Benjamin N. Eldridge mainly focuses on Substrate, Interconnection, Electronic component, Structural engineering and Optoelectronics. His Substrate study typically links adjacent topics like Spring. His Interconnection research incorporates elements of Nanotechnology, Core and Integrated circuit.
His Electronic component study combines topics in areas such as Contact area and Microelectronics. His research integrates issues of Soldering and Interposer in his study of Optoelectronics. Benjamin N. Eldridge has researched Wafer in several fields, including Semiconductor device and Electronic engineering.
Substrate, Electronic component, Optoelectronics, Interconnection and Probe card are his primary areas of study. His Substrate research incorporates themes from Mechanical engineering, Structural engineering and Spring. His Electronic component research integrates issues from Electrical conductor, Semiconductor device, Printed circuit board and Microelectronics.
His work on Wafer as part of general Optoelectronics research is frequently linked to Fabrication and Wire bonding, thereby connecting diverse disciplines of science. His study on Interconnection also encompasses disciplines like
His primary areas of investigation include Substrate, Optoelectronics, Electrically conductive, Composite material and Structural engineering. Benjamin N. Eldridge interconnects Electronic component, Epoxy, Interconnection and Spring in the investigation of issues within Substrate. In his research, Semiconductor device is intimately related to Contact region, which falls under the overarching field of Interconnection.
The concepts of his Spring study are interwoven with issues in Wafer and Tile. His Optoelectronics study integrates concerns from other disciplines, such as Computer hardware, Electronic engineering and Electrical engineering. His Structural engineering research includes elements of Contact element and Interposer.
Benjamin N. Eldridge spends much of his time researching Substrate, Electronic component, Semiconductor device, Electrically conductive and Composite material. His work deals with themes such as Adhesive, Epoxy, Interconnection and Contact region, which intersect with Substrate. He has included themes like Optoelectronics and Interposer in his Electronic component study.
His studies deal with areas such as Falsework, Printed circuit board, Contact area and Soldering as well as Optoelectronics. The Semiconductor device study combines topics in areas such as Redistribution, Contactor, Mechanical engineering, Conductive materials and Electrical engineering. His work carried out in the field of Electrically conductive brings together such families of science as Axial symmetry, Metal, Carbon nanotube, Electrical resistivity and conductivity and Base.
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Interposer, socket and assembly for socketing an electronic component and method of making and using same
H. Dozier Ii Thomas;Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros.
(1998)
Interposer, socket and assembly for socketing an electronic component and method of making and using same
H. Dozier Ii Thomas;Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros.
(1998)
Resilient contact structures formed and then attached to a substrate
Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu.
(2001)
Resilient contact structures formed and then attached to a substrate
Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu.
(2001)
Contact carriers (tiles) for populating larger substrates with spring contacts
Igor Y. Khandros;Benjamin N. Eldridge;Gaetan L. Mathieu;II Thomas H. Dozier.
(2003)
Contact carriers (tiles) for populating larger substrates with spring contacts
Igor Y. Khandros;Benjamin N. Eldridge;Gaetan L. Mathieu;II Thomas H. Dozier.
(2003)
Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method
Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu.
(1998)
Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method
Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu.
(1998)
Probe card assembly and kit, and methods of making same
Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu.
(2001)
Probe card assembly and kit, and methods of making same
Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu.
(2001)
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