World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
63
Citations
12629
World Ranking
1391
National Ranking
573

David R. Hembree publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where David R. Hembree sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 112 publications — 6th percentile

6% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

David R. Hembree D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where David R. Hembree sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 63 D-Index — 81st percentile

81% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

What is he best known for?

The fields of study he is best known for:

  • Mechanical engineering
  • Composite material
  • Electrical engineering

David R. Hembree mainly investigates Optoelectronics, Electronic engineering, Electrical conductor, Wafer and Die. He interconnects Layer and Substrate in the investigation of issues within Optoelectronics. His Substrate research incorporates elements of Electrical engineering and Conductor.

The study incorporates disciplines such as Electrical contacts, Terminal, Base and Interposer in addition to Electrical conductor. His research in Wafer intersects with topics in Chip and Wire bonding. His work in Die addresses subjects such as Die preparation, which are connected to disciplines such as Wafer backgrinding.

His most cited work include:

  • Multi-dice chip scale semiconductor components and wafer level methods of fabrication (361 citations)
  • Carrier for testing an unpackaged semiconductor die (256 citations)
  • Micromachined chip scale package (245 citations)

What are the main themes of his work throughout his whole career to date?

David R. Hembree mostly deals with Optoelectronics, Semiconductor, Electronic engineering, Substrate and Electrical conductor. His work carried out in the field of Optoelectronics brings together such families of science as Layer and Substrate. His research integrates issues of Electrical contacts, Semiconductor device, Etching and Wire bonding in his study of Semiconductor.

David R. Hembree usually deals with Electronic engineering and limits it to topics linked to Chip and Computer hardware. His Substrate study is related to the wider topic of Composite material. His work deals with themes such as Die, Terminal, Base, Conductor and Interposer, which intersect with Electrical conductor.

He most often published in these fields:

  • Optoelectronics (44.22%)
  • Semiconductor (35.86%)
  • Electronic engineering (32.67%)

What were the highlights of his more recent work (between 2005-2018)?

  • Optoelectronics (44.22%)
  • Semiconductor (35.86%)
  • Substrate (10.76%)

In recent papers he was focusing on the following fields of study:

David R. Hembree mainly investigates Optoelectronics, Semiconductor, Substrate, Wire bonding and Electrical conductor. His research in Optoelectronics intersects with topics in Electronic engineering and Electrical engineering. His research integrates issues of Capillary action and Etching in his study of Electronic engineering.

The various areas that David R. Hembree examines in his Electrical engineering study include Die and Silicon. His work carried out in the field of Semiconductor brings together such families of science as Semiconductor device and Substrate. In his study, Base is inextricably linked to Terminal, which falls within the broad field of Electrical conductor.

Between 2005 and 2018, his most popular works were:

  • Through-wafer interconnects for photoimager and memory wafers (190 citations)
  • Method and system for fabricating semiconductor components with through wire interconnects (161 citations)
  • Method of fabricating semiconductor components with through interconnects (137 citations)

Best Publications

  • Semiconductor component having plate, stacked dice and conductive vias

    Warren M. Farnworth;Alan G. Wood;William M. Hiatt;James M. Wark

  • Method for fabricating semiconductor components with conductive vias

    Warren Farnworth;Alan Wood;David Hembree

  • Micromachined chip scale package

    Salman Akram;David R. Hembree;Warren M. Farnworth

  • Carrier for testing an unpackaged semiconductor die

    Alan G. Wood;Warren M. Farnworth;David R. Hembree

  • Through-wafer interconnects for photoimager and memory wafers

    Salman Akram;Charles M. Watkins;Mark Hiatt;David R. Hembree

  • Semiconductor probe card having resistance measuring circuitry and method of fabrication

    David R. Hembree;Salman Akram

  • Circuit and method for heating an adhesive to package or rework a semiconductor die

    David R. Hembree;Salman Akram

  • Method and apparatus for testing unpackaged semiconductor dice

    Alan G. Wood;Warren M. Farnworth;Salman Akram;David R. Hembree

  • Method and system for fabricating semiconductor components with through wire interconnects

    David R. Hembree

  • Test system with mechanical alignment for semiconductor chip scale packages and dice

    Salman Akram;Warren M. Farnworth;David R. Hembree

  • System for testing semiconductor components having flexible interconnect

    David R. Hembree;Derek Gochnour

  • Test socket with interposer for testing semiconductor components having contact balls

    David R. Hembree

  • Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die

    Alan G. Wood;Warren M. Farnworth;David R. Hembree

  • Conventionally sized temporary package for testing semiconductor dice

    Warren M. Farnworth;Alan G. Wood;David R. Hembree;Salman Akram

  • System and interconnect for making temporary electrical connections with bumped semiconductor components

    David R. Hembree;John O. Jacobson;James M. Wark;Warren M. Farnworth

  • Micromachined silicon probe card for semiconductor dice and method of fabrication

    Salman Akram;David R. Hembree;Alan G. Wood

  • Stacked Semiconductor Component Having Through Wire Interconnect And Method Of Fabrication

    David R. Hembree

  • Method of fabricating semiconductor components with through interconnects

    Alan G. Wood;Warren M. Farnworth;David R. Hembree

  • Semiconductor package with pre-fabricated cover

    Warren M. Farnworth;David R. Hembree;Derek Gochnour;Salman Akram

  • Probe card for semiconductor wafers and method and system for testing wafers

    David Hembree;Warren Farnworth;Salman Akram;Alan Wood

Frequent Co-Authors

Alan G. Wood
Alan G. Wood Micron (United States)
Salman Akram
Salman Akram Micron (United States)
James M. Wark
James M. Wark Micron (United States)
Kyle K. Kirby
Kyle K. Kirby Micron (United States)
Mark E. Tuttle
Mark E. Tuttle University of Washington

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