D-Index & Metrics Best Publications

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Electronics and Electrical Engineering D-index 54 Citations 10,695 110 World Ranking 1420 National Ranking 644

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Mechanical engineering
  • Composite material

Benjamin N. Eldridge mainly focuses on Substrate, Interconnection, Electronic component, Structural engineering and Optoelectronics. His Substrate study typically links adjacent topics like Spring. His Interconnection research incorporates elements of Nanotechnology, Core and Integrated circuit.

His Electronic component study combines topics in areas such as Contact area and Microelectronics. His research integrates issues of Soldering and Interposer in his study of Optoelectronics. Benjamin N. Eldridge has researched Wafer in several fields, including Semiconductor device and Electronic engineering.

His most cited work include:

  • Contact carriers (tiles) for populating larger substrates with spring contacts (307 citations)
  • Probe card assembly and kit, and methods of making same (289 citations)
  • Lithographic contact elements (271 citations)

What are the main themes of his work throughout his whole career to date?

Substrate, Electronic component, Optoelectronics, Interconnection and Probe card are his primary areas of study. His Substrate research incorporates themes from Mechanical engineering, Structural engineering and Spring. His Electronic component research integrates issues from Electrical conductor, Semiconductor device, Printed circuit board and Microelectronics.

His work on Wafer as part of general Optoelectronics research is frequently linked to Fabrication and Wire bonding, thereby connecting diverse disciplines of science. His study on Interconnection also encompasses disciplines like

  • Electronic engineering which is related to area like Die and Integrated circuit,
  • Semiconductor, which have a strong connection to Contactor. His Probe card research is multidisciplinary, incorporating elements of Transformer, Computer hardware and Interposer.

He most often published in these fields:

  • Substrate (44.37%)
  • Electronic component (36.42%)
  • Optoelectronics (33.77%)

What were the highlights of his more recent work (between 2007-2018)?

  • Substrate (44.37%)
  • Optoelectronics (33.77%)
  • Electrically conductive (6.62%)

In recent papers he was focusing on the following fields of study:

His primary areas of investigation include Substrate, Optoelectronics, Electrically conductive, Composite material and Structural engineering. Benjamin N. Eldridge interconnects Electronic component, Epoxy, Interconnection and Spring in the investigation of issues within Substrate. In his research, Semiconductor device is intimately related to Contact region, which falls under the overarching field of Interconnection.

The concepts of his Spring study are interwoven with issues in Wafer and Tile. His Optoelectronics study integrates concerns from other disciplines, such as Computer hardware, Electronic engineering and Electrical engineering. His Structural engineering research includes elements of Contact element and Interposer.

Between 2007 and 2018, his most popular works were:

  • Spring interconnect structures (114 citations)
  • Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out (53 citations)
  • Non-Linear Vertical Leaf Spring (27 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Mechanical engineering
  • Composite material

Benjamin N. Eldridge spends much of his time researching Substrate, Electronic component, Semiconductor device, Electrically conductive and Composite material. His work deals with themes such as Adhesive, Epoxy, Interconnection and Contact region, which intersect with Substrate. He has included themes like Optoelectronics and Interposer in his Electronic component study.

His studies deal with areas such as Falsework, Printed circuit board, Contact area and Soldering as well as Optoelectronics. The Semiconductor device study combines topics in areas such as Redistribution, Contactor, Mechanical engineering, Conductive materials and Electrical engineering. His work carried out in the field of Electrically conductive brings together such families of science as Axial symmetry, Metal, Carbon nanotube, Electrical resistivity and conductivity and Base.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Interposer, socket and assembly for socketing an electronic component and method of making and using same

H. Dozier Ii Thomas;Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros.
(1998)

550 Citations

Interposer, socket and assembly for socketing an electronic component and method of making and using same

H. Dozier Ii Thomas;Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros.
(1998)

550 Citations

Resilient contact structures formed and then attached to a substrate

Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu.
(2001)

499 Citations

Resilient contact structures formed and then attached to a substrate

Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu.
(2001)

499 Citations

Contact carriers (tiles) for populating larger substrates with spring contacts

Igor Y. Khandros;Benjamin N. Eldridge;Gaetan L. Mathieu;II Thomas H. Dozier.
(2003)

469 Citations

Contact carriers (tiles) for populating larger substrates with spring contacts

Igor Y. Khandros;Benjamin N. Eldridge;Gaetan L. Mathieu;II Thomas H. Dozier.
(2003)

469 Citations

Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu.
(1998)

467 Citations

Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu.
(1998)

467 Citations

Probe card assembly and kit, and methods of making same

Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu.
(2001)

438 Citations

Probe card assembly and kit, and methods of making same

Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu.
(2001)

438 Citations

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