1999 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers
1994 - ASME Medal, The American Society of Mechanical Engineers
1994 - Edwin F. Church Medal, The American Society of Mechanical Engineers
1993 - IEEE Fellow For contributions to the understanding of thermal phenomena in electronic packaging.
1983 - Fellow of the American Society of Mechanical Engineers
Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates
Avram Bar-Cohen;Warren M. Rohsenow.
Journal of Heat Transfer-transactions of The Asme (1984)
Thermal Analysis and Control of Electronic Equipment
Allan D. Kraus;Avram Bar-Cohen.
(1983)
Direct Liquid Cooling of High Flux Micro and Nano Electronic Components
A. Bar-Cohen;M. Arik;M. Ohadi.
Proceedings of the IEEE (2006)
Design and analysis of heat sinks
Allan D. Kraus;Avram Bar-Cohen.
(1995)
Design of Optimum Plate-Fin Natural Convective Heat Sinks
Avram Bar-Cohen;Madhusudan Iyengar;Allan D. Kraus.
Journal of Electronic Packaging (2003)
Thermal management of electronic components with dielectric liquids
Avram Bar-Cohen.
Jsme International Journal Series B-fluids and Thermal Engineering (1993)
Advances in Thermal Modeling of Electronic Components and Systems. Volume 1
Avram Bar-Cohen;Allan Kraus;V. P. Carey.
(1988)
Superlattice-based thin-film thermoelectric modules with high cooling fluxes
Gary Bulman;Phil Barletta;Jay Lewis;Nicholas Baldasaro.
Nature Communications (2016)
Evaporation and flow dynamics of thin, shear-driven liquid films in microgap channels
Oleg Kabov;Oleg Kabov;D.V. Zaitsev;D.V. Zaitsev;Vyacheslav Cheverda;A. Bar-Cohen.
Experimental Thermal and Fluid Science (2011)
Effusivity-based correlation of surface property effects in pool boiling CHF of dielectric liquids
Mehmet Arik;Avram Bar-Cohen.
International Journal of Heat and Mass Transfer (2003)
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