1999 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers
1994 - ASME Medal, The American Society of Mechanical Engineers
1994 - Edwin F. Church Medal, The American Society of Mechanical Engineers
1993 - IEEE Fellow For contributions to the understanding of thermal phenomena in electronic packaging.
1983 - Fellow of the American Society of Mechanical Engineers
Avram Bar-Cohen mainly focuses on Thermodynamics, Heat transfer, Mechanics, Heat sink and Mechanical engineering. His work carried out in the field of Thermodynamics brings together such families of science as Engineering physics and Dielectric. He combines subjects such as Thermal conduction and Microelectronics with his study of Heat transfer.
His research investigates the link between Mechanics and topics such as Fin that cross with problems in Micro heat exchanger, Plate heat exchanger and Convective heat transfer. His Heat sink research is multidisciplinary, incorporating elements of Thermal resistance, Work and Passive cooling. His Mechanical engineering research includes elements of Reciprocity, Thermal analysis, Thermal and Convection.
His primary scientific interests are in Heat transfer, Thermodynamics, Mechanics, Thermal and Mechanical engineering. His Heat transfer research incorporates elements of Thermal conduction, Composite material and Heat sink. Much of his study explores Thermodynamics relationship to Liquid dielectric.
His study looks at the intersection of Thermal and topics like Thermal conductivity with Annular fin. His studies in Mechanical engineering integrate themes in fields like Thermoelectric effect and Electronics. His biological study spans a wide range of topics, including Silicon and Thermoelectric cooling.
His scientific interests lie mostly in Heat transfer, Thermal, Optoelectronics, Heat transfer coefficient and Mechanics. His Heat transfer study contributes to a more complete understanding of Thermodynamics. His Thermal research is multidisciplinary, incorporating elements of Mechanical engineering, Thermal conductivity, Process engineering and Polymer.
His work carried out in the field of Optoelectronics brings together such families of science as Temperature measurement, Electronic engineering and Thermoelectric cooling. He works mostly in the field of Heat transfer coefficient, limiting it down to concerns involving Pressure drop and, occasionally, Communication channel. In his study, Flow is strongly linked to Tube, which falls under the umbrella field of Mechanics.
His primary areas of investigation include Thermal resistance, Heat transfer, Thermal, Heat transfer coefficient and Electronics. Avram Bar-Cohen interconnects Mechanical engineering, Diamond and Engineering physics in the investigation of issues within Thermal resistance. He works in the field of Heat transfer, namely Heat flux.
His Thermal research also works with subjects such as
This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.
Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates
Avram Bar-Cohen;Warren M. Rohsenow.
Journal of Heat Transfer-transactions of The Asme (1984)
Thermal Analysis and Control of Electronic Equipment
Allan D. Kraus;Avram Bar-Cohen.
Direct Liquid Cooling of High Flux Micro and Nano Electronic Components
A. Bar-Cohen;M. Arik;M. Ohadi.
Proceedings of the IEEE (2006)
Design and analysis of heat sinks
Allan D. Kraus;Avram Bar-Cohen.
Thermal management of electronic components with dielectric liquids
Jsme International Journal Series B-fluids and Thermal Engineering (1993)
Design of Optimum Plate-Fin Natural Convective Heat Sinks
Avram Bar-Cohen;Madhusudan Iyengar;Allan D. Kraus.
Journal of Electronic Packaging (2003)
Advances in Thermal Modeling of Electronic Components and Systems. Volume 1
Avram Bar-Cohen;Allan Kraus;V. P. Carey.
Evaporation and flow dynamics of thin, shear-driven liquid films in microgap channels
Oleg Kabov;Oleg Kabov;D.V. Zaitsev;D.V. Zaitsev;Vyacheslav Cheverda;A. Bar-Cohen.
Experimental Thermal and Fluid Science (2011)
theta /sub jc/ characterization of chip packages-justification, limitations, and future
A. Bar-Cohen;T. Elperin;R. Eliasi.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology (1989)
Thermal Management of Air- and Liquid-Cooled Multichip Modules
IEEE Transactions on Components, Hybrids, and Manufacturing Technology (1987)
Profile was last updated on December 6th, 2021.
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