The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where Avram Bar-Cohen sits on this spectrum.
This scientist: 382 publications — 85th percentile
85% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 659 publications or more.
The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Avram Bar-Cohen sits on this spectrum.
This scientist: 61 D-Index — 82nd percentile
82% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 93 D-Index or more.
Avram Bar-Cohen was affiliated with the University of Maryland, College Park in the United States. They contributed to the field of engineering, with a concentration on mechanical engineering. Their work also encompassed computational mechanics, biomedical engineering, electrical and electronic engineering, and spectroscopy as subfields of study.
Their research primarily addressed topics related to heat transfer and boiling studies, heat transfer and optimization, and fluid dynamics and thin films. Additional topics of their work included nanofluid flow and heat transfer, heat transfer mechanisms, semiconductor lasers and optical devices, and spectroscopy and laser applications.
Frequent coauthors in their research included K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, and Karlheinz Bock. Their publications were consistently featured in certain venues, especially in the journal IEEE Transactions on Components Packaging and Manufacturing Technology, where they had 24 publications. Other journals included Applied Physics B and Applied Sciences.
Selected recent papers authored or coauthored by Avram Bar-Cohen included the following:
Avram Bar-Cohen received several awards during their career. They were honored with the ASME Medal in 1994 and the Edwin F. Church Medal in the same year, both awarded by The American Society of Mechanical Engineers. Additionally, they received the Heat Transfer Memorial Award from the same society in 1999. In 1993, they were named an IEEE Fellow for their contributions to the understanding of thermal phenomena in electronic packaging. Earlier, in 1983, they became a Fellow of the American Society of Mechanical Engineers.
Avram Bar-Cohen;Warren M. Rohsenow
Allan D. Kraus;Avram Bar-Cohen
A. Bar-Cohen;M. Arik;M. Ohadi
Allan D. Kraus;Avram Bar-Cohen
Avram Bar-Cohen;Madhusudan Iyengar;Allan D. Kraus
Gary Bulman;Phil Barletta;Jay Lewis;Nicholas Baldasaro
Avram Bar-Cohen
Avram Bar-Cohen;Peng Wang
Oleg Kabov;Oleg Kabov;D.V. Zaitsev;D.V. Zaitsev;Vyacheslav Cheverda;A. Bar-Cohen
Avram Bar-Cohen;Allan Kraus;V. P. Carey
Mehmet Arik;Avram Bar-Cohen
Avram Bar-Cohen;Kaiser Matin;Sreekant Narumanchi
Mehmet Arik;Avram Bar-Cohen;Seung Mun You
A. Bar-Cohen;T. Elperin;R. Eliasi
A. Bar-Cohen
Peng Wang;Patrick McCluskey;Avram Bar-Cohen
S. Oktay;R. Hannemann;A. Bar-Cohen
W. Tong;A. Bar-Cohen;Terrence W Simon;S. M. You
Avram Bar-Cohen;Emil Rahim
A. Bar-Cohen;M. Iyengar
Avram Bar-Cohen
Avram Bar-Cohen;Allan D. Kraus;Peter A. Engel
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