Il Kwon Shim

What is he best known for?

The fields of study he is best known for:

• Integrated circuit
• Electrical engineering
• Mechanical engineering

The scientist’s investigation covers issues in Semiconductor device, Optoelectronics, Die, Electronic engineering and Layer. His Optoelectronics research is multidisciplinary, incorporating elements of Frame, Substrate and Lead frame. Il Kwon Shim combines subjects such as Structural engineering, Chip-scale package and Semiconductor with his study of Substrate.

The concepts of his Die study are interwoven with issues in Wafer and Electrical engineering. His Electronic engineering study incorporates themes from Composite material and Heat sink. His biological study spans a wide range of topics, including Electrical conductor, Pillar and Active surface.

His most cited work include:

• Semiconductor device and method of forming an interposer package with through silicon vias (292 citations)
• Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure (149 citations)
• Semiconductor device and method of forming the device using sacrificial carrier (140 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of investigation include Optoelectronics, Integrated circuit, Electronic engineering, Die and Semiconductor device. His work deals with themes such as Layer, Substrate, Semiconductor package and Base, which intersect with Optoelectronics. When carried out as part of a general Integrated circuit research project, his work on Integrated circuit packaging is frequently linked to work in Computer hardware, therefore connecting diverse disciplines of study.

His Electronic engineering study integrates concerns from other disciplines, such as Adhesive, Contact pad and Anchoring. He interconnects Structural engineering, Interposer, Lead and Paddle in the investigation of issues within Die. His Semiconductor device research includes elements of Wafer, Silicon, Heat sink, Electrical conductor and Substrate.

He most often published in these fields:

• Optoelectronics (51.82%)
• Integrated circuit (45.45%)
• Electronic engineering (41.82%)

What were the highlights of his more recent work (between 2012-2016)?

• Semiconductor device (33.64%)
• Optoelectronics (51.82%)
• Layer (24.55%)

In recent papers he was focusing on the following fields of study:

His primary areas of study are Semiconductor device, Optoelectronics, Layer, Electrical conductor and Electronic engineering. Semiconductor device and Electrical engineering are commonly linked in his work. His Optoelectronics research includes themes of Die and Base.

Il Kwon Shim works on Layer which deals in particular with Substrate. His Electrical conductor research focuses on Semiconductor package and how it connects with Mold. His studies in Electronic engineering integrate themes in fields like Conductive ink, Indentation and Copper.

Between 2012 and 2016, his most popular works were:

• Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages (40 citations)
• Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package (38 citations)
• Semiconductor device and method of forming thermal lid for balancing warpage and thermal management (34 citations)

In his most recent research, the most cited papers focused on:

• Integrated circuit
• Electrical engineering
• Mechanical engineering

Il Kwon Shim mostly deals with Semiconductor device, Optoelectronics, Electrical conductor, Layer and Electrical engineering. The study incorporates disciplines such as Electronic engineering, Substrate, Dielectric and Stiffening in addition to Semiconductor device. His study in Electronic engineering is interdisciplinary in nature, drawing from both Semiconductor materials, Wafer, Chip, Die preparation and Groove.

His study in Substrate focuses on Semiconductor package in particular. His research integrates issues of Thermal expansion, Thermal grease, Heat spreader and Ceramic in his study of Stiffening. His study of Fan-out is a part of Electrical engineering.