World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
52
Citations
8761
World Ranking
2561
National Ranking
975

Mark E. Tuttle publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Mark E. Tuttle sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 179 publications — 23rd percentile

23% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Mark E. Tuttle D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Mark E. Tuttle sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 52 D-Index — 64th percentile

64% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Composite material
  • Integrated circuit

His scientific interests lie mostly in Electronic engineering, Optoelectronics, Electrical engineering, Signal and Wafer. His research integrates issues of Transmitter and Integrated circuit in his study of Electronic engineering. His Integrated circuit research is multidisciplinary, relying on both Radio frequency, Antenna and Transponder.

His Optoelectronics research integrates issues from Layer, Barrier layer and Electrical conductor. The Chip research he does as part of his general Electrical engineering study is frequently linked to other disciplines of science, such as Stack, therefore creating a link between diverse domains of science. His studies deal with areas such as Engineering drawing and Semiconductor as well as Wafer.

His most cited work include:

  • Radio frequency data communications device (713 citations)
  • Method of manufacturing an enclosed transceiver (452 citations)
  • Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device (222 citations)

What are the main themes of his work throughout his whole career to date?

Mark E. Tuttle focuses on Electrical engineering, Optoelectronics, Electronic engineering, Integrated circuit and Composite material. His study in the field of Antenna, Signal, Transmitter and Chip also crosses realms of Radio-frequency identification. His Optoelectronics research incorporates elements of Layer, Semiconductor device, Substrate and Interconnection.

The various areas that Mark E. Tuttle examines in his Electronic engineering study include Radio frequency and Computer hardware. His research in Integrated circuit intersects with topics in Electromagnetic shielding and Transponder. His Composite material research incorporates elements of Cathode, Structural engineering, Anode and Engineering drawing.

He most often published in these fields:

  • Electrical engineering (38.07%)
  • Optoelectronics (31.98%)
  • Electronic engineering (27.41%)

What were the highlights of his more recent work (between 2005-2020)?

  • Optoelectronics (31.98%)
  • Electronic engineering (27.41%)
  • Electrical engineering (38.07%)

In recent papers he was focusing on the following fields of study:

Mark E. Tuttle mainly investigates Optoelectronics, Electronic engineering, Electrical engineering, Semiconductor device and Signal. His Optoelectronics study combines topics in areas such as Layer, Substrate, Electrical conductor and Interconnection. He incorporates Electronic engineering and Radio-frequency identification in his research.

His work in Integrated circuit, Transmitter and Radio frequency is related to Electrical engineering. His research in Integrated circuit tackles topics such as Transponder which are related to areas like Microprocessor. His Signal research is multidisciplinary, relying on both Die and Antenna.

Between 2005 and 2020, his most popular works were:

  • Through-wafer interconnects for photoimager and memory wafers (190 citations)
  • Methods for forming through wafer interconnects and structures resulting therefrom (108 citations)
  • Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods (86 citations)

Best Publications

  • Radio frequency data communications device

    James E. O'Toole;John R. Tuttle;Mark E. Tuttle;Tyler A. Lowrey

  • Method of manufacturing an enclosed transceiver

    Mark E. Tuttle;John R. Tuttle;Rickie C. Lake

  • Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant

    Mark E. Tuttle;Rickie C. Lake;Joe P. Mousseau;Clay L. Cirino

  • Through-wafer interconnects for photoimager and memory wafers

    Salman Akram;Charles M. Watkins;Mark Hiatt;David R. Hembree

  • Polishing pad with uniform abrasion

    Mark E. Tuttle

  • Wireless identification device, RFID device, and method of manufacturing wireless identification device

    Mark E. Tuttle

  • System with chip to chip communication

    Mark E. Tuttle;John R. Tuttle

  • Process for metallizing integrated circuits with electrolytically-deposited copper

    Terry L. Gilton;Mark E. Tuttle;David A Cathey

  • Electronic communication devices, methods of forming electrical communication devices, and communications methods

    Mark E. Tuttle

  • Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate

    Rickie C. Lake;Mark E. Tuttle;Joseph P. Mousseau;Clay L. Cirino

  • Radio frequency identification device operating methods, radio frequency identification device configuration methods, and radio frequency identification devices

    Mark E. Tuttle;John R. Tuttle

  • Dram cell having a stacked capacitor with a tantalum lower plate, a tantalum oxide dielectric layer, and a silicide buried contact

    Alan R. Reinberg;Mark E. Tuttle

  • Electronic circuit bonding interconnect component and flip chip interconnect bond

    Rickie C. Lake;Mark E. Tuttle

  • Testing and burn-in of IC chips using radio frequency transmission

    Mark E. Tuttle

  • Semiconductor device structures and printed circuit boards comprising semiconductor devices

    Mark E. Tuttle

  • Methods and apparatus for performing financial transactions

    James E. O'Toole;John R. Tuttle;Mark E. Tuttle;Tyler Lowrey

  • Combination etch stop and in situ resistor in a magnetoresistive memory and methods for fabricating same

    Mark E. Tuttle

  • Signal delivery in stacked device

    Brent Keeth;Mark Hiatt;Terry R. Lee;Mark Tuttle

  • Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

    Mark E. Tuttle

  • Method and apparatus for RFID communication

    Mark E. Tuttle;Rickie C. Lake;Steven F. Schicht;John R. Tuttle

Frequent Co-Authors

Rickie C. Lake
Rickie C. Lake Micron (United States)
Tyler A. Lowrey
Tyler A. Lowrey Independent Scientist / Consultant, US
Gurtej S. Sandhu
Gurtej S. Sandhu Micron (United States)
Brent Keeth
Brent Keeth Micron (United States)
Kyle K. Kirby
Kyle K. Kirby Micron (United States)
David R. Hembree
David R. Hembree Micron (United States)
Salman Akram
Salman Akram Micron (United States)
James M. Wark
James M. Wark Micron (United States)
Alan G. Wood
Alan G. Wood Micron (United States)

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