What is he best known for?
The fields of study he is best known for:
- Mechanical engineering
- Thermodynamics
- Electrical engineering
Avram Bar-Cohen mainly focuses on Thermodynamics, Heat transfer, Mechanics, Heat sink and Mechanical engineering.
His work carried out in the field of Thermodynamics brings together such families of science as Engineering physics and Dielectric.
He combines subjects such as Thermal conduction and Microelectronics with his study of Heat transfer.
His research investigates the link between Mechanics and topics such as Fin that cross with problems in Micro heat exchanger, Plate heat exchanger and Convective heat transfer.
His Heat sink research is multidisciplinary, incorporating elements of Thermal resistance, Work and Passive cooling.
His Mechanical engineering research includes elements of Reciprocity, Thermal analysis, Thermal and Convection.
His most cited work include:
- Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates (423 citations)
- Thermal Analysis and Control of Electronic Equipment (303 citations)
- Direct Liquid Cooling of High Flux Micro and Nano Electronic Components (144 citations)
What are the main themes of his work throughout his whole career to date?
His primary scientific interests are in Heat transfer, Thermodynamics, Mechanics, Thermal and Mechanical engineering.
His Heat transfer research incorporates elements of Thermal conduction, Composite material and Heat sink.
Much of his study explores Thermodynamics relationship to Liquid dielectric.
His study looks at the intersection of Thermal and topics like Thermal conductivity with Annular fin.
His studies in Mechanical engineering integrate themes in fields like Thermoelectric effect and Electronics.
His biological study spans a wide range of topics, including Silicon and Thermoelectric cooling.
He most often published in these fields:
- Heat transfer (32.15%)
- Thermodynamics (23.60%)
- Mechanics (21.53%)
What were the highlights of his more recent work (between 2011-2021)?
- Heat transfer (32.15%)
- Thermal (17.11%)
- Optoelectronics (15.34%)
In recent papers he was focusing on the following fields of study:
His scientific interests lie mostly in Heat transfer, Thermal, Optoelectronics, Heat transfer coefficient and Mechanics.
His Heat transfer study contributes to a more complete understanding of Thermodynamics.
His Thermal research is multidisciplinary, incorporating elements of Mechanical engineering, Thermal conductivity, Process engineering and Polymer.
His work carried out in the field of Optoelectronics brings together such families of science as Temperature measurement, Electronic engineering and Thermoelectric cooling.
He works mostly in the field of Heat transfer coefficient, limiting it down to concerns involving Pressure drop and, occasionally, Communication channel.
In his study, Flow is strongly linked to Tube, which falls under the umbrella field of Mechanics.
Between 2011 and 2021, his most popular works were:
- Thermal Management of On-Chip Hot Spot (102 citations)
- Superlattice-based thin-film thermoelectric modules with high cooling fluxes (78 citations)
- Nanothermal Interface Materials: Technology Review and Recent Results (73 citations)
In his most recent research, the most cited papers focused on:
- Mechanical engineering
- Thermodynamics
- Electrical engineering
His primary areas of investigation include Thermal resistance, Heat transfer, Thermal, Heat transfer coefficient and Electronics.
Avram Bar-Cohen interconnects Mechanical engineering, Diamond and Engineering physics in the investigation of issues within Thermal resistance.
He works in the field of Heat transfer, namely Heat flux.
His Thermal research also works with subjects such as
- Thermal expansion that intertwine with fields like Reliability, Characterization, Microelectronics, Heat pipe and Electrical conductor,
- Thermal conductivity together with Electronic engineering.
His Heat transfer coefficient study results in a more complete grasp of Thermodynamics.
His Electronics study integrates concerns from other disciplines, such as Thermal management of electronic devices and systems, Thermoelectric generator and Thermoelectric cooling.
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