David R. Hembree

What is he best known for?

The fields of study he is best known for:

• Mechanical engineering
• Composite material
• Electrical engineering

David R. Hembree mainly investigates Optoelectronics, Electronic engineering, Electrical conductor, Wafer and Die. He interconnects Layer and Substrate in the investigation of issues within Optoelectronics. His Substrate research incorporates elements of Electrical engineering and Conductor.

The study incorporates disciplines such as Electrical contacts, Terminal, Base and Interposer in addition to Electrical conductor. His research in Wafer intersects with topics in Chip and Wire bonding. His work in Die addresses subjects such as Die preparation, which are connected to disciplines such as Wafer backgrinding.

His most cited work include:

• Multi-dice chip scale semiconductor components and wafer level methods of fabrication (361 citations)
• Carrier for testing an unpackaged semiconductor die (256 citations)
• Micromachined chip scale package (245 citations)

What are the main themes of his work throughout his whole career to date?

David R. Hembree mostly deals with Optoelectronics, Semiconductor, Electronic engineering, Substrate and Electrical conductor. His work carried out in the field of Optoelectronics brings together such families of science as Layer and Substrate. His research integrates issues of Electrical contacts, Semiconductor device, Etching and Wire bonding in his study of Semiconductor.

David R. Hembree usually deals with Electronic engineering and limits it to topics linked to Chip and Computer hardware. His Substrate study is related to the wider topic of Composite material. His work deals with themes such as Die, Terminal, Base, Conductor and Interposer, which intersect with Electrical conductor.

He most often published in these fields:

• Optoelectronics (44.22%)
• Semiconductor (35.86%)
• Electronic engineering (32.67%)

What were the highlights of his more recent work (between 2005-2018)?

• Optoelectronics (44.22%)
• Semiconductor (35.86%)
• Substrate (10.76%)

In recent papers he was focusing on the following fields of study:

David R. Hembree mainly investigates Optoelectronics, Semiconductor, Substrate, Wire bonding and Electrical conductor. His research in Optoelectronics intersects with topics in Electronic engineering and Electrical engineering. His research integrates issues of Capillary action and Etching in his study of Electronic engineering.

The various areas that David R. Hembree examines in his Electrical engineering study include Die and Silicon. His work carried out in the field of Semiconductor brings together such families of science as Semiconductor device and Substrate. In his study, Base is inextricably linked to Terminal, which falls within the broad field of Electrical conductor.

Between 2005 and 2018, his most popular works were:

• Through-wafer interconnects for photoimager and memory wafers (190 citations)
• Method and system for fabricating semiconductor components with through wire interconnects (161 citations)
• Method of fabricating semiconductor components with through interconnects (137 citations)