Rickie C. Lake

What is he best known for?

The fields of study he is best known for:

• Electrical engineering
• Mechanical engineering
• Composite material

Optoelectronics, Substrate, Wafer, Integrated circuit and Optics are his primary areas of study. His studies deal with areas such as Electrical conductor, Electronic circuit and Electronic engineering as well as Optoelectronics. The concepts of his Electrical conductor study are interwoven with issues in Ball and Terminal.

Substrate is closely attributed to Adhesive in his research. His studies in Integrated circuit integrate themes in fields like Die, Antenna and Transceiver. In his study, Blank, Base, Lens and Micro electrical mechanical systems is strongly linked to Mold, which falls under the umbrella field of Optics.

His most cited work include:

• Method of manufacturing an enclosed transceiver (452 citations)
• Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant (163 citations)
• Imaging module with symmetrical lens system and method of manufacture (138 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of investigation include Electrical conductor, Substrate, Composite material, Optoelectronics and Electrical engineering. His research integrates issues of Electronic circuit, Integrated circuit, Battery, Coupling and Electrical connection in his study of Electrical conductor. His Substrate research is multidisciplinary, incorporating elements of Adhesive, Conductive materials and Node.

Rickie C. Lake interconnects Cathode and Anode in the investigation of issues within Composite material. His Optoelectronics study integrates concerns from other disciplines, such as Electronic engineering, Soldering and Electronics. His Antenna, Signal, Terminal and Radio frequency communication study, which is part of a larger body of work in Electrical engineering, is frequently linked to Radio-frequency identification, bridging the gap between disciplines.

He most often published in these fields:

• Electrical conductor (39.02%)
• Substrate (38.21%)
• Composite material (33.33%)

What were the highlights of his more recent work (between 2006-2015)?

• Optics (11.38%)
• Wafer (13.01%)
• Optoelectronics (30.89%)

In recent papers he was focusing on the following fields of study:

His main research concerns Optics, Wafer, Optoelectronics, Substrate and Lens. His Wafer research includes elements of Die, Structural engineering and Integrated circuit. Specifically, his work in Optoelectronics is concerned with the study of Microelectronics.

A significant part of his Substrate research incorporates Layer and Composite material studies. His Layer research incorporates elements of Electrical conductor, Engineering drawing and Chip. Rickie C. Lake focuses mostly in the field of Lens, narrowing it down to matters related to Base and, in some cases, Blank.

Between 2006 and 2015, his most popular works were:

• Imaging module with symmetrical lens system and method of manufacture (138 citations)
• Wafer level lens replication on micro-electrical-mechanical systems (107 citations)
• Method and apparatus providing combined spacer and optical lens element (102 citations)

In his most recent research, the most cited papers focused on:

• Electrical engineering
• Mechanical engineering
• Composite material

Optics, Wafer, Lens, Substrate and Optoelectronics are his primary areas of study. While the research belongs to areas of Optics, Rickie C. Lake spends his time largely on the problem of Mold, intersecting his research to questions surrounding Base, Blank, Micro electrical mechanical systems and Lens. Rickie C. Lake combines subjects such as Electrical conductor and Conductive materials with his study of Substrate.

His study in Microelectronics and Integrated circuit is carried out as part of his Optoelectronics studies. His Microelectronics study incorporates themes from Aperture, Wafer-level packaging and Flip chip. His Die study combines topics from a wide range of disciplines, such as Electronic circuit, Grinding and Wafer testing.