D-Index & Metrics Best Publications

D-Index & Metrics

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Mechanical and Aerospace Engineering D-index 48 Citations 7,437 200 World Ranking 403 National Ranking 198

Research.com Recognitions

Awards & Achievements

1999 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers

1994 - ASME Medal, The American Society of Mechanical Engineers

1994 - Edwin F. Church Medal, The American Society of Mechanical Engineers

1993 - IEEE Fellow For contributions to the understanding of thermal phenomena in electronic packaging.

1983 - Fellow of the American Society of Mechanical Engineers

Overview

What is he best known for?

The fields of study he is best known for:

  • Mechanical engineering
  • Thermodynamics
  • Electrical engineering

Avram Bar-Cohen mainly focuses on Thermodynamics, Heat transfer, Mechanics, Heat sink and Mechanical engineering. His work carried out in the field of Thermodynamics brings together such families of science as Engineering physics and Dielectric. He combines subjects such as Thermal conduction and Microelectronics with his study of Heat transfer.

His research investigates the link between Mechanics and topics such as Fin that cross with problems in Micro heat exchanger, Plate heat exchanger and Convective heat transfer. His Heat sink research is multidisciplinary, incorporating elements of Thermal resistance, Work and Passive cooling. His Mechanical engineering research includes elements of Reciprocity, Thermal analysis, Thermal and Convection.

His most cited work include:

  • Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates (423 citations)
  • Thermal Analysis and Control of Electronic Equipment (303 citations)
  • Direct Liquid Cooling of High Flux Micro and Nano Electronic Components (144 citations)

What are the main themes of his work throughout his whole career to date?

His primary scientific interests are in Heat transfer, Thermodynamics, Mechanics, Thermal and Mechanical engineering. His Heat transfer research incorporates elements of Thermal conduction, Composite material and Heat sink. Much of his study explores Thermodynamics relationship to Liquid dielectric.

His study looks at the intersection of Thermal and topics like Thermal conductivity with Annular fin. His studies in Mechanical engineering integrate themes in fields like Thermoelectric effect and Electronics. His biological study spans a wide range of topics, including Silicon and Thermoelectric cooling.

He most often published in these fields:

  • Heat transfer (32.15%)
  • Thermodynamics (23.60%)
  • Mechanics (21.53%)

What were the highlights of his more recent work (between 2011-2021)?

  • Heat transfer (32.15%)
  • Thermal (17.11%)
  • Optoelectronics (15.34%)

In recent papers he was focusing on the following fields of study:

His scientific interests lie mostly in Heat transfer, Thermal, Optoelectronics, Heat transfer coefficient and Mechanics. His Heat transfer study contributes to a more complete understanding of Thermodynamics. His Thermal research is multidisciplinary, incorporating elements of Mechanical engineering, Thermal conductivity, Process engineering and Polymer.

His work carried out in the field of Optoelectronics brings together such families of science as Temperature measurement, Electronic engineering and Thermoelectric cooling. He works mostly in the field of Heat transfer coefficient, limiting it down to concerns involving Pressure drop and, occasionally, Communication channel. In his study, Flow is strongly linked to Tube, which falls under the umbrella field of Mechanics.

Between 2011 and 2021, his most popular works were:

  • Thermal Management of On-Chip Hot Spot (102 citations)
  • Superlattice-based thin-film thermoelectric modules with high cooling fluxes (78 citations)
  • Nanothermal Interface Materials: Technology Review and Recent Results (73 citations)

In his most recent research, the most cited papers focused on:

  • Mechanical engineering
  • Thermodynamics
  • Electrical engineering

His primary areas of investigation include Thermal resistance, Heat transfer, Thermal, Heat transfer coefficient and Electronics. Avram Bar-Cohen interconnects Mechanical engineering, Diamond and Engineering physics in the investigation of issues within Thermal resistance. He works in the field of Heat transfer, namely Heat flux.

His Thermal research also works with subjects such as

  • Thermal expansion that intertwine with fields like Reliability, Characterization, Microelectronics, Heat pipe and Electrical conductor,
  • Thermal conductivity together with Electronic engineering. His Heat transfer coefficient study results in a more complete grasp of Thermodynamics. His Electronics study integrates concerns from other disciplines, such as Thermal management of electronic devices and systems, Thermoelectric generator and Thermoelectric cooling.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

Avram Bar-Cohen;Warren M. Rohsenow.
Journal of Heat Transfer-transactions of The Asme (1984)

741 Citations

Thermal Analysis and Control of Electronic Equipment

Allan D. Kraus;Avram Bar-Cohen.
(1983)

594 Citations

Direct Liquid Cooling of High Flux Micro and Nano Electronic Components

A. Bar-Cohen;M. Arik;M. Ohadi.
Proceedings of the IEEE (2006)

230 Citations

Design and analysis of heat sinks

Allan D. Kraus;Avram Bar-Cohen.
(1995)

229 Citations

Thermal management of electronic components with dielectric liquids

Avram Bar-Cohen.
Jsme International Journal Series B-fluids and Thermal Engineering (1993)

193 Citations

Design of Optimum Plate-Fin Natural Convective Heat Sinks

Avram Bar-Cohen;Madhusudan Iyengar;Allan D. Kraus.
Journal of Electronic Packaging (2003)

180 Citations

Advances in Thermal Modeling of Electronic Components and Systems. Volume 1

Avram Bar-Cohen;Allan Kraus;V. P. Carey.
(1988)

175 Citations

Evaporation and flow dynamics of thin, shear-driven liquid films in microgap channels

Oleg Kabov;Oleg Kabov;D.V. Zaitsev;D.V. Zaitsev;Vyacheslav Cheverda;A. Bar-Cohen.
Experimental Thermal and Fluid Science (2011)

139 Citations

theta /sub jc/ characterization of chip packages-justification, limitations, and future

A. Bar-Cohen;T. Elperin;R. Eliasi.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology (1989)

137 Citations

Thermal Management of Air- and Liquid-Cooled Multichip Modules

A. Bar-Cohen.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology (1987)

137 Citations

Best Scientists Citing Avram Bar-Cohen

Yogendra Joshi

Yogendra Joshi

Georgia Institute of Technology

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Oleg Kabov

Oleg Kabov

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Suresh V. Garimella

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Purdue University West Lafayette

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Adrian Bejan

Adrian Bejan

Duke University

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Andrei G. Fedorov

Andrei G. Fedorov

Georgia Institute of Technology

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Seung M. You

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The University of Texas at Dallas

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Ali Shakouri

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Purdue University West Lafayette

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Kenneth E. Goodson

Kenneth E. Goodson

Stanford University

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Johan Liu

Johan Liu

Chalmers University of Technology

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Chi-Chuan Wang

Chi-Chuan Wang

National Yang Ming Chiao Tung University

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Mehdi Asheghi

Mehdi Asheghi

Stanford University

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Sung Jin Kim

Sung Jin Kim

Korea Advanced Institute of Science and Technology

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Mohamed S. El-Genk

Mohamed S. El-Genk

University of New Mexico

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Moo Hwan Kim

Moo Hwan Kim

Pohang University of Science and Technology

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Satish G. Kandlikar

Satish G. Kandlikar

Rochester Institute of Technology

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Guoqi Zhang

Guoqi Zhang

Georgia State University

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Profile was last updated on December 6th, 2021.
Research.com Ranking is based on data retrieved from the Microsoft Academic Graph (MAG).
The ranking d-index is inferred from publications deemed to belong to the considered discipline.

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