World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
51
Citations
10682
World Ranking
2657
National Ranking
1012

Paul W. Coteus publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Paul W. Coteus sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 199 publications — 29th percentile

29% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Paul W. Coteus D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Paul W. Coteus sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 51 D-Index — 63rd percentile

63% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Research.com Recognitions

  • 2013 - IEEE Fellow For contributions to packaging for high performance computing systems

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Operating system
  • Central processing unit

Paul W. Coteus mainly focuses on Massively parallel, Integrated circuit, Supercomputer, Electrical engineering and Electronic engineering. The Massively parallel study combines topics in areas such as IBM, Blue gene and Node. Paul W. Coteus interconnects Integrated circuit design, Structure, Layer and Interconnection in the investigation of issues within Integrated circuit.

His work deals with themes such as Software, Application-specific integrated circuit and Network packet, which intersect with Supercomputer. He has researched Electrical engineering in several fields, including Interface, Smart memory and Offset. His Electronic engineering research is multidisciplinary, relying on both Busbar, Interleaved memory, Electric power transmission and Inductive coupling.

His most cited work include:

  • Multi-petascale highly efficient parallel supercomputer (385 citations)
  • Overview of the Blue Gene/L system architecture (370 citations)
  • When are transmission-line effects important for on-chip interconnections? (353 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of study are Electrical engineering, Computer hardware, Electronic engineering, Optoelectronics and Chip. Paul W. Coteus studied Electrical engineering and Interposer that intersect with Transverse plane and Plane. In most of his Computer hardware studies, his work intersects topics such as Embedded system.

His studies examine the connections between Electronic engineering and genetics, as well as such issues in Integrated circuit, with regards to Supercomputer. His Optoelectronics research includes themes of Layer and Substrate. His study in Chip is interdisciplinary in nature, drawing from both Mechanical engineering, Electrical conductor and Lead frame.

He most often published in these fields:

  • Electrical engineering (27.49%)
  • Computer hardware (24.70%)
  • Electronic engineering (20.32%)

What were the highlights of his more recent work (between 2014-2020)?

  • Electrical engineering (27.49%)
  • Inductor (1.99%)
  • Printed circuit board (6.37%)

In recent papers he was focusing on the following fields of study:

The scientist’s investigation covers issues in Electrical engineering, Inductor, Printed circuit board, Electronic engineering and Memory module. Paul W. Coteus applies his multidisciplinary studies on Electrical engineering and Anode in his research. His Inductor research incorporates elements of Planar, Transformer, Sense and Inductance.

His research integrates issues of Electrical contacts, Substrate, Topology and Electrical conductor in his study of Printed circuit board. The concepts of his Electronic engineering study are interwoven with issues in Network link, Computer network, Network packet and Power mode. Memory module is a subfield of Computer hardware that Paul W. Coteus studies.

Between 2014 and 2020, his most popular works were:

  • Flexible cold plate with enhanced flexibility (17 citations)
  • Analytic model for power MOSFET turn-off switching loss under the effect of significant current diversion at fast switching events (8 citations)
  • Power management of network links (6 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Operating system
  • Central processing unit

His primary areas of study are Current, Control theory, Electronic engineering, MOSFET and Composite material. The various areas that Paul W. Coteus examines in his Control theory study include Clock skew, Clock domain crossing, Synchronous circuit, Phase and Quadrature. Paul W. Coteus has researched Electronic engineering in several fields, including Network link, Computer network, Network packet, Power mode and Power management.

His Composite material research includes themes of Electronic component, Planar and Structural engineering. His work carried out in the field of Structural engineering brings together such families of science as Conductive materials, Flexibility and Heat sink. Capacitor is a subfield of Electrical engineering that Paul W. Coteus tackles.

Best Publications

  • Massively parallel supercomputer

    Matthias A. Blumrich;Dong Chen;George L. Chiu;Thomas M. Cipolla

  • An Overview of the BlueGene/L Supercomputer

    N.R. Adiga;G. Almasi;G.S. Almasi;Y. Aridor

  • Overview of the Blue Gene/L system architecture

    A. Gara;M. A. Blumrich;D. Chen;G. L.-T. Chiu

  • When are transmission-line effects important for on-chip interconnections?

    A. Deutsch;G.V. Kopcsay;P.J. Restle;H.H. Smith

  • Multi-petascale highly efficient parallel supercomputer

    Sameh Asaad;Ralph E. Bellofatto;Michael A. Blocksome;Matthias A. Blumrich

  • RFID integrated in electronic assets

    Michael John Brady;Paul W. Coteus;Dah-Weih Duan;Venkata S. R. Kodukula

  • On-chip wiring design challenges for gigahertz operation

    A. Deutsch;P.W. Coteus;G.V. Kopcsay;H.H. Smith

  • Ultrascalable petaflop parallel supercomputer

    Matthias A. Blumrich;Dong Chen;George Chiu;Thomas M. Cipolla

  • Practical Strategies for Power-Efficient Computing Technologies

    L. Chang;D.J. Frank;R.K. Montoye;S.J. Koester

  • DOE Advanced Scientific Computing Advisory Subcommittee (ASCAC) Report: Top Ten Exascale Research Challenges

    Robert Lucas;James Ang;Keren Bergman;Shekhar Borkar

  • Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling

    Shawn A. Hall;Shurong Tian;Paul W. Coteus;John P. Karidis

  • System and method for inspection and alignment of semiconductor chips and conductive lead frames

    Thomas M. Cipolla;Paul W. Coteus;Glen W. Johnson;Philip Murphy

  • Smart memory interface

    Paul William Coteus;Daniel Mark Dreps;Frank Ferraiolo

  • 3-dimensional integrated circuit architecture, structure and method for fabrication thereof

    Kerry Bernstein;Paul W. Coteus;Philip G. Emma

  • Structure comprising 3-dimensional integrated circuit architecture, circuit structure, and instructions for fabrication thereof

    Kerry Bernstein;Paul William Coteus;Philip George Emma

  • Lead frame package for electronic devices

    Thomas Mario Cipolla;Paul William Coteus

  • Method and apparatus of water cooling several parallel circuit cards each containing several chip packages

    Thomas M. Cipolla;Shurong Tian;Evan George Colgan;Paul W. Coteus

  • Enhanced cascade interconnected memory system

    Kevin C. Gower;Paul W. Coteus;Warren E. Maule;Robert B. Tremaine

  • Advanced memory device having improved performance, reduced power and increased reliability

    Kyu-hyoun Kim;George L. Chiu;Paul W. Coteus;Daniel M. Dreps

  • When are transmission-line effects important for on-chip interconnections

    A. Deutsch;G.V. Kopcsay;P. Restle;G. Katopis

Frequent Co-Authors

Mark E. Giampapa
Mark E. Giampapa IBM (United States)
Philip Heidelberger
Philip Heidelberger IBM (United States)
Alan Gara
Alan Gara IBM (United States)
Warren E. Maule
Warren E. Maule IBM (United States)
Evan G. Colgan
Evan G. Colgan IBM (United States)
Kevin C. Gower
Kevin C. Gower IBM (United States)
Valentina Salapura
Valentina Salapura Google (United States)
Michael John Brady
Michael John Brady Tufts University
Robert H. Dennard
Robert H. Dennard IBM (United States)
Phillip J. Restle
Phillip J. Restle IBM (United States)

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