2026 Steven Webster: Electronics and Electrical Engineering Researcher – H-Index, Publications & Awards

D-Index & Metrics

Discipline name	D-Index	World Ranking	Current World Ranking	National Ranking	Current National Ranking	Publications	Citations
Electronics and Electrical Engineering	36	5399	5184	1859	1734	67	4700

Discipline name

D-Index

World Ranking

Current World Ranking

National Ranking

Current National Ranking

Publications

Citations

Electronics and Electrical Engineering

5399

5184

1859

1734

4700

Electronics and Electrical Engineering

D-Index

Citations

4700

World Ranking

5399

National Ranking

1859

Best Publications

Chip size semiconductor packages with stacked dies

Thomas P. Glenn;Steven Webster;Vincent DiCaprio

409
Citations
Molded semiconductor package

Steven Webster

264
Citations
Molded window array for image sensor packages

Thomas P. Glenn;Steven Webster

241
Citations
Mounting for a package containing a chip

Thomas P. Glenn;Steven Webster;Roy D. Hollaway

221
Citations
Flip chip image sensor package fabrication method

Thomas P. Glenn;Steven Webster;Roy Dale Hollaway

195
Citations
Wafer scale image sensor package fabrication method

Thomas P. Glenn;Steven Webster;Tony Arellano

195
Citations
Wafer scale image sensor package

Thomas P. Glenn;Steven Webster;Tony Arellano

183
Citations
Optical module with lens integral holder

Steven Webster;Thomas P. Glenn;Roy Dale Hollaway

165
Citations
Semiconductor chip having a radio-frequency identification transceiver

Thomas P. Glenn;Steven Webster

157
Citations
Flip chip on glass image sensor package fabrication method

Thomas P. Glenn;Steven Webster;Roy Dale Hollaway

135
Citations
Micromachine stacked flip chip package fabrication method

Thomas P. Glenn;Steven Webster;Roy Dale Hollaway

128
Citations
Method for forming an image sensor package with vision die in lens housing

Thomas P. Glenn;Steven Webster;Roy Dale Hollaway

116
Citations
Image sensor package

Steven Webster

116
Citations
Camera module with window mechanical attachment

Thomas P. Glenn;Steven Webster

107
Citations
Image sensor package having sealed cavity over active area

Thomas P. Glenn;Steven Webster

105
Citations
Semiconductor package and circuit board for making the package

Thomas P. Glenn;Steven Webster;Roy D. Holloway

102
Citations
Thin image sensor package

Thomas P. Glenn;Steven Webster;Roy Dale Hollaway

94
Citations
Wafer level production of chip size semiconductor packages

Thomas P. Glenn;Steven Webster;Vincent DiCaprio

93
Citations
Micromirror device package

Thomas P. Glenn;Steven Webster;Roy Dale Hollaway

85
Citations
Method for forming a flip chip pressure sensor die package

Steven Webster

84
Citations

Frequent Co-Authors

Thomas P. Glenn Amkor Technology (United States)

External Links

Personal website of Steven Webster

If you think any of the details on this page are incorrect, let us know.

Related Online Degrees & Career Pathways

For students pursuing Electronics and Electrical Engineering, expanding skills in project management can be a valuable asset. Many professionals complement their technical expertise with a project management bachelor degree online, which offers flexibility and practical training essential for leadership roles.

To fast-track career advancements, accelerated programs are an attractive option. Options like the best online accelerated project management degree enable students to earn credentials faster without compromising quality. Many of these are available as accelerated online bachelor degree programs accredited, ensuring recognition by employers and academic institutions alike.

Additionally, for those interested in education technology or corporate training roles, pursuing an online masters in instructional design can provide specialized knowledge in designing effective learning solutions.

Choosing the right complementary degree can enhance both career prospects and professional versatility in the broad field of Electronics and Electrical Engineering.