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Madhusudan K. Iyengar

Madhusudan K. Iyengar

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
70
Citations
11909
World Ranking
406
National Ranking
186

Research.com Recognitions

  • 2019 - Fellow of the American Society of Mechanical Engineers
  • 1941 - Fellow of the American Association for the Advancement of Science (AAAS)

Overview

Madhusudan K. Iyengar is a researcher affiliated with Google in the United States. Their academic contributions are primarily situated within the field of engineering, with a particular focus on mechanical engineering. Iyengar's publications also extend into related subfields such as electrical and electronic engineering, computational mechanics, biomedical engineering, and civil and structural engineering.

Their research topics encompass various aspects of heat transfer and optimization, including heat transfer and boiling studies, heat transfer mechanisms, as well as nanomaterials and printing technologies. Additional areas of study include fluid dynamics and thin films, innovative microfluidic and catalytic techniques innovation, and refrigeration and air conditioning technologies.

The scientist has collaborated frequently with several co-authors, including:

  • Mehdi Asheghi
  • Ki Wook Jung
  • Chris Malone
  • Kenneth E. Goodson
  • Mun Mun Nahar

Key publication venues for their work include:

  • Applied Thermal Engineering
  • International Journal of Heat and Mass Transfer
  • Journal of Electronic Packaging
  • IEEE Transactions on Components Packaging and Manufacturing Technology

Among the recent papers authored or co-authored by Iyengar are:

  • "Review article: Microscale evaporative cooling technologies for high heat flux microelectronics devices: Background and recent advances", 2021, Applied Thermal Engineering
  • "An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sink", 2021, Applied Thermal Engineering
  • "Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits", 2021, International Journal of Heat and Mass Transfer
  • "Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)-Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices", 2020, Journal of Electronic Packaging
  • "In Memoriam Prof. Avram Bar-Cohen", 2021, IEEE Transactions on Components Packaging and Manufacturing Technology

Iyengar has also contributed to academic literature through book publications. Notably, a book titled Embedded Cooling of Electronic Devices was published in 2023 by World Scientific.

Recognition of research contributions includes being named a Fellow of the American Society of Mechanical Engineers in 2019. Additionally, they hold the distinction of Fellow of the American Association for the Advancement of Science (AAAS), an honor dating back to 1941.

Best Publications

  • Challenges of data center thermal management

    R. R. Schmidt;E. E. Cruz;M. K. Iyengar

  • Design of Optimum Plate-Fin Natural Convective Heat Sinks

    Avram Bar-Cohen;Madhusudan Iyengar;Allan D. Kraus

  • Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Apparatus and method for facilitating cooling of an electronics system

    Madhusudan K. Iyengar;Vinod Kamath;Jason A. Matteson;Roger R. Schmidt

  • Server liquid cooling with chiller-less data center design to enable significant energy savings

    Madhusudan Iyengar;Milnes David;Pritish Parida;Vinod Kamath

  • Energy efficient apparatus and method for cooling an electronics rack

    Richard C. Chu;Madhusudan K. Iyengar;Vinod Kamath;Roger R. Schmidt

  • System of facilitating cooling of electronics racks of a data center employing multiple cooling stations

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Techniques for Data Center Cooling

    Alan Claassen;Hendrik F. Hamann;Madhusudan K. Iyengar;James Andrew Lacey

  • Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Method and apparatus for three-dimensional measurements of physical characteristics within a data center

    Hendrik F. Hamann;Madhusudan K. Iyengar;James A. Lacey;Martin P. O'Boyle

  • Design and optimization of air-cooled heat sinks for sustainable development

    A. Bar-Cohen;M. Iyengar

  • Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Method and air-cooling unit with dynamic airflow and heat removal adjustability

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Rack with integrated rear-door heat exchanger

    Alan Claassen;Eric Alan Eckberg;Dennis John Hansen;Vinod Kamath

  • Comparative Analysis of Different Data Center Airflow Management Configurations

    Saurabh Shrivastava;Bahgat Sammakia;Roger Schmidt;Madhusudan Iyengar

  • Electronic module with pump-enhanced, dielectric fluid immersion-cooling

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Liquid-cooled electronics rack with immersion-cooled electronic subsystems

    Levi A. Campbell;Richard C. Chu;Michael J. Ellsworth;Madhusudan K. Iyengar

  • Inter-rack airflow arresting apparatus and method for facilitating cooling of an electronics rack of a data center

    Allan R. Hoeft;Madhusudan K. Iyengar;Francis R. Krug;Steven C. McIntosh

Frequent Co-Authors

Roger R. Schmidt
Roger R. Schmidt IBM (United States)
Robert E. Simons
Robert E. Simons IBM (United States)
Richard C. Chu
Richard C. Chu IBM (United States)
Michael J. Ellsworth
Michael J. Ellsworth IBM (United States)
Bahgat Sammakia
Bahgat Sammakia Binghamton University
Hendrik F. Hamann
Hendrik F. Hamann IBM (United States)
Avram Bar-Cohen
Avram Bar-Cohen University of Maryland, College Park
Evan G. Colgan
Evan G. Colgan IBM (United States)
Yogendra Joshi
Yogendra Joshi Georgia Institute of Technology
Da-Yuan Shih
Da-Yuan Shih IBM (United States)

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