Thomas P. Glenn

What is he best known for?

The fields of study he is best known for:

• Integrated circuit
• Mechanical engineering
• Composite material

His main research concerns Substrate, Optoelectronics, Electronic engineering, Integrated circuit and Flip chip. Thomas P. Glenn has researched Substrate in several fields, including Bead, Electrical conductor, Aperture and Base. His study focuses on the intersection of Optoelectronics and fields such as Electronic component with connections in the field of Hand pressure and Shielded cable.

His Electronic engineering study incorporates themes from Layer, Image sensor and Chip, Chip size. His Integrated circuit research includes themes of Quad Flat No-leads package, Die, Composite material and EPROM. His studies deal with areas such as Computer hardware and Head as well as Quad Flat No-leads package.

His most cited work include:

• Plastic integrated circuit package and method and leadframe for making the package (316 citations)
• Plastic integrated circuit device package and leadframe having partially undercut leads and die pad (299 citations)
• Chip size semiconductor packages with stacked dies (268 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of study are Substrate, Optoelectronics, Integrated circuit, Electronic engineering and Composite material. Thomas P. Glenn usually deals with Substrate and limits it to topics linked to Image sensor and Surface and Integrally closed. His Optoelectronics research is multidisciplinary, incorporating perspectives in Chip and Flip chip.

His studies in Integrated circuit integrate themes in fields like Quad Flat No-leads package, Die, Lead frame and EPROM. The study incorporates disciplines such as Mechanical engineering and Computer hardware in addition to Quad Flat No-leads package. His research integrates issues of Structural engineering and Oblique angle in his study of Composite material.

He most often published in these fields:

• Substrate (48.09%)
• Optoelectronics (38.93%)
• Integrated circuit (34.35%)

What were the highlights of his more recent work (between 2001-2008)?

• Computer hardware (21.37%)
• Integrated circuit (34.35%)
• Substrate (48.09%)

In recent papers he was focusing on the following fields of study:

Thomas P. Glenn mostly deals with Computer hardware, Integrated circuit, Substrate, Window and Die. His studies deal with areas such as Mechanical engineering and Quad Flat No-leads package as well as Computer hardware. His Integrated circuit study improves the overall literature in Optoelectronics.

His biological study focuses on Flip chip. As part of one scientific family, Thomas P. Glenn deals mainly with the area of Die, narrowing it down to issues related to the Composite material, and often Semiconductor and Wire bonding. His Electronic engineering research also works with subjects such as

• Chip, which have a strong connection to Aperture,
• Electrical conductor which intersects with area such as Layer, Optical integrated circuit and Integrated circuit packaging.

Between 2001 and 2008, his most popular works were:

• Method of making near chip size integrated circuit package (151 citations)
• Mounting for a package containing a chip (149 citations)
• Method of making an integrated circuit package (88 citations)

In his most recent research, the most cited papers focused on:

• Mechanical engineering
• Electrical engineering
• Composite material

His primary areas of study are Integrated circuit, Quad Flat No-leads package, Electronic engineering, Optoelectronics and Chip. His Integrated circuit research incorporates elements of Mechanical engineering, Frame, Die, Computer hardware and Substrate surface. His Quad Flat No-leads package study combines topics in areas such as Electrical conductor, Aperture, Base and Semiconductor chip.

The Electronic engineering study combines topics in areas such as Substrate, Flip chip and Chip size.