World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
54
Citations
10711
World Ranking
2299
National Ranking
895

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Mechanical engineering
  • Composite material

Benjamin N. Eldridge mainly focuses on Substrate, Interconnection, Electronic component, Structural engineering and Optoelectronics. His Substrate study typically links adjacent topics like Spring. His Interconnection research incorporates elements of Nanotechnology, Core and Integrated circuit.

His Electronic component study combines topics in areas such as Contact area and Microelectronics. His research integrates issues of Soldering and Interposer in his study of Optoelectronics. Benjamin N. Eldridge has researched Wafer in several fields, including Semiconductor device and Electronic engineering.

His most cited work include:

  • Contact carriers (tiles) for populating larger substrates with spring contacts (307 citations)
  • Probe card assembly and kit, and methods of making same (289 citations)
  • Lithographic contact elements (271 citations)

What are the main themes of his work throughout his whole career to date?

Substrate, Electronic component, Optoelectronics, Interconnection and Probe card are his primary areas of study. His Substrate research incorporates themes from Mechanical engineering, Structural engineering and Spring. His Electronic component research integrates issues from Electrical conductor, Semiconductor device, Printed circuit board and Microelectronics.

His work on Wafer as part of general Optoelectronics research is frequently linked to Fabrication and Wire bonding, thereby connecting diverse disciplines of science. His study on Interconnection also encompasses disciplines like

  • Electronic engineering which is related to area like Die and Integrated circuit,
  • Semiconductor, which have a strong connection to Contactor. His Probe card research is multidisciplinary, incorporating elements of Transformer, Computer hardware and Interposer.

He most often published in these fields:

  • Substrate (44.37%)
  • Electronic component (36.42%)
  • Optoelectronics (33.77%)

What were the highlights of his more recent work (between 2007-2018)?

  • Substrate (44.37%)
  • Optoelectronics (33.77%)
  • Electrically conductive (6.62%)

In recent papers he was focusing on the following fields of study:

His primary areas of investigation include Substrate, Optoelectronics, Electrically conductive, Composite material and Structural engineering. Benjamin N. Eldridge interconnects Electronic component, Epoxy, Interconnection and Spring in the investigation of issues within Substrate. In his research, Semiconductor device is intimately related to Contact region, which falls under the overarching field of Interconnection.

The concepts of his Spring study are interwoven with issues in Wafer and Tile. His Optoelectronics study integrates concerns from other disciplines, such as Computer hardware, Electronic engineering and Electrical engineering. His Structural engineering research includes elements of Contact element and Interposer.

Between 2007 and 2018, his most popular works were:

  • Spring interconnect structures (114 citations)
  • Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out (53 citations)
  • Non-Linear Vertical Leaf Spring (27 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Mechanical engineering
  • Composite material

Benjamin N. Eldridge spends much of his time researching Substrate, Electronic component, Semiconductor device, Electrically conductive and Composite material. His work deals with themes such as Adhesive, Epoxy, Interconnection and Contact region, which intersect with Substrate. He has included themes like Optoelectronics and Interposer in his Electronic component study.

His studies deal with areas such as Falsework, Printed circuit board, Contact area and Soldering as well as Optoelectronics. The Semiconductor device study combines topics in areas such as Redistribution, Contactor, Mechanical engineering, Conductive materials and Electrical engineering. His work carried out in the field of Electrically conductive brings together such families of science as Axial symmetry, Metal, Carbon nanotube, Electrical resistivity and conductivity and Base.

Best Publications

  • Interposer, socket and assembly for socketing an electronic component and method of making and using same

    H. Dozier Ii Thomas;Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros

  • Resilient contact structures formed and then attached to a substrate

    Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu

  • Contact carriers (tiles) for populating larger substrates with spring contacts

    Igor Y. Khandros;Benjamin N. Eldridge;Gaetan L. Mathieu;II Thomas H. Dozier

  • Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

    Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu

  • Probe card assembly and kit, and methods of making same

    Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu

  • Method of planarizing tips of probe elements of a probe card assembly

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures

    Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu

  • Fabricating interconnects and tips using sacrificial substrates

    Igor Y. Khandros;Benjamin N. Eldridge;Gaetean L. Mathieu

  • Apparatus for reducing power supply noise in an integrated circuit

    Benjamin N. Eldridge;Charles A. Miller

  • Special contact points for accessing internal circuitry of an integrated circuit

    Benjamin N. Eldridge;Igor Y. Khandros;David V. Pedersen;Ralph G. Whitten

  • Mounting spring elements on semiconductor devices

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Interconnect assemblies and methods

    Benjamin N. Eldridge;Gaetan Mathieu

  • Method of forming an interconnection element

    Gaetan L. Mathieu;Benjamin N. Eldridge

  • Probe card assembly

    Igor Y. Khandros;A. Nicholas Sporck;Benjamin N. Eldridge

  • Microelectronic contact structures, and methods of making same

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Test assembly including a test die for testing a semiconductor product die

    Benjamin N. Eldridge;Igor Y. Khandros;David V. Pedersen;Ralph G. Whitten

  • Method of making microelectronic contact structures

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Method of making microelectronic spring contact elements

    Benjamin N. Eldridge;Igor Y. Khandros;Gaetan L. Mathieu;David V. Pedersen

  • Apparatus and method for limiting over travel in a probe card assembly

    Timothy E. Cooper;Benjamin N. Eldridge;Carl V. Reynolds;Ravindra Vaman Shenoy

  • Method of manufacturing a probe card

    Gary W. Grube;Igor K. Khandros;Benjamin N. Eldridge;Gaetan L. Mathieu

Frequent Co-Authors

Igor Y. Khandros
Igor Y. Khandros Nutcracker Therapeutics
Gary W. Grube
Gary W. Grube Motorola (United States)
Charles A. Miller
Charles A. Miller University of Iowa

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