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D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
61
Citations
11602
World Ranking
666
National Ranking
288

Research.com Recognitions

  • 1999 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers
  • 1994 - Edwin F. Church Medal, The American Society of Mechanical Engineers
  • 1994 - ASME Medal, The American Society of Mechanical Engineers
  • 1993 - IEEE Fellow For contributions to the understanding of thermal phenomena in electronic packaging.
  • 1983 - Fellow of the American Society of Mechanical Engineers

Overview

Avram Bar-Cohen was affiliated with the University of Maryland, College Park in the United States. They contributed to the field of engineering, with a concentration on mechanical engineering. Their work also encompassed computational mechanics, biomedical engineering, electrical and electronic engineering, and spectroscopy as subfields of study.

Their research primarily addressed topics related to heat transfer and boiling studies, heat transfer and optimization, and fluid dynamics and thin films. Additional topics of their work included nanofluid flow and heat transfer, heat transfer mechanisms, semiconductor lasers and optical devices, and spectroscopy and laser applications.

Frequent coauthors in their research included K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, and Karlheinz Bock. Their publications were consistently featured in certain venues, especially in the journal IEEE Transactions on Components Packaging and Manufacturing Technology, where they had 24 publications. Other journals included Applied Physics B and Applied Sciences.

Selected recent papers authored or coauthored by Avram Bar-Cohen included the following:

  • The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics, 2021, IEEE Transactions on Components Packaging and Manufacturing Technology
  • Experimental Demonstration of Pressure-Driven Flash Boiling for Transient Two-Phase Cooling, 2021, IEEE Transactions on Components Packaging and Manufacturing Technology
  • Two-Phase Flow Regimes and Heat Transfer Coefficients With R245fa in Manifolded-Microgap Channels, 2021, IEEE Transactions on Components Packaging and Manufacturing Technology
  • Thermal and optical performance of cryogenically cooled laser diode bars mounted on pin-finned microcoolers, 2021, Applied Physics B
  • Thermal Performance of Cryogenic Micro-Pin Fin Coolers with Two-Phase Liquid Nitrogen Flows, 2021, Applied Sciences

Avram Bar-Cohen received several awards during their career. They were honored with the ASME Medal in 1994 and the Edwin F. Church Medal in the same year, both awarded by The American Society of Mechanical Engineers. Additionally, they received the Heat Transfer Memorial Award from the same society in 1999. In 1993, they were named an IEEE Fellow for their contributions to the understanding of thermal phenomena in electronic packaging. Earlier, in 1983, they became a Fellow of the American Society of Mechanical Engineers.

Best Publications

  • Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

    Avram Bar-Cohen;Warren M. Rohsenow

  • Thermal Analysis and Control of Electronic Equipment

    Allan D. Kraus;Avram Bar-Cohen

  • Direct Liquid Cooling of High Flux Micro and Nano Electronic Components

    A. Bar-Cohen;M. Arik;M. Ohadi

  • Design and analysis of heat sinks

    Allan D. Kraus;Avram Bar-Cohen

  • Design of Optimum Plate-Fin Natural Convective Heat Sinks

    Avram Bar-Cohen;Madhusudan Iyengar;Allan D. Kraus

  • Superlattice-based thin-film thermoelectric modules with high cooling fluxes

    Gary Bulman;Phil Barletta;Jay Lewis;Nicholas Baldasaro

  • Thermal management of electronic components with dielectric liquids

    Avram Bar-Cohen

  • Thermal Management of On-Chip Hot Spot

    Avram Bar-Cohen;Peng Wang

  • Evaporation and flow dynamics of thin, shear-driven liquid films in microgap channels

    Oleg Kabov;Oleg Kabov;D.V. Zaitsev;D.V. Zaitsev;Vyacheslav Cheverda;A. Bar-Cohen

  • Advances in Thermal Modeling of Electronic Components and Systems. Volume 1

    Avram Bar-Cohen;Allan Kraus;V. P. Carey

  • Effusivity-based correlation of surface property effects in pool boiling CHF of dielectric liquids

    Mehmet Arik;Avram Bar-Cohen

  • Nanothermal Interface Materials: Technology Review and Recent Results

    Avram Bar-Cohen;Kaiser Matin;Sreekant Narumanchi

  • Enhancement of pool boiling critical heat flux in dielectric liquids by microporous coatings

    Mehmet Arik;Avram Bar-Cohen;Seung Mun You

  • theta /sub jc/ characterization of chip packages-justification, limitations, and future

    A. Bar-Cohen;T. Elperin;R. Eliasi

  • Thermal Management of Air- and Liquid-Cooled Multichip Modules

    A. Bar-Cohen

  • Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

    Peng Wang;Patrick McCluskey;Avram Bar-Cohen

  • High heat from a small package

    S. Oktay;R. Hannemann;A. Bar-Cohen

  • Contact angle effects on boiling incipience of highly-wetting liquids

    W. Tong;A. Bar-Cohen;Terrence W Simon;S. M. You

  • Modeling and Prediction of Two-Phase Microgap Channel Heat Transfer Characteristics

    Avram Bar-Cohen;Emil Rahim

  • Design and optimization of air-cooled heat sinks for sustainable development

    A. Bar-Cohen;M. Iyengar

  • State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

    Avram Bar-Cohen

  • Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1

    Avram Bar-Cohen;Allan D. Kraus;Peter A. Engel

Frequent Co-Authors

Terrence W. Simon
Terrence W. Simon University of Minnesota
Bao Yang
Bao Yang University of Maryland, College Park
E. R. G. Eckert
E. R. G. Eckert University of Minnesota
Suhas V. Patankar
Suhas V. Patankar University of Minnesota
Richard J Goldstein
Richard J Goldstein University of Minnesota
Seung M. You
Seung M. You The University of Texas at Dallas
Jane H. Davidson
Jane H. Davidson University of Minnesota
Francis A Kulacki
Francis A Kulacki University of Minnesota
Ankur Srivastava
Ankur Srivastava University of Maryland, College Park
Ali Shakouri
Ali Shakouri Purdue University West Lafayette

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