His scientific interests lie mostly in Electronic engineering, Optoelectronics, Electrical engineering, Signal and Wafer. His research integrates issues of Transmitter and Integrated circuit in his study of Electronic engineering. His Integrated circuit research is multidisciplinary, relying on both Radio frequency, Antenna and Transponder.
His Optoelectronics research integrates issues from Layer, Barrier layer and Electrical conductor. The Chip research he does as part of his general Electrical engineering study is frequently linked to other disciplines of science, such as Stack, therefore creating a link between diverse domains of science. His studies deal with areas such as Engineering drawing and Semiconductor as well as Wafer.
Mark E. Tuttle focuses on Electrical engineering, Optoelectronics, Electronic engineering, Integrated circuit and Composite material. His study in the field of Antenna, Signal, Transmitter and Chip also crosses realms of Radio-frequency identification. His Optoelectronics research incorporates elements of Layer, Semiconductor device, Substrate and Interconnection.
The various areas that Mark E. Tuttle examines in his Electronic engineering study include Radio frequency and Computer hardware. His research in Integrated circuit intersects with topics in Electromagnetic shielding and Transponder. His Composite material research incorporates elements of Cathode, Structural engineering, Anode and Engineering drawing.
Mark E. Tuttle mainly investigates Optoelectronics, Electronic engineering, Electrical engineering, Semiconductor device and Signal. His Optoelectronics study combines topics in areas such as Layer, Substrate, Electrical conductor and Interconnection. He incorporates Electronic engineering and Radio-frequency identification in his research.
His work in Integrated circuit, Transmitter and Radio frequency is related to Electrical engineering. His research in Integrated circuit tackles topics such as Transponder which are related to areas like Microprocessor. His Signal research is multidisciplinary, relying on both Die and Antenna.
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Radio frequency data communications device
James E. O'Toole;John R. Tuttle;Mark E. Tuttle;Tyler A. Lowrey.
Method of manufacturing an enclosed transceiver
Mark E. Tuttle;John R. Tuttle;Rickie C. Lake.
Wireless identification device, RFID device with push-on/push off switch, and method of manufacturing wireless identification device
Mark E. Tuttle.
Method to form a low resistant bond pad interconnect
Trung T. Doan;Mark E. Tuttle.
Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant
Mark E. Tuttle;Rickie C. Lake;Joe P. Mousseau;Clay L. Cirino.
Method and apparatus for improving planarity of chemical-mechanical planarization operations
Marki Tutl;Trunti Doeon;Angasshi;Geties Sandhu.
Through-wafer interconnects for photoimager and memory wafers
Salman Akram;Charles M. Watkins;Mark Hiatt;David R. Hembree.
Polishing pad with uniform abrasion
Mark E. Tuttle.
Wireless identification device, RFID device, and method of manufacturing wireless identification device
Mark E. Tuttle.
System with chip to chip communication
Mark E. Tuttle;John R. Tuttle.
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