World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
52
Citations
8761
World Ranking
2561
National Ranking
974

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Composite material
  • Integrated circuit

His scientific interests lie mostly in Electronic engineering, Optoelectronics, Electrical engineering, Signal and Wafer. His research integrates issues of Transmitter and Integrated circuit in his study of Electronic engineering. His Integrated circuit research is multidisciplinary, relying on both Radio frequency, Antenna and Transponder.

His Optoelectronics research integrates issues from Layer, Barrier layer and Electrical conductor. The Chip research he does as part of his general Electrical engineering study is frequently linked to other disciplines of science, such as Stack, therefore creating a link between diverse domains of science. His studies deal with areas such as Engineering drawing and Semiconductor as well as Wafer.

His most cited work include:

  • Radio frequency data communications device (713 citations)
  • Method of manufacturing an enclosed transceiver (452 citations)
  • Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device (222 citations)

What are the main themes of his work throughout his whole career to date?

Mark E. Tuttle focuses on Electrical engineering, Optoelectronics, Electronic engineering, Integrated circuit and Composite material. His study in the field of Antenna, Signal, Transmitter and Chip also crosses realms of Radio-frequency identification. His Optoelectronics research incorporates elements of Layer, Semiconductor device, Substrate and Interconnection.

The various areas that Mark E. Tuttle examines in his Electronic engineering study include Radio frequency and Computer hardware. His research in Integrated circuit intersects with topics in Electromagnetic shielding and Transponder. His Composite material research incorporates elements of Cathode, Structural engineering, Anode and Engineering drawing.

He most often published in these fields:

  • Electrical engineering (38.07%)
  • Optoelectronics (31.98%)
  • Electronic engineering (27.41%)

What were the highlights of his more recent work (between 2005-2020)?

  • Optoelectronics (31.98%)
  • Electronic engineering (27.41%)
  • Electrical engineering (38.07%)

In recent papers he was focusing on the following fields of study:

Mark E. Tuttle mainly investigates Optoelectronics, Electronic engineering, Electrical engineering, Semiconductor device and Signal. His Optoelectronics study combines topics in areas such as Layer, Substrate, Electrical conductor and Interconnection. He incorporates Electronic engineering and Radio-frequency identification in his research.

His work in Integrated circuit, Transmitter and Radio frequency is related to Electrical engineering. His research in Integrated circuit tackles topics such as Transponder which are related to areas like Microprocessor. His Signal research is multidisciplinary, relying on both Die and Antenna.

Between 2005 and 2020, his most popular works were:

  • Through-wafer interconnects for photoimager and memory wafers (190 citations)
  • Methods for forming through wafer interconnects and structures resulting therefrom (108 citations)
  • Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods (86 citations)

Best Publications

  • Radio frequency data communications device

    James E. O'Toole;John R. Tuttle;Mark E. Tuttle;Tyler A. Lowrey

  • Method of manufacturing an enclosed transceiver

    Mark E. Tuttle;John R. Tuttle;Rickie C. Lake

  • Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant

    Mark E. Tuttle;Rickie C. Lake;Joe P. Mousseau;Clay L. Cirino

  • Through-wafer interconnects for photoimager and memory wafers

    Salman Akram;Charles M. Watkins;Mark Hiatt;David R. Hembree

  • Polishing pad with uniform abrasion

    Mark E. Tuttle

  • Wireless identification device, RFID device, and method of manufacturing wireless identification device

    Mark E. Tuttle

  • System with chip to chip communication

    Mark E. Tuttle;John R. Tuttle

  • Process for metallizing integrated circuits with electrolytically-deposited copper

    Terry L. Gilton;Mark E. Tuttle;David A Cathey

  • Electronic communication devices, methods of forming electrical communication devices, and communications methods

    Mark E. Tuttle

  • Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate

    Rickie C. Lake;Mark E. Tuttle;Joseph P. Mousseau;Clay L. Cirino

  • Radio frequency identification device operating methods, radio frequency identification device configuration methods, and radio frequency identification devices

    Mark E. Tuttle;John R. Tuttle

  • Dram cell having a stacked capacitor with a tantalum lower plate, a tantalum oxide dielectric layer, and a silicide buried contact

    Alan R. Reinberg;Mark E. Tuttle

  • Electronic circuit bonding interconnect component and flip chip interconnect bond

    Rickie C. Lake;Mark E. Tuttle

  • Testing and burn-in of IC chips using radio frequency transmission

    Mark E. Tuttle

  • Semiconductor device structures and printed circuit boards comprising semiconductor devices

    Mark E. Tuttle

  • Methods and apparatus for performing financial transactions

    James E. O'Toole;John R. Tuttle;Mark E. Tuttle;Tyler Lowrey

  • Combination etch stop and in situ resistor in a magnetoresistive memory and methods for fabricating same

    Mark E. Tuttle

  • Signal delivery in stacked device

    Brent Keeth;Mark Hiatt;Terry R. Lee;Mark Tuttle

  • Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

    Mark E. Tuttle

  • Method and apparatus for RFID communication

    Mark E. Tuttle;Rickie C. Lake;Steven F. Schicht;John R. Tuttle

Frequent Co-Authors

Tyler A. Lowrey
Tyler A. Lowrey Independent Scientist / Consultant, US
Gurtej S. Sandhu
Gurtej S. Sandhu Micron (United States)
Brent Keeth
Brent Keeth Micron (United States)
David R. Hembree
David R. Hembree Micron (United States)
Kyle K. Kirby
Kyle K. Kirby Micron (United States)
Alan G. Wood
Alan G. Wood Micron (United States)
Salman Akram
Salman Akram Micron (United States)

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