Trung T. Doan

Trung T. Doan publication distribution in Materials Science in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Trung T. Doan sits on this spectrum.

Trung T. Doan D-index placement in Materials Science in 2026

The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Trung T. Doan sits on this spectrum.

Overview

Best Publications

• Semiconductor component sealed on five sides by polymer sealing layer

  Warren M. Farnworth;Alan G. Wood;Trung Tri Doan

  743
  Citations

• Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers

  Trung T. Doan;Gurtej S. Sandhu

  699
  Citations

• System for real-time control of semiconductor wafer polishing including optical monitoring

  Gurtej S. Sandhu;Trung Tri Doan

  420
  Citations

• System for real-time control of semiconductor wafer polishing

  Gurtej S. Sandhu;Trung Tri Doan

  401
  Citations

• Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer

  Gurtej S. Sandhu;Trung T. Doan

  379
  Citations

• METHOD FOR FORMING SELF-ALIGNING GATE STRUCTURE AROUND COLD-CATHODE EMITTER END USING CHEMICAL AND MECHANICAL POLISHING METHOD

  Doan Trung T;Rolfson J Brett;Lowrey Tyler A;Cathey David A

  350
  Citations

• Slurries for chemical mechanically polishing copper containing metal layers

  Chris C. Yu;Trung T. Doan

  349
  Citations

• System and method for real-time control of semiconductor a wafer polishing, and a polishing head

  Gurtej S. Sandhu;Trung T. Doan

  333
  Citations

• Method to form a low resistant bond pad interconnect

  Trung T. Doan;Mark E. Tuttle

  332
  Citations

• METHOD OF FORMING BURIED AND PROJECTED CONDUCTIVE PLUGS IN INSULATING LAYER

  Yu Chris C;Doan Trung T

  325
  Citations

• Method for fabricating semiconductor component with thnned substrate having pin contacts

  Alan G. Wood;Trung Tri Doan

  306
  Citations

• Method to slope conductor profile prior to dielectric deposition to improve dielectric step-coverage

  Guy T. Blalock;Trung T. Doan

  304
  Citations

• Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers

  Gurtej S. Sandhu;Laurence D. Schultz;Trung T. Doan

  281
  Citations

• Apparatus for endpoint detection during mechanical planarization of semiconductor wafers

  Gurtej S. Sandhu;Laurence D. Schultz;Trung T. Doan

  265
  Citations

• Atomic Layer Deposition Methods

  Trung Tri Doan;Guy T. Blalock;Gurtej S. Sandhu

  257
  Citations

• Method to form self-aligned gate structures and focus rings

  Trung T. Doan;Tyler A. Lowrey;David A. Cathey;J. Brett Rolfson

  256
  Citations

• System having semiconductor component with multiple stacked dice

  Dean A. Klein;Alan G. Wood;Trung Tri Doan

  239
  Citations

• Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces

  Lingyi A. Zheng;Trung T. Doan;Lyle D. Breiner;Er-Xuan Ping

  236
  Citations

• Method for packaging semiconductor dice

  Warren M. Farnworth;Alan G. Wood;Trung T. Doan;John O. Jacobson

  226
  Citations

• Multiple step method of chemical-mechanical polishing which minimizes dishing

  Trung T. Doan;Chris C. Yu

  208
  Citations