-applied Protective Layer

    Il Kwon Shim;Yaojian Lin;Seng Guan Chow

  • Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound

    Yaojian Lin;Jianmin Fang;Kang Chen;Haijing Cao

  • Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference

    Reza A. Pagaila;Byung Tai Do;Yaojian Lin;Rui Huang

  • Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die

    Reza A. Pagaila;Yaojian Lin;Jun Mo Koo;HeeJo Chi

  • Semiconductor device and method of forming integrated passive device module

    Yaojian Lin;Haijing Cao;Qing Zhang;Kang Chen

  • Semiconductor Device and Method of Forming High-Frequency Circuit Structure and Method Thereof

    Yaojian Lin;Jianmin Fang;Kang Chen;Haijing Cao

  • Next generation eWLB (embedded wafer level BGA) packaging

    Yonggang Jin;Xavier Baraton;S. W. Yoon;Yaojian Lin

  • Integrated circuit system having different-size solder bumps and different-size bonding pads

    Yaojian Lin;Byung Tai Do;Romeo Emmanuel P. Alvarez

  • Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions

    Seung Wook Yoon;Patrick Tang;Roger Emigh;Yaojian Lin

  • Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias

    Reza A. Pagaila;Byung Tai Do;Yaojian Lin

Frequent Co-Authors

Reza A. Pagaila
Reza A. Pagaila STATS ChipPAC Ltd
Il Kwon Shim
Il Kwon Shim UTAC Group
Seng Guan Chow
Seng Guan Chow STATS ChipPAC Ltd
Byung Tai Do
Byung Tai Do STATS ChipPAC Ltd

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Related Online Degrees & Career Pathways

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For those aiming to improve workplace training and development skills, pursuing a master's in training and development online can offer advanced strategies for designing effective learning experiences, a valuable asset in technical fields.

Moreover, many institutions now offer competency-based online colleges that focus on skill mastery rather than just time spent on coursework. This approach is ideal for engineering students looking to apply practical knowledge directly to their careers.

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