World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
54
Citations
10711
World Ranking
2299
National Ranking
896

benjamin n eldridge publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where benjamin n eldridge sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 110 publications — 5th percentile

5% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

benjamin n eldridge D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where benjamin n eldridge sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 54 D-Index — 68th percentile

68% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Mechanical engineering
  • Composite material

Benjamin N. Eldridge mainly focuses on Substrate, Interconnection, Electronic component, Structural engineering and Optoelectronics. His Substrate study typically links adjacent topics like Spring. His Interconnection research incorporates elements of Nanotechnology, Core and Integrated circuit.

His Electronic component study combines topics in areas such as Contact area and Microelectronics. His research integrates issues of Soldering and Interposer in his study of Optoelectronics. Benjamin N. Eldridge has researched Wafer in several fields, including Semiconductor device and Electronic engineering.

His most cited work include:

  • Contact carriers (tiles) for populating larger substrates with spring contacts (307 citations)
  • Probe card assembly and kit, and methods of making same (289 citations)
  • Lithographic contact elements (271 citations)

What are the main themes of his work throughout his whole career to date?

Substrate, Electronic component, Optoelectronics, Interconnection and Probe card are his primary areas of study. His Substrate research incorporates themes from Mechanical engineering, Structural engineering and Spring. His Electronic component research integrates issues from Electrical conductor, Semiconductor device, Printed circuit board and Microelectronics.

His work on Wafer as part of general Optoelectronics research is frequently linked to Fabrication and Wire bonding, thereby connecting diverse disciplines of science. His study on Interconnection also encompasses disciplines like

  • Electronic engineering which is related to area like Die and Integrated circuit,
  • Semiconductor, which have a strong connection to Contactor. His Probe card research is multidisciplinary, incorporating elements of Transformer, Computer hardware and Interposer.

He most often published in these fields:

  • Substrate (44.37%)
  • Electronic component (36.42%)
  • Optoelectronics (33.77%)

What were the highlights of his more recent work (between 2007-2018)?

  • Substrate (44.37%)
  • Optoelectronics (33.77%)
  • Electrically conductive (6.62%)

In recent papers he was focusing on the following fields of study:

His primary areas of investigation include Substrate, Optoelectronics, Electrically conductive, Composite material and Structural engineering. Benjamin N. Eldridge interconnects Electronic component, Epoxy, Interconnection and Spring in the investigation of issues within Substrate. In his research, Semiconductor device is intimately related to Contact region, which falls under the overarching field of Interconnection.

The concepts of his Spring study are interwoven with issues in Wafer and Tile. His Optoelectronics study integrates concerns from other disciplines, such as Computer hardware, Electronic engineering and Electrical engineering. His Structural engineering research includes elements of Contact element and Interposer.

Between 2007 and 2018, his most popular works were:

  • Spring interconnect structures (114 citations)
  • Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out (53 citations)
  • Non-Linear Vertical Leaf Spring (27 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Mechanical engineering
  • Composite material

Benjamin N. Eldridge spends much of his time researching Substrate, Electronic component, Semiconductor device, Electrically conductive and Composite material. His work deals with themes such as Adhesive, Epoxy, Interconnection and Contact region, which intersect with Substrate. He has included themes like Optoelectronics and Interposer in his Electronic component study.

His studies deal with areas such as Falsework, Printed circuit board, Contact area and Soldering as well as Optoelectronics. The Semiconductor device study combines topics in areas such as Redistribution, Contactor, Mechanical engineering, Conductive materials and Electrical engineering. His work carried out in the field of Electrically conductive brings together such families of science as Axial symmetry, Metal, Carbon nanotube, Electrical resistivity and conductivity and Base.

Best Publications

  • Interposer, socket and assembly for socketing an electronic component and method of making and using same

    H. Dozier Ii Thomas;Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros

  • Resilient contact structures formed and then attached to a substrate

    Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu

  • Contact carriers (tiles) for populating larger substrates with spring contacts

    Igor Y. Khandros;Benjamin N. Eldridge;Gaetan L. Mathieu;II Thomas H. Dozier

  • Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

    Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu

  • Probe card assembly and kit, and methods of making same

    Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu

  • Method of planarizing tips of probe elements of a probe card assembly

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures

    Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu

  • Fabricating interconnects and tips using sacrificial substrates

    Igor Y. Khandros;Benjamin N. Eldridge;Gaetean L. Mathieu

  • Apparatus for reducing power supply noise in an integrated circuit

    Benjamin N. Eldridge;Charles A. Miller

  • Special contact points for accessing internal circuitry of an integrated circuit

    Benjamin N. Eldridge;Igor Y. Khandros;David V. Pedersen;Ralph G. Whitten

  • Mounting spring elements on semiconductor devices

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Interconnect assemblies and methods

    Benjamin N. Eldridge;Gaetan Mathieu

  • Method of forming an interconnection element

    Gaetan L. Mathieu;Benjamin N. Eldridge

  • Probe card assembly

    Igor Y. Khandros;A. Nicholas Sporck;Benjamin N. Eldridge

  • Microelectronic contact structures, and methods of making same

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Test assembly including a test die for testing a semiconductor product die

    Benjamin N. Eldridge;Igor Y. Khandros;David V. Pedersen;Ralph G. Whitten

  • Method of making microelectronic contact structures

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Method of making microelectronic spring contact elements

    Benjamin N. Eldridge;Igor Y. Khandros;Gaetan L. Mathieu;David V. Pedersen

  • Apparatus and method for limiting over travel in a probe card assembly

    Timothy E. Cooper;Benjamin N. Eldridge;Carl V. Reynolds;Ravindra Vaman Shenoy

  • Method of manufacturing a probe card

    Gary W. Grube;Igor K. Khandros;Benjamin N. Eldridge;Gaetan L. Mathieu

Frequent Co-Authors

Igor Y. Khandros
Igor Y. Khandros Nutcracker Therapeutics
Gary W. Grube
Gary W. Grube Motorola (United States)
Charles A. Miller
Charles A. Miller University of Iowa

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