World's Best Scientists 2026 revealed!
Peter S. Andrews

Peter S. Andrews

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
32
Citations
4310
World Ranking
6320
National Ranking
2081

Overview

What is he best known for?

The fields of study he is best known for:

  • Mechanical engineering
  • Optoelectronics
  • Electrical engineering

His scientific interests lie mostly in Optoelectronics, Optics, Light-emitting diode, Semiconductor and Light emitting device. The Optoelectronics study combines topics in areas such as Layer, Substrate, Substrate and Chip. His biological study spans a wide range of topics, including Electrical conductor and Solder material.

His work is dedicated to discovering how Optics, Voltage are connected with Light extraction in LEDs, Electronic component and Light emission and other disciplines. His research in Light-emitting diode intersects with topics in Lens and Thermal management of electronic devices and systems. Within one scientific family, Peter S. Andrews focuses on topics pertaining to Wavelength conversion under Semiconductor, and may sometimes address concerns connected to Node and Ray.

His most cited work include:

  • Trench cut light emitting diodes and methods of fabricating same (203 citations)
  • Integrated heat spreaders for light emitting devices (LEDs) and related assemblies (140 citations)
  • Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same (135 citations)

What are the main themes of his work throughout his whole career to date?

His primary scientific interests are in Optoelectronics, Optics, Light-emitting diode, Semiconductor and Substrate. His research integrates issues of Die, Chip and Layer, Substrate, Light emitting device in his study of Optoelectronics. His work investigates the relationship between Optics and topics such as Voltage that intersect with problems in Wavelength.

His studies examine the connections between Light-emitting diode and genetics, as well as such issues in Cathode, with regards to Solder mask. Peter S. Andrews interconnects Reflector and Meniscus in the investigation of issues within Semiconductor. His work deals with themes such as Electronic component, Electrical conductor, Light extraction in LEDs and Light emitter, which intersect with Substrate.

He most often published in these fields:

  • Optoelectronics (86.92%)
  • Optics (42.31%)
  • Light-emitting diode (41.54%)

What were the highlights of his more recent work (between 2014-2020)?

  • Optoelectronics (86.92%)
  • Light-emitting diode (41.54%)
  • Chip (14.62%)

In recent papers he was focusing on the following fields of study:

His main research concerns Optoelectronics, Light-emitting diode, Chip, High density and Solid-state lighting. His specific area of interest is Optoelectronics, where Peter S. Andrews studies Semiconductor. He has included themes like Layer, Electrical conductor, Diode and Flip chip in his Light-emitting diode study.

His Solid-state lighting research is multidisciplinary, incorporating perspectives in Passivation, Coating, Thermal copper pillar bump and Fillet. His Substrate research integrates issues from Injector and Light emitter. His work on Color rendering index as part of general Optics research is frequently linked to Computer science, Omnidirectional antenna and Face, thereby connecting diverse disciplines of science.

Between 2014 and 2020, his most popular works were:

  • High density pixelated led and devices and methods thereof (23 citations)
  • Low optical loss flip chip solid state lighting device (19 citations)
  • Solid state lighting components (11 citations)

In his most recent research, the most cited papers focused on:

  • Mechanical engineering
  • Electrical engineering
  • Polymer

Optoelectronics, Light-emitting diode, Solid-state lighting, Flip chip and Color rendering index are his primary areas of study. Peter S. Andrews has researched Optoelectronics in several fields, including Die, Scattering and Chip. Peter S. Andrews combines subjects such as Cathode, Anode, Electrical connection and Metal sheet with his study of Die.

His work carried out in the field of Scattering brings together such families of science as Crosstalk and 3D printing. His studies in Chip integrate themes in fields like Coating, Passivation, Thermal copper pillar bump and Fillet. His Color rendering index study deals with the bigger picture of Optics.

Best Publications

  • Trench cut light emitting diodes and methods of fabricating same

    Michael T Bruhns;Bradley E Williams;Jeff Lahaye;Peter Andrews

  • Integrated heat spreaders for leds and related assemblies

    Nicholas W. Medendorp;Peter Andrews

  • Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same

    Peter Andrews

  • Package for semiconductor light emitting device using distributed sealant and method for packaging the same

    Andrews Peter;アンドリュース ピーター

  • Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same

    Ronan P. Letoquin;Peter Scott Andrews

  • Light emitting diodes including modifications for submount bonding and manufacturing methods therefor

    David B. Slater;Bradley E. Williams;Peter S. Andrews

  • Methods of assembly for a semiconductor light emitting device package

    Peter Scott Andrews

  • High voltage array light emitting diode (led) devices and fixtures

    Christopher P. Hussell;Jesse Colin Reiherzer;Jeffrey Carl Britt;Praneet Athalye

  • Light emitting devices and methods

    Christopher P. Hussell;Peter Scott Andrews;Jesse Colin Reiherzer;David T. Emerson

  • Light emitting diodes including modifications for submount bonding

    David B. Slater;Bradley E. Williams;Peter S. Andrews

  • Packaged light emitting devices

    Peter Andrews;Thomas G. Coleman;James Ibbetson;Michael Leung

  • Reflector packages and semiconductor light emitting devices including the same

    Peter Andrews;Thomas G. Coleman;James Ibbetson;Michael Leung

  • Light emitting diodes including current spreading layer and barrier sublayers

    David B. Slater;Bradley E. Williams;Peter S. Andrews;John A. Edmond

  • Light emitting devices suitable for flip-chip bonding

    David B. Slater;Jayesh Bharathan;John Edmond;Mark Raffetto

  • Optical preforming of solid-state light-emitting die, manufacturing method therefor, assembly method, and system

    Peter S Andrews;Ronan P Le Toquin;エス. アンドリューズ ピーター;ピー. レ トーキン ロナン

  • Semiconductor substrate assemblies and methods for

    Negley Gerald H;Andrews Peter;Brown Elbert

  • High CRI lighting device with added long-wavelength blue color

    Gerald H. Negley;Antony Paul Van de Ven;Bernd P. Keller;Ronan P. LeToquin

  • Semiconductor light emitting devices and submounts

    Bernd Keller;James Ibbetson;Peter Andrews;Gerald H. Negley

  • Method of uniform phosphor chip coating and LED package fabricated using method

    Ban P. Loh;Nicholas W. Medendorp;Peter Andrews;Yankun Fu

  • Methods of fabricating light emitting devices using mesa regions and passivation layers

    David B. Slater;Bradley E. Williams;Peter S. Andrews

Frequent Co-Authors

Gerald H. Negley
Gerald H. Negley Wolfspeed, Inc.
John Adam Edmond
John Adam Edmond Wolfspeed, Inc.
bernd keller
bernd keller Cree (United States)
Antony Paul Van de Ven
Antony Paul Van de Ven Wolfspeed, Inc.

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